Nippon Telegraph and Telephone Corporation

Kowa Company Limited

Kyowa Hakko Kirin Co., Limited

Mitsui Chemicals Tohcello, Inc.

Fuji Xerox Co., Ltd.

Mitsui Chemicals, Inc.

Hopnic Laboratory Co., Ltd.

Other

Denso Corporation

Ntt Electronics Corporation

Ntt Advanced Technology Corporation

Mitsui Chemicals Ict Materia, Inc.

Toru Miura

Kimiyuki Shibuya

Tadaaki Ohgiya

Michiko Seyama

Tsutomu Horiuchi

Yuzuru Iwasaki

Hiroshi Fukuda

Yoshiho Maeda

Koichi Yamazaki

Ayumu Okuda

Tsuyoshi Hayashi

Yukihiro Sato

Hiroyoshi Kurihara

Nobuaki Takahashi

Mitsuteru Hirata

Taro Aoki

Seiichi Sato

Takahiro Kitamura

Takayuki Matsuda

Shinji Nishimura

Hajime Yamada

Kazuhiro Onogi

Yuichi Higuchi

Yuki Yamaguchi

Kiyoshi Takahashi

Yoshimitsu Aiiso

Toshiaki Watanabe

Hiroshi Tomita

Kenji Kobayashi

Tsuneyuki Haga

Jun-ichi Takahashi

Toshiyuki Edano

Katsumi Kawamine

Katsutoshi Miyosawa

Chiyoka Ozaki

Toshiharu Arai

Haruki Shibata

Yoshinori Kitagawa

Serge Camou

Junya Tagashira

Aki Matsushima

Ryohei Sekimoto

Rie Ishida

Hitomi Aoki

Masahiro Takiguchi

Jin Kinoshita

Joji Yamaguchi

Sayaka Kurobuchi

Yuichiro Watanabe

Hisanobu Dobashi

Kouji Igarashi

Tatsuya Hirata

Hiromi Sato

Shigeru Date

Jyunichi Takahashi

Masaru Kobayashi

Tomoaki Ishifuji

Masayuki Murakami

Tadashi Sato

Kimiaki Ando

Etsu Hashimoto

Naoki Ooba

Minoru Koura

Koichi Hadama

Hidefumi Ozawa

Gen Watanabe

Katsuyoshi Hayashi

Jun-Ichi Takahashi

Ayako Tosaka

Ryouzo Yoshino

Aki Hirano

A method for manufacturing an electronic device includes at least a preparing step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, an adhesive resin layer (B) provided on a second surface side of the base material layer, and an unevenness-absorbing resin layer (C) provided between the base material layer and the adhesive resin layer (A) or between the base material layer and the adhesive resin layer, and an electronic component attached to the adhesive resin layer (A) of the adhesive film and having an uneven structure, a cross-linking step of cross-linking the unevenness-absorbing resin layer (C) by applying an external stimulus to the unevenness-absorbing resin layer (C) in the structure, and a sealing step of sealing the electronic component with a sealing material.

Method for manufacturing electronic device

In an embodiment, an optical inspection circuit includes: an optical modulator comprising an optical waveguide on a substrate, the optical waveguide having a core comprising a semiconductor; a first input waveguide optically connected to the optical modulator, the first input waveguide having a core comprising the semiconductor; an output waveguide optically connected to the optical modulator, the output waveguide having a core comprising the semiconductor; a photodiode on the substrate in a vicinity of the optical modulator; a wire electrically connecting the optical modulator and the photodiode; and a second input waveguide optically connected to the photodiode, the second input waveguide having a core comprising the semiconductor.

Optical inspection circuit and optical inspection method

A method for manufacturing an electronic device includes at least a step (1) of preparing a structure comprising (i) an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, and an adhesive resin layer (B) provided on a second surface side of the base material layer, (ii) an electronic component attached to the adhesive resin layer (A) of the adhesive film, and (iii) a support substrate attached to the adhesive resin layer (B) of the adhesive film; a step (2) of sealing the electronic component with a sealing material; a step (3) of peeling the support substrate from the structure by reducing an adhesive force of the adhesive resin layer (B) by applying an external stimulus; and a step (4) of peeling the adhesive film from the electronic component.

A method for manufacturing an electronic device includes at least a preparing step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is reduced by external stimuli, and an unevenness-absorbing resin layer (C) provided between the base material layer and the adhesive resin layer (A) or between the base material layer and the adhesive resin layer (B), an electronic component attached to the adhesive resin layer (A) of the adhesive film and having an uneven structure, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; and a sealing step of sealing the electronic component with a sealing material.

There is provided an optical waveguide constituted by a core made of a semiconductor and formed on a substrate. A grating coupler is provided at one end of the optical waveguide. Further, a reflecting portion formed on the optical waveguide by being optically coupled to the optical waveguide is provided at the other end of the optical waveguide. The optical waveguide constituted by the core includes a light intensity modulation unit that modulates an intensity of guided light in the optical waveguide. The light intensity modulation unit is constituted by a variable optical attenuator.

Optical circuit for alignment and optical alignment method

An alignment optical circuit includes: a plurality of grating couplers that are formed on a substrate and arranged on a line; a plurality of optical waveguides that are connected to the plurality of grating couplers, respectively. Further, the alignment optical circuit includes an optical sensor that is formed on the substrate and measures optical intensity at a first light-receiving spot and a second light-receiving spot on a line along an arrangement direction of the plurality of grating couplers.

Aligning optical circuit and aligning method

A stage, electric probes, an optical probe, an electric measurement device, an optical measurement device, and a first positioning mechanism are provided. The stage includes a second positioning mechanism that changes relative positional relationship between the electric probes and an electric connection portion of each of the optical elements. The electric probes electrically connect the electric measurement device and each of the optical elements. The optical probe optically connects the optical measurement device and each of the optical elements. The first positioning mechanism changes relative positional relationship between the optical probe and an optical connection portion of each of the optical elements.

Inspection device and method

Plural grating couplers having grating conditions different from each other and plural optical waveguides respectively connected with the plural grating couplers are included. The plural grating couplers have the same arraying directions of gratings. Further, each of the plural grating couplers has a different grating interval as a grating condition. Further, plural reflection units respectively provided to the plural optical waveguides are included.

Optical circuit for alignment

The method for manufacturing an electronic device includes at least: a step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer and for temporarily fixing an electronic component, and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, an electronic component attached to the adhesive resin layer (A) of the adhesive film, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; at least one step selected from a step of decreasing water content in the adhesive film and a step of decreasing water content in the structure; and a step of sealing the electronic component with a sealing material.

An adhesive film includes a base material layer; an adhesive resin layer (A) provided on a first surface side of the base material layer; and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, in which, as measured by method 1, an integrated tacking force value (F) of the adhesive resin layer (B) is 1.0 gf/sec or more at a test speed of 2.5 mm/min and a test temperature of 130&#xb0; C., and an integrated tacking force value (F) of the adhesive resin layer (B) is 7.0 gf/sec or more at a test speed of 30 mm/min and a test temperature of 130&#xb0; C.

Adhesive film and method for manufacturing electronic device

An embodiment optical test circuit includes a first optical circuit and a second optical circuit formed on a substrate, an input optical waveguide optically connected to the first optical circuit and the second optical circuit, and an output optical waveguide optically connected to the first optical circuit and the second optical circuit. The optical test circuit also includes a light emitting diode optically connected to the input optical waveguide, and a photodiode optically connected to the output optical waveguide.

Optical test circuit

An optical waveguide in which a grating coupler is formed, a first pattern region arranged to surround the grating coupler, and a second pattern region arranged to surround the grating coupler are included. The first pattern region and the second pattern region are arranged adjacently. In a periphery of the grating coupler, the first pattern region is formed in a region continuous in a circumferential direction. Similarly, in the periphery of the grating coupler, the second pattern region is formed in a region continuous in the circumferential direction.

An optical inspection circuit includes an optical circuit to be inspected formed on a substrate, an input optical waveguide optically connected to the optical circuit, and an output optical waveguide optically connected to the optical circuit. The input optical waveguide is connected with a grating coupler for input. The grating coupler is connected with the input optical waveguide via a spot size conversion unit. The output optical waveguide is optically connected with a photodiode.

Optical inspection circuit

A photodiode including a p-type region and an n-type region formed in a core of a grating coupler is provided. The p-type region and the n-type region are each formed as a region having a rectangular shape extending in an array direction of a grating as seen in plan view and are arranged in a direction orthogonal to the array direction of the grating and parallel to a plane of a substrate. A plurality of the p-type regions and a plurality of the n-type regions are formed and alternately arranged.

An information processing apparatus includes a first reception unit that receives a first request from a client; a first transmitting unit that transmits the first request to a load balancer unit; a second reception unit that receives a response to the first request from the load balancer unit; a storage controller that controls to cause a storage device to store first information applied to the first request, and second information applied to the response, in an associated manner; and a second transmitting unit that transmits the response from which the second information is deleted, to the client.

System, information processing apparatus, information processing method, and storage medium

Growing community of inventors

Tokyo, Japan

Toru Miura