Hitachi Cable, Inc.

Hitachi, Ltd.

Toshi Sasaki

Takashi Suzumura

Hiroshi Sugimoto

Wataru Nakayama

Yuju Endo

Takaharu Yonemoto

Hiromichi Yoshida

Yoshihiko Nakayama

Kiyoshi Oizumi

Hiroyuki Takasaka

Shigeho Fukuda

Shigeharu Takahagi

Toshio Kawamura

Makoto Aida

Teruyuki Watahiki

Hiroki Tanaka

Takahiro Daikoku

Tadakatsu Nakajima

Kenji Takahashi

Heikichi Kuwahara

Shigeo Sugimoto

Kimio Kakizaki

Takehiko Yanagida

A method for punching an insulating film is composed of using plural divided punches having a clearance between each two of the divided punches. The clearance absorbs thermal expansion of the divided punches caused by receiving a heat from a heater. A punched insulating film is stuck to a lead frame by being pressed between the divided punches and the heater.

Method for sticking an insulating film to a lead frame

An apparatus for sticking a film to a lead frame has a punch moving up and down for punching a film, a die for placing the film to be punched, and a heating plate for heating a lead frame. A punched film with a predetermined shape is applied on the lead frame and thermally compressed and adhesively attached on a lead portion of the lead frame. The die is additionally provided with a buffer layer on the top plane of the die for relaxing compressing stress but increasing tensile stress put to the film at the punching step so that a punched film is prevented from producing cracks on the cutting end thereof.

Method and apparatus for sticking a film to a lead frame

A method of applying adhesives to leads of lead frame, a nozzle of a dispenser is moved horizontally above one lead and positioned against the lead at a predetermined distance. While keeping adhesives flowing from the nozzle of the dispenser, the dispenser is moved horizontally relative to the leads in a direction from one lead to the next lead so that the distance is kept constant. Then the adhesives are applied to a predetermined portion of each lead. When the application of adhesives to the last lead is complete, the nozzle is raised and moved horizontally. Therefore, the number of upward and downward movements of the nozzle is greatly reduced and the application time can be shortened. Preferably, the distance between the tip of the nozzle and the surface of the lead is to be one-fourth to three times as long as the inside diameter of the nozzle.

Method of applying adhesive to lead of lead frame and method of making

In a heat transfer wall having a number of fine and elongate tunnels adjacent to each other with a minute distance under the surface thereof being in contact with liquid on the heat transfer wall, and a number of fine openings for communicating the tunnels to the outside thereof defined on ceilings of the tunnels along the longitudinal directions thereof with each minute distance, a tongue-like projection is provided which protrudes from an edge of the opening or vicinity of the opening across the opening 1 whereby a flow of fluid passing through the openings provided with the projections is controlled so that heat transfer performance characteristics are improved.

Evaporating heat transfer wall

A method of producing a heat transfer wall, including a plurality of minute tunnels parallelly extending and spaced a minuscule distance from each other under an outer surface of the wall in contact with liquid, and a plurality of tiny hole portions formed at the outer surface of the wall above the tunnels and located at regular intervals along the tunnels to maintain same in communication with the outside. Each hole portion includes a projection located in the hole portion including a hole itself and extending from the vicinity of the hole portion into the hole portion in a manner to traverse same, so that a flow of liquid into the tunnels and a flow of vapor out of the tunnels can be optimally regulated by the projections to enable the heat transfer wall to exhibit a high heat transfer performance.

Method for producing a heat transfer wall for vaporizing liquids

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Ibaraki, Japan

Toshi Sasaki