Mitsubishi Denki Kabushiki Kaisha

Advanced Display, Inc.

Toru Kokogawa

Hayato Takasago

Atsushi Tanaka

Mitsuyuki Takada

Kenichi Niki

Kohei Adachi

Takanori Takaki

Mitsumasa Mori

Hideaki Ootsuki

A light guide plate has a hologram pattern on a light exit surface. The hologram pattern anisotropically diffuses light in the direction parallel with a light incident surface of the light guide plate. On a back surface of the light guide plate are formed mirror-polished prism structures extending parallel with the light incident surface. A downward-pointing prism sheet with a given prism apex angle is placed on the light exit surface of the light guide plate. The use of the downward-pointing prism sheet together with the light guide plate having the anisotropic diffusion hologram pattern integrally formed thereon produces a liquid crystal display device with enhanced luminance properties.

Planar light source unit and display device

A drive circuit module comprises a board formed of a hard base material having no flexibility, a circuit pattern formed on the board and having a plurality of input terminals and output terminals supported by a flexible insulation film, and a carrying section for carrying a drive LSI and the like on the circuit pattern; characterized in that the board is provided with at least one cutout on a surface opposite to the surface on which the circuit pattern of the board is formed, thereby making flexible the board in a direction in which the output terminal surface and the carrying section surface are different from each other.

Rigid circuit board for liquid crystal display including cut out for

A tape carrier for mounting and bonding an IC chip on substrate having an interconnection pattern is disclosed. The tape carrier comprises a peripheral and a central film portion made of an electrically insulating flexible material, and a set of leads carried at least one the peripheral film portion. The central portion covers the central area of the surface of the IC chip on which the bumps are formed. An aperture is formed between the peripheral and central film portion which has enough dimension to allow the leads to be bonded to the bumps of the IC chip therethrough. Some of the leads extend over the central film portion and, extending out of a side of the central film portion, reach the opposing area of the peripheral film portion across a strip of the aperture, thereby effecting electrical connection from the bumps to far-away portions of the circuitry on the substrate and between the bumps themselves. The central film portion may form an island separated from the peripheral potion by a ring-shaped aperture; alternatively, it may form a tongue-shaped appendage projecting into the aperture. The leads and the IC chip may be situated on the same surface of the film portions; alternatively, they may be situated on the opposite surfaces thereof.

Tape carrier for assembling an IC chip on a substrate

In a method of packaging a semiconductor device, the semiconductor device and a mounting body are positioned in such a manner that electrodes of the semiconductor device and leads of the mounting body are brought into slidable mechanical contact with each other, the electrodes being not bonded to the leads. Next, an insulating resin that shrinks on setting is supplied in such a manner that the contacted portions of the electrodes and the leads are covered. Subsequently, the resin is set while keeping the electrodes and the leads in contact with each other to bond the electrodes to the leads whereby the resin, when set, applies a compressive force between the electrodes and the leads.

Growing community of inventors

Kikuchi-gun, Japan

Toru Kokogawa