Hitachi-kokusai Electric Inc.

Az Electronic Materials (luxembourg) S.a.r.l.

Tooru Kakuda

Hideto Tateno

Takuya Joda

Masahisa Okuno

Masamichi Kurokawa

There is provided a substrate processing method, including: (a) loading a substrate into a processing vessel having a pre-baked film containing a silazane bond; (b) heating the substrate to a first temperature and supplying a process gas to the heated substrate; and (c) heating the substrate to which the process gas has been supplied, to a second temperature which is higher than the first temperature and less than or equal to a temperature at which the pre-bake has been performed.

Substrate processing method, substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

Growing community of inventors

Toyama, Japan

Tooru Kakuda