Ebara Corporation

Sumitomo Heavy Industries, Ltd.

Nippon Sheet Glass Company, Limited

Toru Maruyama

Yasuyuki Motoshima

Nobuyuki Takahashi

Hisanori Matsuo

Mitsunori Komatsu

Keisuke Kamiki

Yoichi Shiokawa

Shuji Uozumi

Suguru Sakugawa

Itsuki Kobata

Keita Yagi

Katsuhide Watanabe

Fujihiko Toyomasu

Yohei Eto

Junji Kunisawa

Tadakazu Sone

Zhongxin Wen

Norio Kimura

Osamu Nabeya

Hiroyuki Shinozaki

Mitsuru Miyazaki

Koji Maeda

Seiji Katsuoka

Shunichiro Kojima

Katsutoshi Ono

Masayoshi Imai

Yoshimitsu Matsushita

Teruaki Hombo

Tomohiko Takeuchi

Hideki Okamoto

Taichi Yokoyama

Shin Ohwada

Yoshinori Isono

Hiroaki Yanagi

Jyunya Hamasaki

A method of checking a leakage of fluid from a fluid line includes connecting a leakage checking line to the fluid line between a supply valve and a return valve, regulating a pressure regulator disposed in the leakage checking line such that a pressure of fluid of the leakage checking line becomes the same as a pressure of fluid of the fluid line; closing the supply valve and the return valve and opening an opening/closing valve disposed in the leakage checking line; acquiring a flow rate of the fluid that flows in the leakage checking line by a flowmeter disposed in the leakage checking line; comparing the flow rate of the fluid acquired at the acquiring with a predetermined threshold; and determining that the fluid of the fluid line is leaked, when the flow rate of the fluid acquired at the acquiring is larger than the predetermined threshold.

Method of checking leakage of fluid and polishing apparatus

An object of the present invention is to improve a substrate processing apparatus using the CARE method. The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

Substrate processing apparatus, substrate processing system, and substrate processing method

The present invention relates to a temperature regulating apparatus for regulating a temperature of a polishing surface of a polishing pad used for polishing a substrate, such as a wafer. The present invention further relates to a polishing apparatus including such a temperature regulating apparatus. The temperature regulating apparatus () includes: a heat exchanger () having a heating flow passage () and a cooling flow passage () formed therein; a holder () arranged over the heat exchanger (); a coupling mechanism () configured to detachably fix the heat exchanger () to the holder (), the coupling mechanism () including: a first hook () fixed to an upper surface of the heat exchanger (); and a second hook () held by the holder (). The second hook () is configured to be able to be engaged with and disengaged from the first hook ().

Temperature regulating apparatus and polishing apparatus

A system () includes a heat exchanging member () and a liquid supply unit (). The liquid supply unit () includes a pump device () that adjusts the flow amount of a liquid flowing through a heating liquid supply line (HSL), a needle valve (MNV) that is attached to a cooling liquid supply line (CSL), and a control device () that controls operations of the pump device () and the needle valve (MNV).

System for adjusting pad surface temperature and polishing apparatus

The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device () for measuring surface properties of a polishing pad (), a support arm () for supporting the surface-property measuring device (), and a moving unit () coupled to the support arm () and configured to move the surface-property measuring device () from a retreat position to a measure position.

Polishing apparatus having surface-property measuring device of polishing pad and polishing system

The present invention relates to a method of cleaning an optical film-thickness measuring system used for measuring a film thickness of a substrate, such as a wafer, while polishing the substrate. The method includes: cleaning an optical sensor head () by supplying a rinsing liquid into a through-hole () formed in a polishing pad () on a polishing table () before or after polishing of a substrate (W) with use of slurry, the optical sensor head () being located below the through-hole (); and discharging the rinsing liquid from the through-hole () through a drain line ().

Method of cleaning an optical film-thickness measuring system

The present application relates to a pad-temperature regulating apparatus for regulating a temperature of a surface of a polishing pad. The pad-temperature regulating apparatus includes a pad-contact member, a supply system for supplying a heating liquid and a cooling liquid into the pad contact member, a pad-temperature measuring device for measuring the temperature of the surface of the polishing pad, and a controller for performing a PID control of manipulated variables of a first flow control valve and a second flow control valve. The controller includes a memory in which a learned model constructed to maintain a temperature behavior curve, created based on measured values of the pad-temperature measuring device, within a predetermined allowable range, is stored; and a processing device which inputs at least one temperature behavior parameter to the learned model, and performs a calculation to output a change value of PID parameter for the PID control.

Pad-temperature regulating apparatus, method of regulating pad-temperature, polishing apparatus, and polishing system

A method of inspecting a leak detection system in a short time is disclosed. The leak detection system includes a leak detection line, an on-off valve, a flow mater, an operation controller configured to detect a fluid leak from a fluid line based on a first flow rate measured by the flow mater, a drain line, and a drain valve attached to the drain line. The inspection method includes: opening the on-off valve and the drain valve, with a supply valve and a return valve closed; measuring a second flow rate of fluid in the leak detection line by the flow mater; and determining that the leak detection system has a defect when the second flow rate is lower than a predetermined reference value.

Leak detection system and inspection method for the system

A pad-temperature regulating apparatus is disclosed, which includes a heat exchanger capable of being cleaned in a limited space. A pad-temperature regulating apparatus includes a heat exchanger configured to contact a polishing pad to exchange heat with the polishing pad, a moving mechanism configured to move the heat exchanger between a temperature regulating position where the heat exchanger can exchange heat with the polishing pad, and a retreat position located on a side of the polishing pad, and a cleaning mechanism configured to clean the heat exchanger moved to the retreat position. The heat exchanger has an approximate triangular shape in a horizontal cross-section, and a longest side of the heat exchanger faces the polishing pad when the heat exchanger is moved to the retreat position.

Pad-temperature regulating apparatus, and polishing apparatus

A pad-temperature regulating device is disclosed, which can improve a responsiveness of a control for a surface temperature of a polishing pad and regulate the surface temperature of the polishing pad without causing defects, such as scratches, on the substrate. The pad-temperature regulating apparatus includes: a heat exchanger disposed above the polishing pad, whose temperature is maintained at a predetermined temperature; a pad-temperature measuring device configured to measure the surface temperature of the polishing pad; a distance sensor configured to measure a separation distance between the polishing pad and the heat exchanger; an elevating mechanism for moving the heat exchanger vertically with respect to the polishing pad; and a controller configured to control operation of the elevating mechanism based on measured values of the pad-temperature measuring device.

Pad-temperature regulating apparatus, pad-temperature regulating method, and polishing apparatus

A substrate cleaning device that facilitates control of the amount of liquid supplied to a substrate and reduces adverse influences of the liquid supplied to a bearing part on the substrate is provided. The substrate cleaning device includes: a holding part that has a bearing part configured to rotatably hold a cleaning member for cleaning a substrate; a first supply part that has at least a part provided inside the holding part and supplies a first liquid into the cleaning member through the inside of the holding part; and a second supply part that supplies a second liquid to the bearing part.

Substrate cleaning device

A cleaning apparatus capable of effectively removing dirt attached to a bottom surface of a heat exchanger, is disclosed. The cleaning apparatus cleans the heat exchanger for regulating a surface temperature of a polishing pad. This cleaning apparatus includes: a moving mechanism configured to move the heat exchanger between a temperature-regulating position in which the heat exchanger can exchange heat with the polishing pad, and a retreat position in which the heat exchanger is separated from a surface of the polishing pad; and a cleaning mechanism configured to clean a bottom surface of the heat exchanger moved to the retreat position The retreat position is located on a side of the polishing pad. The cleaning mechanism includes at least one cleaning nozzle for ejecting a cleaning liquid to the bottom surface of the heat exchanger, or a cleaning tank in which the bottom surface of the heat exchanger can be immersed.

Cleaning apparatus for heat exchanger and polishing apparatus

There is provided a cryocooler including a first compressor, a second compressor, a cold head that has a high pressure port and a low pressure port, a high pressure line that is configured such that a refrigerant gas is able to flow from the first compressor and the second compressor to the high pressure port of the cold head via a merging portion, the high pressure line including a first high pressure sub-line and a second high pressure sub-line, and a low pressure line that is configured such that the refrigerant gas is able to flow from the low pressure port of the cold head to the first compressor and the second compressor via a diverting portion, the low pressure line including a first low pressure sub-line and a second low pressure sub-line.

Cryocooler and cryocooler pipe system

A substrate processing apparatus having a detecting unit that can detect an abnormality of a substrate such as a crack of the substrate or chipping of the substrate is disclosed. The substrate processing apparatus includes a polishing unit configured to polish a substrate, a cleaning unit configured to clean the polished substrate, a substrate abnormality detection unit configured to detect an abnormality of the substrate, and a substrate transporting mechanism configured to transport the substrate in the order of the polishing unit, the substrate abnormality detection unit, and the cleaning unit. The substrate abnormality detection unit includes an imaging device configured to image the substrate, and an output monitoring unit configured to determine a status of the substrate by comparing a signal obtained from the imaging device with a predetermined threshold.

Growing community of inventors

Tokyo, Japan

Toru Maruyama