Tdk Corporation

Fanuc Corporation

Sae Magnetics (h.k.) Limited

Fujitsu Corporation

Nippon Mektron Limited

Toru Mizuno

Osamu Shindo

Satoshi Yamaguchi

Toshinobu Miyagoshi

Tomomi Asakura

Hidetoshi Suzuki

Yuji Saito

Kenichi Toyoda

Ryuichi Hara

Kouji Tanaka

Masaaki Kaneko

Masatoshi Ito

Shigehiro Morikawa

Hiroshi Ikeda

Nobutoshi Torii

Hiroji Nishi

Masashi Gotoh

Masayoshi Kobayashi

Jitsuo Kanazawa

Hitoshi Nakayama

Takashi Shioura

Tokio Tadano

Yuichi Kanda

Youichi Andoh

Yoshihiro Onozeki

Koichiro Okazaki

Tatuo Umeya

Tatsuya Wagou

Toshiaki Otsuki

Fumihiko Matsuda

Minoru Nakamura

Makoto Orikasa

Takashi Kawashima

Hiroyuki Takano

Masahiko Hosokawa

Katsuhiko Igarashi

Shoji Takano

Haruyuki Ishikawa

Kazuaki Takanuki

Hirotsugu Kaihori

Garo Miyamoto

Takashi Iwamoto

Norihiko Kawada

Masakazu Nakayama

Mitsuyoshi Makida

Tatsunori Otomo

Shoichi Sagara

Junichi Kamata

Yasuhiro Saitou

Masaya Wada

Takao Torii

Tatsuya Wagoh

A mounting apparatus for mounting an optical element on a wiring board having a reflecting mirror part of an optical waveguide on its back side comprises a mounting table that supports the wiring board by a holding area, a mounting nozzle that holds the optical element and mounts it on the wiring board, a light source that emits light for illuminating the reflecting mirror part by transmission through the holding area, an image pickup apparatus that captures a transmitted light image of the reflecting mirror part, and a control apparatus that determines a mounting position of the optical element based on the transmitted light image, thereby achieving high density mounting without providing a light introducing part for positioning in mounting the optical axis.

Apparatus and method for mounting photoelectric element

A magnetic head device which has strong joint strength in an arm and a suspension and high accuracy of a size and a shape is provided. The magnetic head device comprises an arm, a suspension overlapping with a leading end part of the arm, a slider located at a leading end part of the suspension, and a first joint part that is placed between the leading end part of the arm and the suspension and that joins the arm and the suspension, the first joint part including Sn or a resin adhesive.

Magnetic head device having suspension and spacer

A workpiece mounting apparatus includes a transfer apparatus having a nozzle, a first imaging unit, and an image processor. The nozzle has opposed first and second ends, a suction hole at the first end, and a transparent end face member sealing the second end. The first imaging unit captures a first pattern for positioning a workpiece. The image processor identifies a reference position of the workpiece based on the first pattern captured. The workpiece mounting apparatus also includes a substrate support supporting a substrate with a second pattern for positioning, a second imaging unit for capturing the second pattern, and a positioning unit for controlling position of the nozzle. The image processor identifies a mounting target position on the substrate, based on the second pattern capture, and the positioning unit controls the nozzle to mount the workpiece on the substrate, when the reference position coincides with the mounting target position.

Workpiece mounting apparatus

An application head includes a storage-side valve, a discharge-side valve and a plunger. The storage-side valve slides in a space in communication with an intermediate liquid passage between the storage-side valve and the discharge-side valve and changes the volume of liquid in the intermediate liquid passage. Each of the storage-side valve and the discharge-side valve has a column-shaped part, includes a through-hole penetrating between outer circumferential surfaces of the column-shaped part, and is rotatable at least within a predetermined angular range around a center axis of the column-shaped part. Each of the through-holes of the storage-side valve and the discharge-side valve communicates with liquid passages on both sides at a predetermined rotational position and does not communicate with the liquid passage on both sides at other rotational positions outside the angular range.

Application head and droplet applying apparatus

A workpiece transfer apparatus includes a nozzle unit and an imaging unit. The nozzle unit includes a tubular body, a suction hole opening at one end of the tubular body and an end face member of a transparent body sealing the other end of the tubular body. The imaging unit captures images of first patterns for positioning that are located on an upper surface of a workpiece. The size and shape of the suction hole fits within an outline of the upper surface of the workpiece. The end face member of the transparent body maintains a negative pressure inside the cylindrical body and permits optical penetration for the imaging unit. The imaging unit captures the image of the first pattern for positioning of the workpiece while the imaging unit views a suctioned surface of the workpiece through the transparent body and the suction hole.

Workpiece transfer apparatus

A method and a system for stabilizing the sight line of a chip component being carried on two discs, for stabilizing delivery of the chip component between the two discs, and improving and stabilizing the inspection accuracy in the visual check of the chip component. This is achieved by employing a mechanism for carrying the chip component while supporting it on the horizontal plane of the first rotary disc and then carrying the chip component while suction-holding it on the vertical plane of the second rotary disc. When the chip component is carried on the first rotary disc, the upper surface and one side face of the chip component are imaged by first and second cameras. When the chip component is carried on the second rotary disc, the lower surface and the other side face of the chip component are imaged by third and fourth cameras.

Chip component carrying method and system, and visual inspection method and system

In an ultrasonic mounting apparatus, a pressing shaft coupled with a voice coil motor to apply a load on a part to be mounted is placed independently from components including a bonding tool, ultrasonic horn, transducer, and horn support member. The components can move coaxially with the pressing shaft which is an application axis of a driving force. Abutting position of the bonding tool and pressing shaft is brought into coincidence with a node of a standing wave generated in the bonding tool.

Ultrasonic mounting apparatus

A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.

Mounting apparatus mounting surface-mounted device on receiving device using ultrasonic vibration

In a conductive material supply apparatus that can connect a small slider electrode and a wiring electrode on a flexure in a miniaturized magnetic head, electrically conductive material is supplied, with the aid of flow of nitrogen gas that is pressurized to a first pressure, into the interior of a nozzle assembly that defines an interior space having a nozzle orifice through which the electrically conductive material can pass. After the electrically conductive material has been supplied, the flow of the nitrogen gas is stopped, and the interior space is temporarily brought into communication with the exterior space thereby decreasing the pressure in the interior space. Thereafter, nitrogen gas maintained at a second pressure that is designed to be lower than the first pressure is supplied to the interior space, whereby the electrically conductive material is ejected to the exterior from the nozzle orifice by the effect of the second pressure.

Apparatus and method for supplying electrically conductive material

Provided is an apparatus for adjusting static attitude of a thin film magnetic head attached to a flexure of a head arm assembly. The apparatus has an adjusting unit for bending the flexure, a laser emitter unit for irradiating a laser beam to a bent area of the flexure a measuring unit for measuring a static attitude angle of the thin film magnetic head, and a computer system including a CPU and a memory unit in which adjustment conditions corresponding to static attitude angles of the thin film magnetic head are previously ranked and memorized. The CPU is configured to retrieve from the memory unit a particular adjustment condition corresponding to a measured angle supplied from the measuring unit and supply the retrieved adjustment condition to the adjusting unit, enabling the adjusting unit to bend the flexure based on the retrieved adjustment condition supplied from the computer system.

Apparatus for adjusting static attitude of thin film magnetic head

The present invention provides a solder ball bonding method and a solder ball bonding apparatus, which can enhance efficiency of bonding processing and in which plural electrodes formed on objects to be bonded are bonded to each other by melting a solder ball. In the present invention, the solder balls are picked up by a pick-up nozzle having a plurality of pick-up openings corresponding to electrode areas on the objects to be bonded and the solder balls are conveyed on the electrode areas. A laser radiating unit disposed independently above the pick-up nozzle is shifted along an arrangement direction of the pick-up openings and a laser beam from the laser radiating unit is irradiated onto the solder ball through a transparent member of the pick-up nozzle and through the pick-up opening of the pick-up nozzle, thereby melting the solder ball on the electrode area.

Conductive ball bonding method and conductive ball bonding apparatus

Provided is a nozzle unit for use in a bonding device in which bonding between a first member and a second member is effected by providing a bonding member that has been melted by heating at a bonding position where the first member and the second member are to be bonded to each other. The nozzle unit includes: a cylindrical nozzle assembly having an accommodating space accommodating the bonding member, and an opening which allows ejection of the bonding member accommodated in the accommodating space onto the bonding position, which has a diameter larger than the diameter of the bonding member, and which communicates with the accommodating space; and a holding/releasing member for releasably holding the bonding member within the accommodating space.

Soldering method, soldering device, bonding method, bonding device, and nozzle unit

A horn that can suppress oscillation components other than the component in the horizontal direction, a horn unit, and a bonding apparatus using same are provided. The horn has a cross-section variable section in which a cross section perpendicular to the lengthwise direction (X direction) thereof has a first region extending in the Z direction and a pair of second regions sandwiching the first region from Y direction. In the position Pcorresponding to an anti-node of a standing wave of oscillations excited in the horn, a sectional area Sof the first region assumes a maximum and a sectional area Sof the second region assumes a minimum. With a transition from the position Pto the other positions corresponding to nodes, the sectional area Sdecreases and the sectional area Sincreases. As a result, oscillation components other than those in the X direction are suppressed.

Horn, horn unit, and bonding apparatus using same

After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a lower block which is situated inside of the receiving hole at a time when the solder ball is taken into the receiving hole and surrounds a rolling trajectory of the solder ball that has been taken into the receiving hole, the solder ball is forcibly introduced into the receiving hole.

Solder ball supplying method and supplying device

Growing community of inventors

Tokyo, Japan

Toru Mizuno