Samsung Display Co., Ltd.

Toru Tsunekawa

Yong-Woo Lee

Yong Woo Lee

Won-Seok Kim

Jinhyuk Park

Joon-Ik Lee

A display apparatus includes a display panel bendable in a bending direction about a bending axis, pad units disposed on one side of the display panel and arranged in the bendable direction, printed circuit boards disposed below the display panel, and flexible printed circuit boards configured to connect the display panel to the printed circuit boards. The printed circuit boards are bendable in the bending direction about the bending axis, are arranged in the bendable direction, and extend in the bendable direction. Each of the flexible printed circuit boards has a first end connected to the display panel and a second end connected to one of the printed circuit boards. A second distance between the second ends of two of the flexible printed circuit boards respectively connected to two adjacent printed circuit boards is greater than a first distance between the first ends of the two flexible printed circuit boards.

Display apparatus and method for manufacturing the same

A display apparatus includes a display panel configured to display an image, a lower receiving container comprising a bottom portion and a side wall and accommodating the display panel and a mold frame integrally formed with the lower receiving container, extending along the side wall of the lower receiving container, and comprising a plurality of groove portions extending from an inner surface of the mold frame toward an outer surface of the mold frame.

Display apparatus

A liquid crystal display, including: a liquid crystal panel including a first display panel and opposing second display panel opposite the first display panel, a backlight assembly configured to provide light to the liquid crystal panel, a receiving member configured to support the backlight assembly, and an adhesive member configured to couple the liquid crystal panel and the receiving member. The first display panel includes a display area configured to display an image, a peripheral area disposed outside the display area, and a plurality of integrated circuit ('IC') chips disposed in the peripheral area, the plurality of IC chips being configured to apply a driving signal to the display area. The adhesive member is disposed in the peripheral area and does not overlap with the plurality of IC chips.

Growing community of inventors

Cheonan-si, South Korea

Toru Tsunekawa