Shin-etsu Chemical Co., Ltd.

Tooru Takamura

Noboru Shimamoto

Kunio Itoh

Ryuichi Handa

A method of producing a cover-packing assembly for a hard disk device is disclosed which comprises applying a liquid self-adhesive silicone rubber material to a predetermined position of a cover member, and curing the rubber material. According to the method, the formation of a packing member and the adhesion of the packing member to the cover member are performed simultaneously on the cover member. Thus, use of a pressure sensitive adhesive, an adhesive or the like, as in the case of employing a packing member comprising a molded or die-cut product, is unnecessary in this method, which is extremely advantageous.

Method of producing cover-packing assembly for hard disk device

Different from a conventional casing for fixed disc memory assembly constructed by conjoining two covering members at the flanges by sandwiching a gasket prepared by punching a sheet of a spongy rubber, the invention proposes a covering member in which a gasket of a solid silicone rubber is adhesively and integrally bonded to the flange thereof in advance so that the fixed disc memory assembly can be constructed with greatly improved work-ability in addition to the advantage obtained by the absence of any tiny rubber particles formed by pubching of a spongy rubber sheet as the dusts to cause serious troubles. The gasket may be shaped either by a conventional rubber molding method and bonded to the flange using a silicone-based adhesive or may be formed by the techniques of the so-called FIPG method.

Covering member for casing of fixed disc memory unit

The invention provides a novel curable epoxy resin composition suitable for resin encapsulation of various electronic devices such as transistors, ICs, LSIs and the like with high anti-moisture resistance and without causing excessive stress upon curing to the electronic devices. The resin composition comprises an epoxy resin, a curing agent such as a phenol novolac resin, a filler and a curing catalyst such as an imidazole compound as well as an organosilicon polymer represented by the general formula ##STR1## in which R is a monovalent hydrocarbon group such as methyl, Z is a divalent organic group such as ethylene and phenylene, n is a positive number of at least 10 on an average and a and b are each zero or a positive number not exceeding 1 with the proviso that a+b is in the range from 1 to 2 inclusive, in a limited amount.

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Gunma, Japan

Tooru Takamura