Globalfoundries Inc.

Qimonda Ag

Torsten Maehr

Arthur Hotzel

Ralf Ziebold

Andreas Jahnke

Martin Freitag

A method includes performing a spin coating process. In the spin coating process, a first fluid is dispensed to a surface of a wafer. The method further includes performing an inspection of an edge area of the wafer. On the basis of the inspection of the edge area of the wafer, a defect analysis is performed. In the defect analysis, it is determined if the edge area of the wafer has a defect that is indicative of an insufficient coating of the surface of the wafer by the first fluid.

Methods including a processing of wafers and spin coating tool

A photomask for a lithography apparatus includes a chip pattern configured to be transferred into a resist layer on a workpiece and at least one registration mark that is configured not to be transferred into the resist layer. Mask qualification may be improved without impacting wafer level processes.

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Dresden, Germany

Torsten Maehr