Fujitsu Corporation

Toru Okada

Masanao Fujii

Masayuki Kitajima

Hidehiko Kobayashi

Seiichi Shimoura

Keiichi Yamamoto

Yutaka Noda

Hiroshi Kobayashi

Shunji Baba

Hidehiko Kira

Norio Kainuma

Masakazu Takesue

Kenji Iketaki

Hisao Tanaka

Takatoyo Yamakami

Satoshi Emoto

Kenji Kobae

Kazuhisa Mishima

Takeshi Komiyama

Toshiaki Otsuka

Yasunori Sasaki

Shingo Yamaguchi

Yoshiaki Yanagida

Hideo Abe

Hirokazu Yamanishi

Mitsuo Takeuchi

Tohru Harada

Takumi Masuyama

Koichi Shimamura

Haruyasu Watanabe

Yoshikazu Hirano

Kinuko Mishiro

Ryoji Matsuyama

Yasutoshi Furukawa

Naoki Yamasaki

A substrate on which an electronic component is soldered, includes an electronic component, a through hole positioned on the substrate and passing through the substrate, a solder that joins the through hole and a terminal of the electronic component inserted in the through hole, a pattern formed on a first surface of the substrate, the first surface facing a second surface on which the electronic component is placed, a first resist superimposed on the pattern, an exposed portion of which the pattern is exposed from the first resist around the through hole, and a second resist superimposed on the pattern and arranged between the through hole and the exposed portion.

Substrate on which electronic component is soldered, electronic device, method for soldering electronic component

An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

Apparatus for mounting electronic component

A method of determining a reinforcement position of a circuit board includes: setting a numerical model of a circuit board in which an electronic component is mounted in a front surface by bumps, and a reinforcing member is attached to a position corresponding to a bump located in a corner part of the electrical component in a back surface; incorporating information about a stud that is located in a periphery of the electronic component and fixes the circuit board to a chassis of the electronic device; performing a simulation for obtaining values of stresses generated in bumps of corner parts when a force is applied to the electronic component from a back side of the circuit board; and determining an arrangement of the reinforcing member in accordance with a position of the stud based on the values of stresses obtained by the simulation.

Method of determining reinforcement position of circuit substrate and substrate assembly

Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.

Board reinforcing structure, board assembly, and electronic device

A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board.

Repair apparatus and repair method

A contact sensor unit includes: a flexible substrate having a conductive pattern; a sensor element having a detecting surface for detecting a fingerprint of a test subject, the sensor element having a terminal electrically connected to the conductive pattern, and the sensor element mounted on the flexible substrate to be covered with the flexible substrate; and a reinforcing member fixed on the flexible substrate and surrounding the sensor element.

Contact sensor unit, electronic device, and method for producing a contact sensor unit

A first plate material is set on a work stage. The first plate material includes first components commonly connected to a first connection member. A second plate material is subsequently set on the work stage. The second plate material includes second components commonly connected to a second connection member. The second components are superposed on the corresponding first components. The first components as well as the second components can be handled as a one-piece component. It leads to an improved productivity. Heat surfaces of a heat block contact the second components. The connection members are prevented from thermal expansion. The constant intervals are reliably maintained between the adjacent first components and the adjacent second components.

Method of heating superposed components and heating apparatus therefor

A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive () is provided on the surface () of a micro component () opposite to the side of a substrate (), and the distal end of a component holding pin () having cross-section area falling within the surface () of the micro component () opposite to the side of the surface () is passed through the thermosetting adhesive () to abut against the surface () of the micro component (). Subsequently, solder () between the micro component () and the substrate () is heated to melt and the component holding pin () is moved in the direction receding from the substrate (). Consequently, the micro component () is removed from the substrate ().

Micro component removing method

An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.

Optical module

A method and a apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive () is provided on the surface () of a micro component () opposite to the side of a substrate (), and the distal end of a component holding pin () having cross-section area falling within the surface () of the micro component () opposite to the side of the surface () is passed through the thermosetting adhesive () to abut against the surface () of the micro component (). Subsequently, solder () between the micro component () and the substrate () is heated to melt and the component holding pin () is moved in the direction receding from the substrate (). Consequently, the micro component () is removed from the substrate ().

Micro component removing apparatus

A solder repairing apparatus includes a stage designed to place the surface of at least a specific part of an object along a reference plane within a specific spot defined on the stage. A heating unit applies a thermal energy to the specific spot. A dividing plate is designed to move into the specific spot in a vertical attitude perpendicular to the reference plane. The dividing plate exhibits a low solder wettability. The solder melts in response to the application of the thermal energy. When the dividing plate in the vertical attitude enters the specific spot, the dividing plate gets into the solder. Since the dividing plate exhibits a low solder wettability, the dividing plate repels the solder. The solder is divided into two parts. The division of the solder reliably eliminates a short circuit in the electronic circuit.

Solder repairing apparatus and method of repairing solder

The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding memberincluding a holding wallair-tightly closing a space S that holds a plurality of balls B having the same size and in which a holelarger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup meansfor blowing the balls B held in the holding memberupward; and capturing meansfor capturing a ball B blown up by the blowup meansand reached the hole.

Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method

An optical module is produced by coating, with respect to a substrate having a substrate surface provided with terminal pads and landing pads a solder material on the terminal pads, mounting an optical element package having terminals and a flat top surface on the substrate using the landing pads so that the top surface becomes approximately parallel to the substrate surface and a gap is formed between a bottom surface of the optical element package and the substrate surface, preheating the terminal pads simultaneously as the mounting, and electrically connecting the terminal pads to corresponding terminals of the optical element package by melting the solder material and thereafter hardening the solder material.

Optical module producing method and apparatus

An apparatus and method for improving the underfill filling of a semiconductor chip elementwhich is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip elementincludes a silicon chipand a group of stud bumpsformed on a bottom surfaceof the chip. Signal stud bumpsare made of gold while power stud bumpsground stud bumpsand dummy stud bumpsare all made of a gold-palladium alloy, which are harder than the signal stud bumpsand thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip elementis mounted, a gap of approximately 30 &#x3bc;m is maintained between the bottom surfaceof the chipand a top surface of the circuit boardon which the semiconductor chip elementis mounted.

Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method

In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.

Growing community of inventors

Kawasaki, Japan

Toru Okada