Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Tooru Furushige

Yuji Yamamoto

Masayuki Takahashi

Koso Matsuno

Yoshifumi Takasu

Michirou Yoshino

Naomi Kishimoto

Yuta Moriyama

A device for peeling off silicon wafers, including: a supporting member that is configured to support a board-shaped member to which plural silicon wafers are bonded via an adhesive; a heating unit for heating the board-shaped member; a shifting mechanism that is configured to shift, in a horizontal direction, the supporting member relatively with respect to the heating unit; a peeling-off mechanism that is configured to peel off the silicon wafers one by one; and a container for allowing the silicon wafers, the board-shaped member and the supporting member to soak in a liquid.

Method and device for peeling off silicon wafers

A pressing mold for optical lenses, which molds a ring-zone-type diffraction lens having a plurality of concentric ring zones, the mold including: diffraction action transfer surfaces configured to form diffraction action surfaces that diffract light passing through the diffraction lens; and step transfer surfaces configured to form step surfaces that connect the adjacent diffraction action surfaces of the diffraction lens, wherein surface roughness of the step transfer surfaces is larger than surface roughness of the diffraction action transfer surfaces.

Pressing mold for optical lenses and method for manufacturing glass optical lenses

Growing community of inventors

Osaka, Japan

Tooru Furushige