Nec Corporation

Other

Lenovo Innovations Limited

Toru Taura

Hirobumi Inoue

Kouji Matsunaga

Satoshi Hayakawa

Masao Tanehashi

Yuuichi Yamagishi

Masahiko Nikaidou

Michinobu Tanioka

Hiroshi Toyao

Shigeki Hoshino

Hironori Tsugane

Shinji Watanabe

Hideki Sasaki

Junya Sato

Takahiro Kimura

Nobuhiro Mikami

Muneo Fukaishi

Atsumasa Sawada

Nozomu Nishimura

An antenna deviceincludes at least one dielectric substrate, a conductor platearranged in the dielectric substrate, at least one slotformed in the conductor plate, at least one stub, and at least one via. The stubis formed on a surface of the dielectric substratedifferent from a surface where the slot is formed, the stubbeing formed to cross the slot. The viahas one end connected to a periphery of the slotof the conductor plateand another end connected to the stub

Antenna device

A structural body includes a first conductor having a first opening; a second conductor, having a second opening, which is opposite to at least a portion of the first conductor; a conductor via, passing through the first opening and the second opening, which is insulated from the first conductor and the second conductor; a first interconnect, provided in the inside of the first opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end and which is opposite to the second conductor; and a second interconnect, provided in the inside of the second opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end, and which is opposite to the first conductor.

Structural body and interconnect substrate

A slot antenna includes a dielectric substrate, a conductor surface provided on one of surfaces of the dielectric substrate, a slot formed by making a cut in the conductor surface, one end of the cut forming an opened end on an edge of the conductor surface, and a stub formed inside the slot, the stub being connected to one of opposing sides of the slot by using a connection part, in which the stub is formed in such a manner that a length of the connection part becomes longer than a distance between a side opposing to the side connected to the connection part and the stub.

Slot antenna

The present invention aims to provide a slot antenna, an electronic apparatus, and a method for manufacturing a slot antenna which are capable of obtaining multiple resonances with a small mounting space. The slot antenna according to the present invention includes three conductor plates: a rectangular conductor platehaving a notch with an open end formed at one side of the conductor plate; a rectangular conductor platedisposed to face the conductor plate; a third conductor plate connecting the conductor platesandon a side opposite to the open end of the conductor plate; and a feederconnecting a core wireand a groundat two points across the notch of the conductor plate

Slot antenna, electronic apparatus, and method for manufacturing slot antenna

An interface circuit, which uses electromagnetic induction to perform a signal transmission, comprises a transmission coil and a transmission circuit that provides a signal to the transmission coil, thereby causing the transmission coil to output a triangular or roughly triangular magnetic field signal.

Transmission method, interface circuit, semiconductor device, semiconductor package, semiconductor module and memory module

A circuit board device includes: plurality of wiring boards (and) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member () arranged between wiring boards (and) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block () composed of a metal material and arranged between the wiring boards (and) to enclose anisotropic conductive member (), and a pair of holding blocks (and) composed of a metal material arranged to clamp the plurality of wiring boards (and), wherein the plurality of wiring boards (and), while in a state of being clamped between the pair of holding blocks (and), is connected together by the anisotropic conductive member () and the terminals provided on each of the wiring boards (and), the functional block (), and the holding blocks (and) are electrically connected.

Circuit board device, wiring board interconnection method, and circuit board module device

A plurality of LSI chips () are stacked on an interposer (). Signal coils () for signal transmission are formed on the circuit formation surfaces of LSI chips () that are formed using silicon substrates (). The signal coils () connect to circuits formed in the LAI chips (). Through-holes () are formed in the centers of the signal coils () of the silicon substrate (). Signal coils () connected to solder balls () by way of through-conductors () are formed on the interposer (). Magnetic pins () that are composed of a magnetic material are inserted in the centers of the signal coils (and).

Semiconductor device for implementing signal transmission and/or power supply by means of the induction of a coil

The semiconductor device testing apparatus has a testing LSI; a power supply unit; and an intermediate substrate. The testing LSI has a dielectric material layer facing a tested semiconductor device; an electrode disposed in a position corresponding to a position of an external terminal electrode of the tested device on a surface of the dielectric layer facing the tested device; and a first penetrating electrode that passes completely through the dielectric layer, is connected to the electrode, and is used for exchanging signals with the exterior. The power supply unit has mutually independent elastic probe pins that are disposed in positions corresponding to power electrodes of the tested device, and that are provided with a metal protrusion at the distal ends thereof; a substrate on which a first wiring layer is formed and is electrically connected to the probe pins; and a second penetrating electrode that passes through the substrate.

Semiconductor device testing apparatus and power supply unit for semiconductor device testing apparatus

A semiconductor device testing apparatus that has a laminate structure composed of a contact sheet having a first opening, an elastic sheet having a second opening and a base plate having a third opening. A supply voltage is applied to an external terminal located on a peripheral portion of the contact sheet. A probe of a probe portion is contacted to a signal electrode of a semiconductor device through the third, second and first openings.

Semiconductor device testing apparatus having a contact sheet and probe for testing high frequency characteristics

In a tip portion structure basically having a substrate, a plate spring, and a ground block, the substrate is attached to a signal line on a back surface of the substrate and is contacted on the tip with the signal electrode of the DUT placed on a device stage. The plate spring is made of a resilient material, placed on the front side of the substrate, and positioned to apply a pressure to the substrate. The ground block is positioned between the signal line and the device stage functioned as a ground electrode of the DUT. Alternatively, the tip portion structure further may have a ground plate or a ground surface formed of a conductive thin plate covering entirely the front surface of the substrate, and shaped to surround the signal line in cooperation with the ground block. A plurality of the signal lines may be arranged in parallel on the same plane of the substrate. Another tip portion structure is based on a coaxial cable to be cut from the center at a plane perpendicular to the axial direction thereof along one or more oblique plane. A metal ring fitted over a periphery of the coaxial outer conductor may be used.

Method for fabricating probe tip portion composed by coaxial cable

A high-frequency probe according to the present invention comprises a probe chip that has an end part that is pressed to an electrode and is covered by a electrically conductive outer enclosure, and slides in a vertical direction by an inner surface of this electrically conductive outer enclosure inside this electrically conductive outer enclosure. A signal conductive pattern is fixed inside this probe chip and is connected with a inner conductor having elasticity. The inner conductor can be bent in the vertical direction at a central part of a hole having an opening, which is sufficiently long in the vertical direction, in the center space of a ground conductor, which is fixed to an end part of the main block, when the inner conductor is pressed due to contact of the end part. In addition, the high-frequency probe has a thin shape of a maximum thickness in a transverse direction which is perpendicular to the vertical direction that is a direction of the probe being pressed to a device electrode. The maximum thickness is substantially equal to a pitch between device electrodes, and can be formed in the construction of unifying a plurality of high-frequency probes.

Longitudinal type high frequency probe for narrow pitched electrodes

In a tip portion structure basically having a substrate, a plate spring, and a ground block, the substrate is attached to a signal line on a back surface of the substrate and is contacted on the tip with the signal electrode of the DUT placed on a device stage. The plate spring is made of a resilient material, placed on the front side of the substrate, and positioned to apply a pressure to the substrate. The ground block is positioned between the signal line and the device stage functioned as a ground electrode of the DUT. Alternatively, the tip portion structure further may have a ground plate or a ground surface formed of a conductive thin plate covering entirely the front surface of the substrate, and shaped to surround the signal line in cooperation with the ground block . A plurality of the signal lines may be arranged in parallel on the same plane of the substrate. Another tip portion structure is based on a coaxial cable to be cut from the center at a plane perpendicular to the axial direction thereof along one or more oblique plane. A metal ring fitted over a periphery of the coaxial outer conductor may be used.

Tip portion structure of high-frequency probe and method for fabrication probe tip portion composed by coaxial cable

In a high-frequency probe having a detachable end according to the present invention, parts relating to replacement of an end unit are three parts, that is, an end unit, a probe body, and a pressure block. The end unit comprises a coaxial cable, two slender plate-like ground plates. The coaxial cable is linear in the direction of the end of the high-frequency probe. The ground plates sandwich the coaxial cable. The probe body has an end unit support surface, a circuit board, an end unit arrangement surface and an end part guide. The end unit support surface forms a perpendicular surface used for fixing the end unit to a predetermined position in the end side of the central block in a central part of a surface of the body block. The circuit board connects the end unit to a coaxial connector. The end unit arrangement surface forms a plane in an end side of the body block. And further the guide groove positions and fixes the ground plate in the end part. It is capable to supply positioning pins and a positioning pin holes in mutual contact surfaces for positioning. The present invention makes it possible to adjust characteristic impedance of the probe end part by providing an elastically-shaped part for securing contact pressure and using a pipe or the ground plate in an exposed part of the coaxial inner conductor for performing gap adjustment.

High-frequency probe capable of adjusting characteristic impedance in end part and having the end part detachable

A process for manufacturing a high frequency multichip module includes a reception inspection step which includes steps of preparing a vertical-type probe, setting the high frequency bare chip on a device stage, and measuring high frequency characteristics of the high frequency bare chip using the vertical-type probe. The prepared vertical-type probe has a center conductor and ground conductors arranged at both sides of the tip portion of the center conductor in the vertical direction in which the probe is pressed to electrodes of the high frequency bare chip. The high frequency bare chip has a ground electrode disposed at the opposite side of the chip from the signal electrodes on the upper surface of a device stage. Then, only a good product is fed to the next step. After the reception inspection, the process goes to a component mounting step. Preferably, the process goes to the next step when the high frequency multichip modules passes at least on of a performance test and visual inspection after the component mounting step.

Process for manufacturing high frequency multichip module enabling independent test of bare chip

In a video signal test, a sync signal test is first performed in which specification items of sync signals are measured. If the result is good, then a dot level test is performed using a dot discriminating pattern in which a dot level of the video signal changes between the maximum value and the minimum value for every dot. If the result is good, then a gradation test is finally performed using a gradation change pattern in which the gradation gradually changes for every horizontal line. In a case that the gradation test result is determined to be good, the functions of the video signal generator are finally judged to be good. On the other hand, if any one of the testing results is not good, the function test is ended at that stage without executing the next test.

Growing community of inventors

Tokyo, Japan

Toru Taura