Mitsui Petrochemical Industries, Ltd.

Mitsui Petrochemical Ind. Ltd.

Idec Izumi Corporation

Nec Environment Engineering, Ltd.

Toru Tomoshige

Harumi Furuta

Akihiro Tachi

Kojiro Kan

Norio Matsuzawa

Kakutaro Kauchi

Hideyuki Kitayama

Shoji Usuda

Kenji Yokoyama

Riichiro Nagano

Toshimasa Takata

Yoshio Iida

Toshikazu Furihata

Youhei Suzuki

Akio Ohdaira

Kaoru Tominaga

Tetsuo Imamura

Hiroshi Iizuka

Yasumasa Fujii

Toshikazu Takagi

Yoshio Ishida

Kinich Onodera

Nobuyuki Kawamoto

Hideya Aoki

An adhesive composition for a vinyl halide resin is disclosed. This adhesive composition is formed by incorporating an aliphatic polyamine having a plurality or ether bonds, an alicyclic polyamine or an alkylene diamine into a blend of an epoxy resin and a vinyl chloride copolymer resin. This adhesive composition is effectively used in the solvent-free state for a molded body of a vinyl halide type resin such as a vinyl chloride resin or a vinylidene halide resin.

Vinyl halide resin with epoxy resin and polyamine

A two-component, or two-part epoxy resin composition which adheres well to wet mortar and concrete is provided. One part comprising a non-cycloaliphatic epoxy resin, a reactive diluent in the form of an epoxy compound, a modifying resin selected from the group consisting of a coumarone-indene polymer resin, a dicyclopentadiene polymer resin, an acrylonitrile modified polyvinyl chloride resin, an amino terminated acrylonitrile-butadiene copolymer resin, and an epoxy terminated polybutadiene resin, a silane coupling agent having an epoxy or amino group, and a synthetic zeolite is combined, on use, with the other part comprising an amine curing agent selected from the group consisting of a cycloaliphatic polyamine, an aliphatic/aromatic polyamide, and an amine adduct.

Two-component epoxy resin compositions

A light-emitting or receiving device comprising a light-emitting or receiving element coated with a silicone resin composition and an encapsulating means for encapsulating said light-emitting or receiving element, said encapsulating means comprising a polymer of a monomer, an oligomer or a mixture thereof comprising a diallyl compound. The device has improved weatherability, chemical resistance, hardness, optical properties such as transparency, and moisture resistance.

Light-emitting or receiving device and method for preparing the same

There is provided a light-emitting or receiving device having improved weatherability, chemical resistance, hardness, and optical properties, wherein a light-emitting or receiving element is encapsulated with a polymer of a polymerizable liquid composition comprising (a) a monomer or an oligomer or a mixture thereof containing a diallyl compound as an essential ingredient. There is also provided an encapsulant and a method for encapsulating a light-emitting or receiving element.

Light-emitting or receiving device with smooth and hard encapsulant resin

Imide prepolymer compositions containing an unsaturated component (A) and diamine component (B) at the (A)/(B) molar ratio of 0.9-1.5 and 0.01-5.0% by weight, based on the sum of said components (A) and (B), of at least one radical polymerization inhibitors, and preferably further 0.01-5.0% by weight, based on the sum of said components (A) and (B), of at least one compound selected from the group of carboxylic acid and carboxylic acid anhydride. The imide prepolymer compositions of the present invention which contain the above-defined components in specific proportions are tough and excellent in adhesive strength to glass cloths and metals and in heat resistance.

Imide type prepolymer composition comprising unsaturated bis imide,

Disclosed is a damping member comprising, as main components, a petroleum resin, asphalt and mica. By selecting and using mica as the filler and incorporating mica in an amount smaller than the amount of asphalt, the adhesion follow-up property to a substrate can be improved. This damping material can be attached simply and assuredly to a substrate having a curved surface, such as a tube or pipe, an air-conditioning duct or a part of a building or vehicle by heat-pressing or heat-fusion-bonding, and a product having an excellent damping effect is provided.

Composition having damping property, damping member, process for

A semiconductor encapsulating material is obtained from a polyimide resin composition comprising (A) a polyaminobismaleimide resin, (B) a silicone monomer and/or oligomer having a hydroxyl or alkoxyl group bonded to a silicon atom and mixtures thereof, and (C) an inorganic filler wherein the weight ratio of polyaminobismaleimide resin (A) to silicone component (B) ranges from 99.5/0.5 to 70/30, and the weight ratio of polyaminobismaleimide resin (A) to inorganic filler (C) ranges from 100/50 to 100/1000.

Polyimide resin compositions

A maleated saturated hydrocarbon wax having a number-average molecular weight of 500 through 6000, a content of a maleic anhydride unit of 14 through 40% by weight and a melt viscosity of 10.sup.2 through 10.sup.6 centipoises at 140.degree. C. is disclosed. This maleated wax is self-emulsifiable and the emulsion thereof can be stored for a long period of time, even in a very dilute emulsion. This maleated wax is produced from the reaction of a saturated hydrocarbon wax with the specified amount of maleic anhydride, in the presence of an organic peroxide, at the specified temperature by adding the maleic anhydride and the organic peroxide to the molten saturated hydrocarbon wax at the specified rates.

Highly maleated wax and process for producing the same

An epoxy-modified polyolefin wax, which consists of a low-molecular-weight polyolefin grafted, copolymerized and modified with an epoxy group-containing, ethylenically unsaturated compound and has a number average molecular weight of from 600 to 10,000 and an epoxy equivalent of from 200 to 100,000, is disclosed. This epoxy-modified polyolefin wax is very valuable as a modifier for improving brittleness or adhesion (adhesiveness) in various resins, especially thermosetting resins.

Epoxy-modified polyolefin wax, process for preparation thereof and

An aqueous dispersion of an olefinic resin composition having improved properties which comprises mixing an olefinic resin composition comprising (a) 50 to 99% by weight of a carboxyl-free olefinic resin having an intrinsic viscosity of 0.1 to 5 and (b) 1 to 50% by weight of a carboxyl-containing modified olefinic resin having an intrinsic viscosity of 0.04 to 1 and an acid number of 30 to 150, the amount of each resin being based on the total amount of resins (a) and (b), which has been melted by heating to a temperature above the melting point, whichever is higher, of the resins, with an aqueous medium heated to a temperature of 140 to 300.degree. C. in the presence of at least 0.2 chemical equivalent, to the carboxyl groups of resin (b), of a base.

Aqueous dispersions of olefinic resin compositions and process for

A process for preparing thermoplastic olefin elastomers which comprises mixing and extruding in a screw extruder (A) an olefin rubber having a number average molecular weight of about 10,000 to 100,000 and composed of a copolymer of ethylene with an .alpha.-olefin containing at least 3 carbon atoms and (B) about 1 to 15 parts by weight, per 100 parts by weight of the olefin rubber (A), of a specified dicarboxylic acid monomer at about 200 to 320.degree. C in the presence of (C) 0.02 to 3 milliequivalents, per 100 grams of the olefin rubber (A), of an alkyl peroxide, and in the absence of molecular oxygen. The thermoplastic olefin elastomers have superior mechanical properties, thermal stability, processability and adhesiveness, and find a wide range of applications, for example, as extrusion or injection molding materials, adhesives, coating agents, and modifiers for plastics and rubbers.

Production of thermoplastic olefin elastomers

A method of producing a modified waxy ethylene polymer, which comprises polymerizing ethylene in an inert hydrocarbon solvent at 120.degree. - 250.degree. C. and pressure ranging from the vapor pressure of the solvent at the polymerization temperature to 100 Kg/cm.sup.2 using a catalyst composed of a halogen compound of titanium and/or vanadium and an organoaluminum compound supported on a carrier comprising a hydrocarbon-insoluble magnesium-containing compound to form a waxy ethylene polymer having a viscosity average molecular weight of 500 to 30000, reacting an unsaturated polycarboxylic acid with the resulting waxy ethylene polymer in the presence of a peroxide at a temperature above the melting point of the waxy ethylene polymer and up to 250.degree. C., and if desired, contacting the ethylene polymer, before or after the reaction with the unsaturated polycarboxylic acid, with oxygen or a gas containing oxygen.

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Ichihara, Japan

Toru Tomoshige