Globalfoundries Inc.

Torsten Schaefer

Dirk Fimmel

Hendrik Thomas Mau

Methods and systems are provided for computing IR drop, i.e., voltage drop, in a semiconductor device. The method includes generating a modeling element corresponding to the plurality of transistors. At least one of the transistors in the modeling element is replaced with a current source. The method also includes performing an IR drop analysis of the modeling element utilizing a software program to calculate the IR drop in the semiconductor device.

Systems and methods for semiconductor voltage drop analysis

A device includes a substrate and a dual port static random access memory cell. The substrate includes an N-well region, a first P-well region and a second P-well region. The first and second P-well regions are arranged on opposite sides of the N-well region and spaced apart along a width direction. The static random access memory cell includes first and second pull-up transistors that are provided in the N-well region, a first pair of pull-down transistors and a first pair of access transistors provided in the first P-well region, and a second pair of pull-down transistors and a second pair of access transistors provided in the second P-well region. Each of the first pair and the second pair of pull-down transistors includes a first pull-down transistor and a second pull-down transistor. Active regions of the first pull-down transistor and the second pull-down transistor are spaced apart along the width direction.

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Pulsnitz, Germany

Torsten Schaefer