Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Toru Komatsu

Tadashi Nomura

Atsushi Shimizu

Yukiya Yamaguchi

Issei Yamamoto

Hideo Nakagoshi

Tetsuya Oda

Akihiro Fujii

Yoichi Takagi

Hideki Shinkai

Motohiko Kusunoki

Ryohei Okabe

To provide electronic circuit module capable of dissipating heat generated by electronic component while suppressing increase in thickness, and capable of improving identifiability and visibility of identification character and identification mark as compared with conventional technique. Electronic circuit module according to present disclosure includes board, plurality of electronic components mounted on upper surface of board; and sealing resin configured to cover electronic component. Sealing resin has lower surface in contact with upper surface of board, and upper surface positioned on opposite side from board with respect to electronic component to face in opposite direction from lower surface. Identification recess constituting at least one of identification character and identification mark when viewed from thickness direction of board is formed in upper surface of sealing resin. Identification recess is filled with filler made of material having higher thermal conductivity than material of sealing resin.

Electronic circuit module

An electronic component module includes a plurality of components including a terminal and placed along a plane, a frame substrate supporting at least some components among the plurality of components, a sealing resin portion sealing the plurality of components and the frame substrate, and a shield layer covering an outer surface of the sealing resin portion. The frame substrate includes an insulating layer, a ground layer, and a ground bump electrically connected to the ground layer, and also an opening supporting a portion other than solder bumps of bump components, and the ground layer of the frame substrate is exposed to a side surface of the frame substrate and is electrically connected to the shield layer. The terminal of the plurality of components and the ground bump are exposed while protruding from a plane of the sealing resin portion and are used as mounting terminals of the electronic component module.

Electronic component module comprising plurality of components and substrate including insulating layer, ground layer and ground bump

A module includes a substrate, a first component, and a first sealing resin layer. The substrate includes a first principal surface. The first component is mounted on the first principal surface. The first sealing resin layer contains a filler containing an inorganic oxide as a main component. The first sealing resin layer is provided on the first principal surface. The first sealing resin layer seals the first component. A marking portion is provided on a surface of the first sealing resin layer on a side opposite to the substrate. In the first sealing resin layer, the content rate of the filler is smaller in a second portion on the side opposite to the substrate than in a first portion on the substrate.

Module having a changing filler content rate in sealing resin layer

An electronic component module includes a substrate having a main surface, an electronic component mounted on the main surface, a sealing resin having an insulation property and covering the electronic component and the main surface, and a conductive film that covers an outer surface of the sealing resin. The electronic component includes a housing whose outer surface has an insulation property, and a first external electrode arranged at one end of the housing. The electronic component module includes a conductive auxiliary layer that covers a part of the first external electrode and a part of the housing on a side of the electronic component opposite to the substrate. The sealing resin has a recessed portion that exposes the conductive auxiliary layer. A conductive portion is formed in the recessed portion and is connected to the conductive film and the conductive auxiliary layer.

Electronic component module and method of manufacturing electronic component module

A module includes a substrate including a first surface, a first component mounted on first surface, and a first sealing resin sealing first component. First sealing resin contains a filler. An upper surface of first sealing resin includes a first region and a second region. A ratio of an area where the filler is exposed from first sealing resin in the second region is smaller than a ratio of an area where the filler is exposed from first sealing resin in the first region, at least the first region and side surfaces of the first sealing resin are covered with a shield film, and the second region is not covered with shield film.

Module and method for manufacturing same

An electronic component module includes a plurality of components having terminals and arranged along a plane, a sealing resin portion that covers and seals these components and has a plane as one plane of an outer surface, and a shield layer that covers the outer surface of the sealing resin portion. Terminals of the plurality of components are exposed in a state of protruding from the plane of the sealing resin portion, and the terminals of these components protruding from the plane of the sealing resin portion are used as mounting terminals of the electronic component module.

Electronic component module and method for manufacturing electronic component module

An electronic component module includes a substrate, a sub-module to be mounted on a main surface of the substrate, and a terminal conductor formed on a main surface of the substrate. The sub-module includes a substrate, an electronic component, an electronic component, and an electronic component. The substrate has a main surface and a main surface. The electronic component and the electronic component are mounted on the main surface. The electronic component is mounted on the main surface. The substrate has a through hole that penetrates between the main surface and the main surface. The sub-module is mounted so that the electronic component may be housed in the through hole.

Electronic component module, and method of manufacturing electronic component module

A module is provided that includes a substrate having a first main surface, a component mounted on the first main surface, a first sealing resin disposed so as to cover the first main surface and the component, and a shield film covering at least an upper surface of the first sealing resin. The shield film includes a protective layer exposed to the outside and a conductive layer covered by the protective layer. The color of a surface of the conductive layer closer to the protective layer is different from the color of the protective layer. Moreover, the laser absorption coefficient of a material of the protective layer is higher than the laser absorption coefficient of a material forming the surface of the conductive layer closer to the protective layer. The module includes a marking section that is not covered by the protective layer and from which the conductive layer is exposed.

Module and method of manufacturing the same

A module is disclosed that includes a substrate having a first main surface, a first component mounted on the first main surface, a first sealing resin disposed so as to cover the first main surface and the first component, a marking film covering at least an upper surface of the first sealing resin, and a shield film covering the marking film. An upper surface of the marking film is locally formed with a first recess.

Package module comprising marking and shield films and method of manufacturing the same

A module is provided that includes a substrate having a first main surface, a first component mounted on the first main surface, a first sealing resin disposed so as to cover the first main surface and the first component, and a shield film covering at least an upper surface of the first sealing resin. The shield film includes a conductive layer, a first protective layer covering the conductive layer, and a second protective layer. The first protective layer is locally formed with a marking section. The second protective layer includes a first region covering the first protective layer and a second region covering the marking section.

Package module comprising shield film on semiconductor device and method of manufacturing the same

An electronic component module includes a substrate, an electronic component, an insulating resin, and a shield film. The insulating resin covers a first main surface side of the substrate. The insulating resin exposes an opposite surface of the electronic component. The shield film covers the insulating resin and the opposite surface of the electronic component. The opposite surface has an uneven portion. A concave portion of the uneven portion has a smoother shape than a convex portion of the uneven portion.

A module includes a substrate including a first main surface, a first component mounted on the first main surface, a first sealing resin including a first upper surface, the first component being sealed with the first sealing resin, a first shield film that covers at least a part of the first upper surface of the first sealing resin, and a second shield film that covers a side surface of the first sealing resin and a side surface of the substrate. A step portion lower than the first upper surface of the first sealing resin is provided on an outer periphery of the first sealing resin. The first shield film and the second shield film are electrically connected to each other on a side surface below the step portion.

A high frequency module having a groove for shielding formed in a sealing resin layer achieves downsizing without damaging wiring electrodes formed on a wiring board or mounting components. A manufacturing method of a high frequency module includes mounting components on an upper surface of a wiring board, and then forming a sacrificial layer for forming a groove. The method further includes forming a sealing resin layer for sealing the components and the sacrificial layer, and dissolving and removing the sacrificial layer to form the groove for shielding. Finally, the method includes forming a shield film coating the surface of the sealing resin layer, and the high frequency module is manufactured. With this method, even when the groove is formed at a position overlapping with the component or a surface layer wiring electrode, the high frequency module can be downsized without damaging the component or the surface layer wiring electrode.

Manufacturing method of high frequency module and high frequency module having groove in sealing resin layer

A module that has excellent heat dissipation performance and enables height reduction easily is provided. The module includes a wiring substrate, a plurality of components mounted on the top surface of the wiring substrate, a plurality of heat dissipation members, a sealing resin layer laminated on the top surface of the wiring substrate, and a shield film that covers surfaces of the sealing resin layer. The heat dissipation member is formed into a strip-shaped sheet. In addition, both end portions of the heat dissipation member are in contact with the top surface of the wiring substrate and also with the components disposed between the both end portions. The heat dissipation member thereby forms a heat dissipation path that transmits heat generated by the component to the wiring substrate.

Module equipped with a heat dissipation member

A vacuum device includes a processing target placement unit that is arranged inside a vacuum chamber and a vacuum evacuation unit that is connected to the vacuum chamber. The processing target placement unit has one main surface on which processing targets are placed and a side surface that is connected to the one main surface. The processing target placement unit is provided with a plurality of grooves that have openings at the one main surface. When the processing target placement unit is viewed from the one main surface side thereof, the smallest width of the opening of each groove in the one main surface is equal to or less than half the smallest width of the processing target.

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Kyoto, Japan

Toru Komatsu