Rohm Co., Ltd.

Torayuki Tsukada

Kentaro Naka

Masanori Tanimura

Kousaku Tanaka

Masaki Yoneda

Takahiro Kuriyama

Tadatoshi Miwa

Mitsuo Nonaka

A chip resistor includes a first electrode, a second electrode, a resistor portion, a first intermediate layerconnected to the first electrodeand the resistor portion, a second intermediate layerconnected to the second electrodeand the resistor portion, a coating filmcovering the first electrode, and oxides existing in the first intermediate layer. The coating filmis made of a material having a higher absorptance of a laser beam of a predetermined wavelength than that of the material forming the first electrode. The oxides are oxides of the material forming the coating film

Chip resistor, mounting structure for chip resistor, and manufacturing method for chip resistor

A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.

Chip resistor and manufacturing method thereof

A chip resistor includes a resistor element, a reinforcing member, and a pair of electrodes. The resistor element includes a first surface and a second surface opposite to the first surface. The reinforcing member is bonded to the first surface of the resistor element. The pair of electrodes are formed on the second surface of the resistor element. The resistor element is formed with a slit located between the pair of electrodes.

Chip resistor and method for manufacturing the same

A chip resistor (A) includes a chip-like resistor element (), two electrodes () spaced from each other on the bottom surface () of the resistor element, and an insulation film () between the two electrodes. Each electrode () has an overlapping portion () which overlaps the insulation film () as viewed in the vertical direction.

A chip resistor includes a metal resistor element made in the form of a chip that includes an upper surface, a lower surface, two end surfaces, and two side surfaces. Two electrodes are formed on the resistor element to be spaced from each other in a longitudinal direction of the resistor element. Each of the electrodes is formed directly on the resistor element and extends continuously from the lower surface onto the upper surface via a corresponding one of the two end surfaces.

Chip resistor and method of making the same

The chip resistor () of the present invention includes an insulating substrate () in the form of a chip, a pair of terminal electrodes () formed on both ends of the insulating substrate (), a plurality of resistor films () formed on an obverse surface of the insulating substrate () in parallel with each other between the paired terminal electrodes (), and a cover coat formed on the obverse surface of the insulating substrate () to cover the resistor films (). In the chip resistor (), one of the terminal electrodes () includes individual upper electrodes () each formed on the obverse surface of the insulating substrate () to be independently connected to a respective one of the resistor films () and a side electrode () formed on a side surface of the insulating substrate () to be connected to all the individual upper electrodes ().

Chip resistor and method for producing the same

The chip resistor () includes an insulating substrate () and a main upper electrode () formed on a main surface of the insulating substrate (). On the main surface of the insulating substrate (), a resistor film () including an end () overlapping the upper surface of main upper electrode () is formed. The resistor film () is covered by a protective coat (). An auxiliary upper electrode () is formed on the upper surface of the main upper electrode (). The auxiliary upper electrode () includes an inner end () overlapping the upper surface of the end () of the resistor film (). The protective coat () overlaps the inner end () of the auxiliary upper electrode ().

A variable chip resistor () of the present invention includes a resistor element () made of a metal plate which is in the form of a chip and has a predetermined specific resistance. Terminal electrodes () for soldering are provided at both ends of the resistor element (), and at least one adjustment hole () is formed in the resistor element () at a portion between the terminal electrodes (). An adjustment rod () is inserted into the adjustment hole () in close contact with the inner surface of the adjustment hole. The adjustment rod () is made of an electroconductive material, and its insertion depth is adjustable in the axial direction of the adjustment hole ().

Variable chip resistor

The chip resistor () of the present invention includes a pair of terminal electrodes () provided at ends of an insulating substrate () in the form of a chip, and a resistor film () formed on the upper surface of the insulating substrate () for electrical connection to the paired terminal electrodes () and formed with a trimming groove () for setting the resistance. The paired terminal electrodes () include a lower electrode () formed on the lower surface of the insulating substrate (). The lower electrode () extends up to a position directly below a narrower portion () of the resistor film () which has a relatively small width due to the formation of the trimming groove () in the resistor film ().

Chip resistor

A chip resistor includes a resistive element (), an insulation layer () formed in a back surface of the flat surface, and two electrodes () spaced from each other via the insulation layer. Each electrode () makes contact with the insulation layer (). Each electrode () has a lower surface formed with a solder layer ().

Chip resistor and manufacturing method therefor

A chip resistor (A) comprises a first insulation layer (A) covering the regions between a plurality of electrodes () on a rear surface () of a resistor (), and a second insulation layer covering a pair of side faces of the resistor (). Inadvertent adhesion of solder to an improper part of the resistor () can thereby be eliminated. A solder layer () is preferably formed on a pair of end faces () of the resistor (). In so doing, a solder fillet can be formed appropriately.

Chip resistor, process for producing the same, and frame for use therein

A method of making a chip resistor is provided. The method includes the following steps. First, a resistive element is provided on a substrate. Then, a resin layer is formed on the substrate to enclose the resistive element. Then, the substrate and the resin layer are cut in this order. To prevent the breakage of the substrate during the cutting, the resin layer has better machinability than the substrate.

Chip resistor fabrication method

A chip resistor includes a resistor element in the form of a chip, and at least two electrodes formed on the resistor element. The resistor element includes an upper surface, a lower surface, and two end surfaces extending between the upper and the lower surfaces and spaced from each other. The two electrodes are provided on the lower surface of the resistor element. Each of the end surfaces of the resistor element is formed with a conductor film integrally connected to a corresponding one of the electrodes. The conductor film is made of copper, for example, and is higher in solder-wettability than the resistor element.

Growing community of inventors

Kyoto, Japan

Torayuki Tsukada