Mitsubishi Chemical Corporation

Tooru Kondou

Takuya Teranishi

Masahiro Ichino

Akira Oota

Mitsuru Kutsuwada

Eriko Satou

Akiko Miyagawa

An object of the present invention is to provide an acrylic resin powder suitable for hot melt adhesives which dissolves in polyol components such as polyalkylene glycols faster than conventional ones, as well as a resin composition which can be produced with lower energy than conventional ones. The object is achieved by using an acrylic resin powder comprising: a copolymer which contains a methyl methacrylate unit, wherein a volume average particle size of a primary particle is 0.1 to 10 &#x3bc;m, a volume average particle size of a secondary particle is 20 to 80 &#x3bc;m, a weight average molecular weight is 10,000 to 500,000, and the acrylic resin powder is soluble in polypropylene glycol having a weight average molecular weight of 1000 under stirring at a concentration of 10% by mass at 60&#xb0; C. for 60 minutes.

Acrylic resin powder and resin composition for hot melt adhesives, and method of producing same

A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa&#xb7;s to 20000 Pa&#xb7;s, and the minimum viscosity is 2 Pa&#xb7;s to 600 Pa&#xb7;s, the final viscosity being higher than the minimum viscosity.

Sheet-molding compound and fiber-reinforced composite material

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Chiyoda-ku, Japan

Tooru Kondou