Murata Manufacturing Co., Ltd.

Toru Koidesawa

Tadashi Nomura

Tetsuya Oda

Hideki Shinkai

Motohiko Kusunoki

Shin Furuya

Masahiro Inoue

A circuit module () includes: a substrate () including a plurality of inner conductors (); a first electronic component arranged on one main surface (S) of the substrate (); a first resin layer () provided on the one main surface (S) and configured to seal the first electronic component; a plurality of outer electrodes (B) provided on another main surface (S) of the substrate () and including a ground electrode; a conductor film () provided at least on an outer surface of the first resin layer () and a side surface (S) of the substrate () and connected to the ground electrode with at least one of the plurality of inner conductors () interposed therebetween; and a resin film ().

Circuit module

A module includes: a substrate having a main surface and a side surface; an electronic component mounted on the main surface; a sealing resin that covers the main surface and the electronic component; and a shield film that covers a surface of the sealing resin and the side surface of the substrate. The sealing resin includes: a resin component containing an organic resin as a main component; and a granular filler containing an inorganic oxide as a main component. On a surface of the sealing resin, which is in contact with the shield film, parts of some grains of the filler are exposed from the resin component, a surface of the resin component includes a nitrogen functional group, and the shield film is formed of a metal that is a passivation metal and a transition metal or an alloy containing the metal.

Module and method for manufacturing the same

A circuit module () includes a substrate () having a plurality of internal conductors (), a first electronic component disposed on one principal surface (S) of the substrate (), a first resin layer () provided on the one principal surface (S) and sealing the first electronic component, a plurality of outer electrodes (B) provided on the other principal surface (S) of the substrate () and including a ground electrode, a conductor film () at least provided on an outer surface of the first resin layer () and a side surface (S) of the substrate () and connected to the ground electrode via at least one of the plurality of internal conductors (), and a resin film ().

Growing community of inventors

Kyoto, Japan

Toru Koidesawa