Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Tooru Wada

Shigeaki Sakatani

Kazuma Oikawa

Takashi Tsuruta

Shinji Okada

Rikako Shono

Masaya Sumita

Hidenori Miyakawa

Daido Komyoji

Shigeki Sakaguchi

Daido Kohmyohji

A manufacturing method of a heat insulating sheet of the present disclosure includes a composite generating step of impregnating a nonwoven fiber with a basic sol prepared to generate a composite of a hydrogel-nonwoven fiber, the basic sol being prepared by adding carbonate ester to a water glass composition; and a drying step of drying a liquid contained in the composite at a temperature lower than a critical temperature of the liquid and a pressure lower than a critical pressure of the liquid to remove the liquid from the composite. A heat insulating sheet according to the present disclosure includes an aerogel and a nonwoven fiber, and has a compression rate at 0.30 MPa to 5.0 MPa of 40% or less. In an electronic device of the present disclosure, the heat insulating sheet is disposed between an electronic component and a housing. In a battery unit of the present disclosure, the heat insulating sheet is disposed between batteries. This provides a heat insulating sheet that can be used under a high load and a manufacturing method thereof, and an electronic device and a battery unit including the same.

Heat insulating sheet and method of manufacturing thereof, and electronic device and battery unit using heat insulating sheet

Used is a method for producing a thermal insulation sheet, including: composite-forming including impregnating a nonwoven fabric with a basic sol prepared by adding a carbonate ester to a water glass composition to form a hydrogel-nonwoven fabric composite; surface-modifying including mixing the composite with a silylating agent for surface modification; and drying including removing liquid contained in the composite through drying at a temperature lower than the critical temperature of the liquid under a pressure lower than the critical pressure of the liquid. Used is a thermal insulation sheet including an aerogel and a nonwoven fabric, where the thermal insulation sheet exhibits a compressibility of 40% or lower at 0.30 to 5.0 MPa.

Thermal insulation sheet and method for producing the same, and electronic device and battery unit

Heat-insulation materials that can be placed along the lines of heat sources, heat-insulation structures using the same, and processes for producing the same. A heat-insulation material, that includes: fiber sheets that each have fibers and an aerogel and that have different sizes; and at least one covering material that covers the fiber sheets, or at least one elastic material that includes the fiber sheets. The at least one covering material may include a first covering material and a second covering material.

Heat-insulation material, heat-insulation structure using same, and process for producing same

A heat-insulation material does not cause deterioration in heat-insulation performance and any loss of components included therein, and possesses an excellent radiation-preventing function. The heat-insulation material includes: a first heat-insulation layer that includes a first silica xerogel and a first radiation-preventing material; and a third heat-insulation layer that includes a third silica xerogel and second fibers, wherein the first heat-insulation layer and the third heat-insulation layer are layered. An electronic device includes the heat-insulation material. Yet further disclosed is a method for producing the heat-insulation material.

Heat-insulation material and production method thereof

An adjustment circuit including tri-state circuits is provided between a transmitter circuit and a receiver circuit. Jitter generated by transmission of a signal over a long-distance interconnect is reduced by being converted into jitter of control signals generated by a pulse generator circuit in the tri-state circuits.

Semiconductor integrated circuit for transmitting and receiving data signals in a source-synchronous scheme

A semiconductor integrated circuit according to the present invention comprises a latch circuit, a retaining circuit, and a feedback circuit, wherein the latch circuit inputs therein an input data signal, a clock signal and a feedback signal and outputs an output data signal, the retaining circuit retains the output data signal, and the feedback circuit inputs therein the input data signal and the output data signal to thereby generate the feedback signal based on logic combinations of the input data signal and the output data signal, and an internal operation of the latch circuit is turned on/off by means of the feedback signal.

Growing community of inventors

Osaka, Japan

Tooru Wada