Sony Corporation

Toru Takebe

Masaru Uryu

Kunihiko Tokura

Yoshio Watanabe

Takahisa Tagami

Kentaro Fujii

Emiko Ikeda

Mayumi Kosemura

A speaker diaphragm includes a thermoplastic resin having a three-layer structure. The three-layer structure includes a polyester film as a base material of the three-layer structure, a polyimide-based resin layer as a top layer of the three-layer structure, and another polyimide-based resin layer as a bottom layer of the three-layer structure.

Speaker diaphragm and speaker including the same

A multilayer printed circuit board which can surely establish interlayer connection with low resistance. The multilayer printed circuit board comprises: a first substrate having a conductive pattern on one face and a non-penetration connection hole on the other face, for exposing the conductive pattern to outside; a second substrate having a conductive pattern formed on a face opposed to the other face of first substrate and a conductive bump on the conductive pattern integrally. The first substrate and the second substrate are integrated by engaging the bump of the second substrate with the connection hole of the first substrate and by intervening a conductive cement between the bumps and the conductive pattern exposed to outside from the connection holes.

Multilayer printed circuit board and method of manufacturing multilayer printed circuit board

There is provided an acoustic diaphragm used for a loudspeaker, having an injection-molded edge molded using a thermoplastic elastomer, in which the edge is formed using a workable polyolefinic elastomer, as a material, containing a soft segment having rubber particles of 1 &#x3bc;m to 10 &#x3bc;m in diameter uniformly dispersed therein, and a hard segment composed of an olefinic resin, and the edge is formed into a shape allowing the resin to be aligned as being not causative of anisotropy in the physical characteristics of the edge, as a result of thin-wall molding by the injection molding.

Acoustic diaphragm, and method of fabricating acoustic diaphragm

A speaker diaphragm made of a resin containing a thermoplastic polymeric material is provided. The speaker diaphragm includes a changed portion formed on the diaphragm that is molded using the resin. The changed portion is formed by partially changing physical properties of the thermoplastic polymeric material for dispersing local vibrations based on a characteristic of local vibrations measured in advance.

Speaker diaphragm and method of manufacturing speaker diaphragm

Wholly aromatic polyamide fibers cut to a length of 0.5 to 5 mm are dispersedly contained in an injection-moldable thermoplastic resin, and the resin is molded by ultrahigh-speed thin-wall injection molding so as to produce a loudspeaker diaphragm in which the wholly aromatic polyamide fibers are dispersed in a direction perpendicular to the resin flow direction, whereby the loudspeaker diaphragm is improved in internal loss.

Loudspeaker diaphragm

A conductive bond comprises conductive colloidal particles and a dispersant for dispersing the conductive colloidal particles. A multilayer printed circuit board includes a plurality of substrates, each having a conductive pattern on at least one face thereof. Any adjacent two of the substrates are separated by an insulating layer, and the conductive pattern of a first substrate of the two substrates faces the conductive pattern of a second substrate of the two substrate. The conductive pattern of a first substrate has one or more bumps for electrical connection to the second substrate. The bump and the conductive pattern of the second substrate are bonded to each other with the conductive bond applied to the tip of the bump.

Conductive bond, multilayer printed circuit board, and method for making the multilayer printed circuit board

There is provided a composite wiring board that occupies a small space and is low in price and a manufacturing method thereof; the composite wiring board comprises at least two rigid wiring boards on end faces of which connection portions are formed, in which each of the rigid wiring boards is arranged so that each of the connection portions is situated on a plane and each of corresponding connection portions is connected with each other in the plane.

Growing community of inventors

Tokyo, Japan

Toru Takebe