Atotech Deutschland Gmbh

Torsten Küssner

Reinhard Schneider

Gonzalo Urrutia Desmaison

Bert Reents

Stefan Kretschmer

Gerd Senge

Thorsten Ross

Heribert Streup

Stephan Kenny

Wolfgang Plöse

A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.

Device and method for electrolytically treating an at least superficially electrically conducting work piece

In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with the invention serves to deposit matt layers of copper and has the additional advantageous property that the layers may also be deposited with sufficient coating thickness in very narrow bore holes at average cathode current density. For this purpose the bath contains at least one polyglycerin compound selected from the group comprising poly(1,2,3-propantriol), poly(2,3-epoxy-1-propanol) and derivatives thereof.

Copper bath and methods of depositing a matt copper coating

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Berlin, Germany

Torsten Küssner