Ibiden Company Limited

Toru Nakai

Satoru Kawai

Yoshiyuki Iwata

Hiroshi Niwa

Sho Akai

Masanori Tamaki

Tetsuo Amano

Yoshinori Takasaki

Liyi Chen

Katsuya Ohno

Tomohiro Nohara

Teruaki Yokota

Kumiko Takada

Kenta Uemura

Hiroko Takagi

The objective of the invention is to provide a plant activator with superior resistance-inducing activity and growth promoting activity and low toxicity and soil contamination. A plant activator comprising a fatty acid metabolite obtainable by a metabolism of a fatty acid with 4 to 30 carbon atoms by a proteobacteria under a dissolved oxygen concentration of 0.1-8 mg/L, and a method for manufacturing a plant activator comprising a fatty acid metabolite, comprising a step for fatty acid metabolism wherein a fatty acid with 4 to 30 carbon atoms is subjected to a proteobacterial metabolization under a dissolved oxygen concentration of 0.1-8 mg/L. A method for manufacturing a plant activator comprising a fatty acid metabolite, comprising a step for fatty acid metabolism wherein a fatty acid with 4 to 30 carbon atoms is subjected to a proteobacterial metabolization under a dissolved oxygen concentration of 0.1-8 mg/L.

Plant activator and a method of manufacturing the same

A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder padis formed by providing a single tin layeron a conductor circuitor a via. Therefore, a signal propagation rate can be increased, as compared with a printed wiring board of the prior art on which two metal layers are formed. In addition, due to lack of nickel layers, manufacturing cost can be decreased and electric characteristics can be enhanced.

Printed wiring board

A method for manufacturing a printed wiring board including forming an insulative resin layer containing a resin and an inorganic filler, forming a conductor layer including a conductive material and having a conductor on the insulative resin layer, irradiating a laser beam upon the conductor of the conductor layer such that the conductor is sectioned or a width of the conductor is narrowed, and forming a conductive pattern on the insulative resin layer. The inorganic filler is in an amount of 30 wt. % or more of the insulative resin layer.

Method for manufacturing printed wiring board

A multilayer printed wiring board includes a first interlaminar resin insulating layer, a first conductor circuit formed on the first interlaminar resin insulating layer, a second interlaminar resin insulating layer formed on the first interlaminar resin insulating layer and the first conductor circuit, a second conductor circuit formed on the second interlaminar resin insulating layer. A via conductor can be formed in the opening portion. The opening portion of the second interlaminar resin insulating layer can expose a face of the first conductor circuit. The via conductor connects the first conductor circuit and the second conductor circuit. The via conductor includes an electroless plating film formed on inner wall face of the opening portion and includes an electrolytic plating film formed on the electroless plating film and on the exposed face of the first conductor circuit exposed by the opening portion. The second conductor circuit includes the electroless plating film and the electrolytic plating film.

Method of manufacturing multilayer printed wiring board

A plating apparatus and method to perform plating in non-through-hole openings or through-hole openings of a printed wiring board having at least either non-through holes or through-holes to form via-hole conductors or through-hole conductors. The plating method contacts a printed wiring board having the non-through holes or through-holes with a plating solution including plating ingredients, and plates metal on a surface of the printed wiring board while making contact with at least a portion of a pliable contact body.

Plating apparatus and method of plating

A wiring board includes an insulation layer containing a resin and a silica-type filler and having a roughened surface, and a conductive layer formed on the roughened surface of the insulation layer and having a first conductive portion and a second conductive portion positioned adjacent to the first conductive portion. The roughened surface of the insulation layer has a roughness under the first conductive portion, a roughness under the second conductive portion, and a roughness between the first conductive portion and the second conductive portion, and the roughness between the first conductive portion and the second conductive portion is set less than at least one of the roughness under the first conductive portion and the roughness under the second conductive portion.

Wiring board and method for manufacturing the same

A method of manufacturing a multilayer printed wiring board includes forming a first interlaminar resin insulating layer, a first conductor circuit on the first interlaminar resin insulating layer, a second interlaminar resin insulating layer, opening portions in the second interlaminar resin insulating layer to expose a face of the first conductor circuit, an electroless plating film on the second interlaminar resin insulating layer and the exposed face, and a plating resist on the electroless plating film. The method further includes substituting the electroless plating film with a thin film conductor layer, having a lower ion tendency than the electroless plating film, and a metal of the exposed face, forming an electroplating film including the metal on a portion of the electroless plating film and the thin film conductor layer, stripping the plating resist, and removing the electroless plating film exposed by the stripping.

[Subject Matter] To provide a method for manufacturing a wiring substrate where rigidity is enhanced in an insulative portion made by oxidizing aluminum. [Solution(s)] Aluminum oxide insulative portionis formed on aluminum plateas shown in FIG.(A) through anodic oxidation (FIG.(C)). Then, holes (nano-holes) () in aluminum oxideare filled with resin(FIG.(E)). Accordingly, the rigidity (strength) of insulative portionwill be enhanced and cracking will not occur during heat cycles. Also, the insulation reliability of aluminum oxide will increase, and short circuiting may be prevented at through holes(aluminum portions) separated by aluminum oxide

Wiring substrate and method for manufacturing wiring substrate

A multilayer printed circuit board has an insulation layer, a first conductor layer provided over a first side of the insulation layer, a second conductor layer provided over a second side of the insulation layer opposite to the first side, and multiple filled vias electrically connecting the first conductor layer and the second conductor layer. The filled vias have upper surfaces, respectively, and each of the upper surfaces is made such that a difference between a lowest point and a highest point of each of the upper surfaces is less than or equal to about 7 &#x3bc;m.

Plating apparatus, plating method and multilayer printed circuit board

Multilayer printed wiring board and method of manufacturing multilayer printed wiring board

A method for manufacturing a multilayer printed circuit board including providing a core substrate having a penetrating-hole, forming an electroless plated film on a surface of the substrate and an inner wall surface of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of the substrate an insulating member in contact with the surface of the substrate such that an electrolytic plated film is formed on the electroless plated film, an opening space inside the penetrating-hole is filled with an electrolytic material, and a through-hole conductor structure is formed in the penetrating-hole, forming an etching resist having an opening pattern on the electrolytic plated film, and removing an exposed pattern of the electrolytic plated film exposed by the opening pattern and a pattern of the electroless plated film under the exposed pattern such that a conductor circuit is formed on the surface of the substrate.

A printed wiring board including resin insulation layers, and conductive circuits formed between the resin insulation layers such that spaces between the conductive circuits are filled with a resin material of the resin insulation layers. The conductor circuits include a first conductive circuit and a second conductive circuit positioned adjacent to the first conductive circuit, each of the first and second conductive circuits has a trapezoidal cross section, and the first and the second conductive circuits satisfy a formula, 0.10T&#x2266;|W&#x2212;W|&#x2266;0.73T where Wrepresents a width of a space between upper surfaces of the first and second conductive circuits, Wrepresents a width of a space between lower surfaces of the first and second conductive circuits, and T represents a thickness of each of the first and second conductive circuit.

Printed wiring board and manufacturing method thereof

A plating method includes providing an article in a plating bath, covering a surface of the article with an insulating member in the plating bath, and electrolytically plating the article while moving one of the insulating member and the article relative to each other.

A printed wiring board having an interlayer insulation layer and conductive circuits formed on the interlayer insulation layer. The conductive circuits include a first conductive circuit and a second conductive circuit positioned adjacent to each other, and the first and second conductive circuits satisfy a formula, 0.10 T&#x2266;|W&#x2212;W|&#x2266;0.73 T, where Wrepresents an upper conductive circuit space between the first and second conductive circuits, Wrepresents a lower conductive circuit space between the first and second conductive circuits, and T represents a thickness of the first and second conductive circuits.

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Ibi-gun, Japan

Toru Nakai