Matsushita Electronics Corporation

Matsushita Electric Industrial Co., Ltd.

Toru Tsuruta

Hideyuki Nakanishi

Ryuma Hirano

Yuzo Shimizu

Shin-ichi Hamaguchi

Masanori Hirose

An optoelectronic apparatus includes an optoelectronic device, a mounting portion, a frame member surrounding a periphery of the mounting portion, and an optical component. The optical component is placed on an optical component placement portion. The frame member includes a pair of first side walls and a pair of second side walls. Each of the pair of second side walls has a recessed portion and a protruded portion. The optical component is disposed between the protruded portions, and is fixed with an adhesive filled in the recessed portions.

Optical electronic apparatus and method for producing the same

To more precisely output signals of optical recording media, a semiconductor laser element is mounted in a concave portion on the surface of a semiconductor substrate so that the optical axis of signal detecting light emitted from the semiconductor laser element is substantially parallel to the surface of the semiconductor substrate, and the light emitted from the semiconductor laser element is reflected at the side surface of the concave portion that is opposed to the signal detecting light emitting side of the semiconductor laser element in a direction substantially perpendicular to the surface of the semiconductor substrate. A light receiving portion for signal detection is provided in an area outside the concave portion on the surface of the semiconductor substrate where the semiconductor laser element is mounted. When the signal detecting light emitting side of the semiconductor laser element is the front side of the semiconductor laser element, a first light intercepting region is provided in areas posterior to, obliquely posterior to and at the left and right sides of the semiconductor laser element on the bottom surface of the concave portion, and a second light intercepting region is provided on, of the side surfaces of the concave portion, at least the side surface between the semiconductor laser element and the light receiving portion.

Optical semiconductor device

An object is that stray light carriers are absorbed, and hence a signal larger than actual signal will not be outputted, thereby to output more precise signals. For achieving the foregoing, a concave portion is provided on the surface of a semiconductor substrate, a light receiving element for signal detection is provided around the concave portion, a semiconductor laser element is mounted in the concave portion, and a light shielding area is provided on the side existing between the semiconductor laser element and the light receiving element for signal detection of the sides of the concave portion. This causes stray light contained in the light emitted from the semiconductor laser element to be cut off at the light shielding area. Consequently, around the light receiving element for signal detection, the occurrence of stray light carriers on the surface of the semiconductor substrate can be prevented, and hence the stray light carriers are not absorbed by the light receiving element for signal detection. Therefore, the signal of an optical recording medium can be outputted with more precision.

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Osaka, Japan

Toru Tsuruta