Murata Manufacturing Co., Ltd.

Toru Tominaga

Jun Endo

Shozo Otera

Junichi Hashimoto

Hidekazu Kano

Takashi Kihara

Tadashi Morimoto

Takaaki Ooi

Makoto Matsubara

Yukichi Sakurai

Yoshikazu Yoshida

A vibration structure that includes a piezoelectric film constructed to deform in a plane direction as a voltage is applied thereto, a frame-shaped member, a vibration portion surrounded by the frame-shaped member in a plan view of the vibration structure, a support portion connecting the vibration portion and the frame-shaped member, and supporting the vibration portion within the frame-shaped member such that the vibration portion vibrates in the plane direction when the piezoelectric film is deformed in the plane direction, a first connection member that connects the piezoelectric film to the vibration portion, and a second connection member that connects the piezoelectric film to the frame-shaped member. Of the connection members, the first connection member is disposed between the center of gravity of the vibration portion and the second connection member.

Vibration structure and vibration generator

A piezoelectric device that includes a film that has a first main surface and a second main surface, and has piezoelectricity; a first substrate; and a first connection member that connects the film to the first substrate. The first connection member is a thermosetting resin, and a curing temperature of the first connection member is lower than a temperature at which the film thermally contracts.

Piezoelectric device, vibration structure and piezoelectric sensor

A vibration structure that includes a film having a first electrode on a first main surface thereof, the first electrode defining a first connection region on the first main surface where the first electrode is not present, and the film is constructed to be deformed in a plane direction when a voltage is applied thereto; a frame-shaped member; a vibration portion surrounded by the frame-shaped member; a first connection member that connects the first main surface of the film to the frame-shaped member at the first connection region; a second connection member that connects the film to the vibration portion; and an extended electrode that is connected to the first electrode.

Vibration structure

A vibration structure that includes a film constructed to deform in a plane direction as voltage is applied thereto, a frame-shaped member, a vibration portion surrounded by the frame-shaped member in a plan view of the vibration structure, a support portion connecting the vibration portion and the frame-shaped member and supporting the vibration portion within the frame-shaped member, a first connection member that connects the film and the frame-shaped member, and a second connection member that connects the film to the vibration portion such that the vibration portion vibrates in the plane direction when the film is deformed in the plane direction. The support portion is disposed at a position closer to a center of gravity of the vibration portion than an end portion of the vibration portion when viewed in the plan view.

Vibration structure and electronic device

A vibration device that includes a vibration unit that has a vibrator which vibrates in a plane direction; and a sensor arranged on at least a portion of the vibration unit around the vibrator in a plan view of the vibration unit, and the sensor is constructed to detect a pressing operation in a direction normal to a pressing surface of the vibration device.

Vibration device

A vibration device that includes a flat plate that has a first main surface and a second main surface; a vibrator that is configured to vibrate along a first direction parallel to the first main surface; a connecting member that connects the vibrator to the first main surface of the flat plate; a support member having a cavity or a recess in a portion thereof facing the vibrator; and a cushioning material connecting the first main surface of the flat plate to the support member, the cushioning material being disposed so as to not overlap with the vibrator in a plan view of the vibration device. A combined length of the vibrator and the connecting member in a second direction perpendicular to the first main surface of the flat plate is larger than a length of the cushioning material in the second direction.

Vibration device having cushioning material with reduced thickness

A surge absorber includes a laminated compact of a first ceramic green sheet having a first internal electrode film extending to both sides thereof, a second ceramic green sheet having an second internal electrode film extending to both end surfaces thereof, and a third ceramic green sheet having a discharge hole. Ground external electrode layers are provided on both sides of the laminate so as to be connected with both ends of the first internal electrode film, and signal external electrode layers are further provided on both end surfaces of the laminated compact so as to be connected with both ends of the second internal electrode film. The laminated compact may also include a resistance element.

Surge absorber and surge absorber array

A method of fabricating a monolithic chip varistor includes the steps of preparing a varistor body including a plurality of varistor layers and at least one pair of internal electrodes; forming a first layer for each of a pair of external electrodes by applying a metal component and a glass component to an exterior portion of the varistor body, followed by heat treatment; forming a second layer for the external electrode on the first layer by applying a glass component, followed by heat treatment; forming a third layer for the external electrode on the second layer by applying a glass component that is different from the glass component used for forming the second layer, followed by heat treatment; forming a fourth layer for the external electrode on the third layer by applying a metal component that is different from the metal component used for forming the first layer, followed by heat treatment under the same heat treatment conditions as those used for the formation of the first layer; and forming a fifth layer for the external electrode by electroplating. During the heat treatment for forming the fourth layer, the metal component contained in the fourth layer is diffused into the second layer and the third layer.

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Nagaokakyo, Japan

Toru Tominaga