Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Torsten Voss

Andreas Kirbs

Heiko Brunner

Philip Hartmann

Sven Lamprecht

Carl Christian Fels

Jörg Schulze

Holger Kühnlein

Jöerg Schulze

Aylin Machmor

Mutlu-Iskender Muglali

Bernd Fröese

Ulrike Engelhardt

Frank Bayer

Bernd Fröse

Aylin Sönmez

The present invention relates to a method for etching at least one surface of a plastic substrate, the method comprising steps (A) to (C), wherein step (B) comprises a contacting with a pre-treatment composition comprising one or more than one fluorine-free surface-active compound, and step (C) comprises a contacting with an etching composition comprising one or more than one manganese species, wherein after step (B) and prior to step (C) no rinsing is applied, and the etching composition is substantially free of, preferably does not comprise, fluorine-containing surface-active compounds.

Method for etching at least one surface of a plastic substrate

The present invention relates to a method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath during a copper/copper alloy plating process, the use of such a method for controlling a plating process, a controlled process for electrolytically depositing copper/copper alloy onto a substrate utilizing the method for monitoring according to the present invention, and the use of one or more than one redox active compound for monitoring and/or determining the total amount of brighteners in the acidic copper/copper alloy plating bath.

Method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath and controlled process for plating

The present invention concerns a plating method for manufacturing of electrical contacts on a solar module wherein the wiring between silicon solar cells in a solar module is deposited by electroplating onto a conductive seed. The wiring between individual silicon solar cells comprises wiring reinforcement pillars which improve the reliability of said wiring.

Plated electrical contacts for solar modules

To be able to form a copper-zinc-tin alloy which optionally comprises at least one chalcogenide and thus forms a semiconductor without the use of toxic substances a metal plating composition for the deposition of a copper-zinc-tin alloy is disclosed, wherein said metal plating composition comprises at least one copper plating species, at lease one zinc plating species, at least one tin plating species and at least one complexing agent and further, if the alloy contains at least one chalcogen, at least one chalcogen plating species.

Metal plating composition and method for the deposition of copper&#x2014;zinc&#x2014;tin suitable for manufacturing thin film solar cell

The invention relates to electroplating additives for the deposition of a group IB metal/binary or ternary group IB-group IIIA/ternary, quaternary or pentanary group IB-group IIIA-group VIA alloy on substrates useful for thin film solar cells. The additives are thiourea compounds or derivatives which have the general formula (A): wherein Xand Xmay be the same or different and are selected from the group consisting of arylene and heteroarylene; FGand FGmay be the same or different or are selected from the group consisting of &#x2014;S(O)OH, &#x2014;S(O)OH, &#x2014;COOH, &#x2014;P(O)OH and primary, secondary and tertiary amino groups and salts and esters thereof; R is selected from the group consisting of alkylene, arylene or heteroarylene and n and m are integers from 1 to 5.

Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)&#x2014;group 13 (IIIA)&#x2014;Group 16 (VIA)

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Berlin, Germany

Torsten Voss