Infineon Technologies Ag

Continental Automotive Gmbh

Benteler-Automobiltechnik Gmbh

Hochschule Für Angewandte Wissenschaften Fh Ingolstadt

Torsten Groening

Karsten Guth

Georg Borghoff

Michael Feser

Reinhold Spanke

Roman Lennart Tschirbs

Thomas Brandmeier

Thomas Nuebel

Mark Essert

Thorsten Andres

Alexander Ciliox

Paul Spannaus

Christian Steininger

Max Niesse

Markus Kohlhuber

Mario Geigenfeind

Johannes Koestner

A power semiconductor module includes one or more power semiconductor dies attached to a first main face of a substrate, a plastic housing attached to the substrate, which together with the substrate encloses the one or more power semiconductor dies, a plurality of power terminals attached to the first main face of the substrate at a first end, and extending through the plastic housing at a second end to provide a point of external electrical connection for the one or more power semiconductor dies, a potting compound embedding the one or more power semiconductor dies, the first main face of the substrate and at least part of the first end of the plurality of power terminals, and an insulative coating applied only to parts of the plurality of power terminals disposed inside the plastic housing and in contact with just air. A corresponding method of manufacture also is provided.

Power semiconductor module with partially coated power terminals and method of manufacturing thereof

A power semiconductor module includes a baseplate having a top side, an underside, and a depression formed in the baseplate. The depression extends into the baseplate proceeding from the top side. A thickness of the baseplate is locally reduced in a region of the depression. The power semiconductor module further includes a circuit carrier arranged above the depression on the top side of the baseplate such that the depression is interposed between the circuit carrier and the underside of the baseplate.

Power semiconductor module with pressed baseplate and method for producing a power semiconductor module with pressed baseplate

A die fixing method is disclosed which includes providing a substrate having a metallized surface, forming a joining material on the metallized surface and placing a die alignment member with a plurality of openings on the substrate so that portions of the joining material are exposed through the openings. The method further includes placing a plurality of dies in the openings of the die alignment member with a bottom side of each die in contact with part of the joining material and attaching the plurality of dies to the metallized surface of the substrate at an elevated temperature and pressure, the die alignment member withstanding the elevated temperature and pressure. The die alignment member is removed from the substrate after the plurality of dies are attached to the metallized surface of the substrate.

Die fixing method and apparatus

Growing community of inventors

Paderborn, Germany

Torsten Groening