Ube Industries, Inc.

Toru Kidosaki

Tetsuji Hirano

Kenji Kawabata

Ryo Sakimoto

A polyolefin micro-porous film containing a polypropylene resin, in which a meltdown temperature of the polyolefin micro-porous film is 195&#xb0; C. to 230&#xb0; C. A weight-average molecular weight of the polypropylene resin is 500,000 to 800,000. Furthermore, a molecular weight distribution of the polypropylene resin is 7.5 to 16.

Polyolefin micro-porous film, separator film for power-storage device, and power-storage device

A first polyimide precursor solution composition contains: (A) a polyamic acid; (B) a carboxylic acid compound having at least three pairs of carboxyl groups within its molecule or an esterified product thereof; and (D) a solvent. A second polyimide precursor solution composition contains the components (A), (B), and (D) of the first polyimide precursor solution composition and additionally containing (C) a carboxylic acid compound having two pairs of carboxyl groups within its molecule or an esterified product thereof. A third polyimide precursor solution composition contains the components of the second polyimide precursor solution composition, wherein the polyamic acid (A) is a polyamic acid having a specific structure.

Polyimide precursor solution composition

A binder resin precursor solution composition for electrode containing at least (A) a polyamic acid having repeating units represented by chemical formulae (1) and (2) in a (1) to (2) molar ratio of 2:8 to 8.5:1.5 and having a tetracarboxylic acid component to diamine component molar ratio of 0.94 to 0.99, (B) a carboxylic acid compound having two pairs of carboxyl groups in the molecule thereof or an ester thereof, and (C) a solvent. 

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Chiba, Japan

Toru Kidosaki