Nichia Corporation

Toru Takasone

Masahiko Sano

Masatsugu Ichikawa

Daisuke Sanga

Shunsuke Minato

Takafumi Sugiyama

Toshiyuki Hirai

Hiroaki Yuto

Shoichi Yamada

Naoki Eboshi

Hiroyuki Inoue

A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

Light emitting device and method of manufacturing light emitting device

A fluorescent module includes a fluorescent member including a phosphor-containing layer, and a light reflecting layer disposed on the phosphor-containing layer. The phosphor-containing layer contains a YAG phosphor and a Ga-YAG phosphor within the same layer, the Ga-YAG phosphor being a phosphor in which a portion of the aluminum constituting the YAG phosphor is substituted with gallium. A volumetric ratio of the Ga-YAG phosphor to the entirety of the YAG phosphor and the Ga-YAG phosphor is in a range of 19.0% to 80%.

Fluorescent module and illumination device

A fluorescent module includes a fluorescent member, a heat dissipation member, and an optical relaxation member. The fluorescent member includes a phosphor-containing layer, and a light reflecting layer. The fluorescent member is secured to the heat dissipation member so that the light reflecting layer is arranged between the phosphor-contacting layer and the heat dissipation member. The optical relaxation member is configured to absorb and/or diffuse light. The optical relaxation member is arranged with respect to the fluorescent member so that the light reflecting layer is arranged between the phosphor-containing layer and the optical relaxation member.

A fluorescent member includes: a plurality of fluorescent particles; an inorganic binder; and a plurality of pores. An upper surface of the fluorescent member is a light extraction surface of the fluorescent member. The plurality of pores are localized in a vicinity of at least one of the plurality of fluorescent particles in a cross section that is parallel to the upper surface of the fluorescent member and extends through the fluorescent particles and the pores.

Fluorescent member, optical component, and light emitting device

A light emitting device includes a laser light, a wavelength conversion member, a base member and a lid. The wavelength conversion member includes a plurality of projected portions each extending along a first direction on an upper surface side thereof and arranged side by side in a second direction. Each of the plurality of projected portions has a first surface extending along the first direction. The first surface is inclined with respect to a reference surface. The laser light source and the wavelength conversion member are arranged so that an optical axis of first light from the laser light source extends along the second direction when viewed from above and is inclined with respect to the reference surface, and light directly incident to the first surface along a direction parallel to the optical axis of the first light is regularly reflected toward an upward direction.

Light emitting device and wavelength conversion member

Provided is a method for manufacturing a light emitting device comprising a light emitting element and an optical part, the method comprising the steps of (i) forming a hydroxyl film on a bonding surface of each of the light emitting element and the optical part by an atomic layer deposition, and (ii) bonding the bonding surfaces of the light emitting element and the optical part with each other, each of the bonding surfaces having the hydroxyl film formed thereon, wherein a substep is repeated at least one time in the step (i), in which substep a first raw material gas and a second raw material gas are sequentially supplied onto the bonding surfaces of the light emitting element and the optical part, and wherein the bonding of the bonding surfaces in the step (ii) is performed without a heating treatment.

Method for manufacturing light emitting device

A method for manufacturing a nitride semiconductor substrate includes the steps of growing a first nitride semiconductor on a substrate, patterning the first nitride semiconductor to obtain a pattern surrounded by a plane equivalent to the (11-20) plane and having at least two concave portions that are similar in their planar shape, and growing a second nitride semiconductor layer, using a plane equivalent to the (11-20) plane in the first nitride semiconductor pattern as a growth nucleus.

Method for manufacturing nitride semiconductor substrate

A method for manufacturing a nitride semiconductor substrate comprises the steps of: growing a first nitride semiconductor on a substrate, patterning the first nitride semiconductor to obtain a pattern surrounded by a plane equivalent to the (11-20) plane and having at least two concave portions that are similar in their planar shape, and growing a second nitride semiconductor layer, using a plane equivalent to the (11-20) plane in the first nitride semiconductor pattern as a growth nucleus.

Growing community of inventors

Tokushima, Japan

Toru Takasone