Hewlett-packard Development Company, L.p.

Shin-etsu Chemical Co., Ltd.

Tajioma Incorporated

Toru Iijima

Munenao Hirokami

Katsuhiro Uehara

Eiichi Tajima

Rikio Sugimoto

A method for producing an ureido group-containing organosilicon compound includes the following steps (I) and (II): wherein Rrepresents an alkyl group having 1 to 10 carbon atoms or the like, Rrepresents a hydrogen atom or the like, Me represents a methyl group, m represents an integer of 1 to 3, and n represents an integer of 1 to 12, wherein Rrepresents a hydrogen atom or the like, and R, Me, m, and n represent the same meaning as described above; and

Method for producing ureido group-containing organosilicon compound

The performances of computers having various configurations are compared by putting a common load on the computers. Servers (-to-n) provide a simulator () with a common interface for accepting a processing request. The simulator () sequentially sends a processing request in which the contents of the processing is specified to each of the servers (-to-n). According to the processing requests, the servers (-to-n) perform the processings and send processing responses to the simulator (). The simulator () receives the processing responses, compiles the processing times each from the sending of a processing request to the reception of the processing responses corresponding to the processing request, the usage rates of various resources in the servers (), etc., and displays the compiled results to the user.

Load-testing device and load-testing method

A method for installing an electroconductive flooring and an electroconductive welding rod for use in this method are disclosed. The electroconductive welding rod is composed of a joint material including as the main component a thermoplastic resin composition of a ribbon-shape or a rod-shape, with the peripheral surface thereof being coated with an electroconductive coating material. The method for installing the electroconductive flooring is composed of the steps of laying flooring sheets in mutual contact and cutting joint-forming grooves, or laying the flooring sheets with spaces therebetween for the formation of the joints of the adjacent flooring sheets, softening the electroconductive welding rod, filling the softened electroconductive welding rod into the grooves or the spaces between the flooring sheets, and welding the adjacent flooring sheets to form joints, whereby the flooring sheets are electrically integrated.

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Tokyo, Japan

Toru Iijima