Altera Corporation

Xilinx, Inc.

Other

Altera Corporaton

Tony K Ngai

Sergey Yuryevich Shumarayev

Wei-Jen Huang

Rakesh H Patel

Bruce B Pedersen

Victor Maruri

James G Schleicher

Jim Park

Eunice Y D Hao

Wayson J Lowe

James Park

David Wolk Mendel

Michael David Hutton

Peter H Alfke

Andrew Leaver

Peter J Kazarian

Arifur Rahman

Vinson Chan

Haiming Yu

Kok Heng Choe

Sammy S Cheung

Thungoc M Tran

Jennifer Wong

Tin H Lai

Henry Y Lui

Nitin Prasad

Chiakang Sung

Andy Louie Lee

David Lewis

Richard G Cliff

Joseph Huang

Bonnie I Wang

Khai Nguyen

Srinivas T Reddy

Hong Shi

Boon Jin Ang

Stephen D Brown

Alvin Y Ching

Curt Wortman

Wei Yee Koay

Zhe Li

Thow Pang Chong

Surinder Singh

John D Lam

Ket Chiew Sia

Bruce B Pederson

Hao-Yuan Howard Chou

Chin Ghee Ch'ng

Ray Ruey-Hsien Hu

Sean Woei Voon

A semiconductor die includes at least one flexible interface block. The flexible interface block includes at least one interconnect, and at least one buffer coupled to the at least one interconnect. The flexible interface block further includes a routing interface coupled to circuitry integrated in the semiconductor die, and a controller coupled to provide communication between the routing interface and the at least one buffer.

Apparatus for flexible electronic interfaces and associated methods

Integrated circuit (IC) packages with an inter-die thermal spreader are disclosed. A disclosed IC package includes a plurality of stacked dies disposed on a package substrate. A heat spreader is disposed on a top die of the plurality of stacked dies. The IC package further includes a thermal spreader layer disposed adjacent to at least one die of the plurality of stacked dies. The thermal spreader layer may extend out of a periphery of the plurality of stacked dies and may be attached to the heat spreader through a support member.

Integrated circuit package with inter-die thermal spreader layers

A first-in-first-out memory may have first and second memory banks. A write controller may write data into the first and second memory banks. In performing write operations, the write controller may determine whether to write the data into the first bank or the second bank by evaluating a first bank empty flag and a second bank empty flag. When transitioning between writing in the first bank and the second bank, the write controller may latch a write address value indicative of the last location at which valid data was written in a given bank. A read controller may read data from the first and second memory bank. The read controller may determine when to transition between reading in the first bank and reading in the second bank by comparing a current read address to the latched write address value.

First-in-first-out memory with dual memory banks

An integrated circuit in a multi-chip package is provided. The integrated circuit may include adjustable interface circuitry configured to interface with other off-chip components. In particular, the adjustable interface circuitry may include a microbump input-output buffer operable to drive signals off of the integrated circuit and operable to receive signals from other integrated circuits in the multi-chip package via a microbump. The microbump input-output buffer may include output buffers and input buffers. The output buffers may have programmable drive strengths and may each be selectively switched in and out of use depending on the desired application. Each output buffer may include a level shifter, a buffer circuit, and multiple inverter-like circuits each of which can be turned on or off to adjust the drive strength of that output buffer.

Adjustable drive strength input-output buffer circuitry

Integrated circuit (IC) packages with multiple clock sources are disclosed. A disclosed IC package includes a first die having a first clock source and a first clock tree and a second die having a second clock source and a second clock tree. The first clock source and the second clock source may be coupled to the second clock tree and the first clock tree, respectively, through a plurality of interconnects to form a clock tree network on the IC package. The clock tree network may be operable to be driven by either the first clock source or the second clock source.

Integrated circuit package with distributed clock network

A PLD comprises a substrate, an array of programmable logic elements formed in the substrate, a first columnar interface coupling to the array of logic elements and extending in the substrate substantially parallel to a first side of the substrate, and at least a second columnar interface coupling to the array of logic elements and extending in the substrate substantially parallel to the first columnar interface. The interfaces illustratively provide a plurality of interconnects, control circuits and one or more of driver circuits, rebuffering circuits, signal conditioning circuits, deskewing circuits, clock synchronization circuits, power management circuits, testing/debugging circuits, partial reconfiguration circuits, multi-plexing circuits, pipelining circuits and storage circuits. The PLD is mounted on an interposer so that its interfaces electrically couple to electrically conducting paths on the interposer.

Placement, rebuffering and routing structure for PLD interface

An integrated circuit system may include a first integrated circuit (IC), a second IC, and interface circuitry. The first IC is operable to output a parallel data stream at a first data rate. The second IC is operable to output a serialized data stream at a second date rate. The second data rate may be different than the first data rate. The interface circuitry may be coupled between the first integrated circuit and the second integrated circuit. The interface circuitry may be operable to convert the parallel data stream received from the first IC into a serialized data stream with the second data rate. The interface circuitry may be also operable to convert the serialized data stream received from the second IC to a parallel data stream with the first data rate.

Interface circuitry for an integrated circuit system

A method for determining clock uncertainties is provided. The method includes identifying clock transfer types between registers from an integrated circuit design and identifying contributors to the clock uncertainties for each of the clock transfers. The jitter associated with each identified contributor is calculated for both set-up time and hold time. This calculated jitter is incorporated into a slack calculation to determine whether timing constraints are met for a circuit design.

Method and apparatus for determining clock uncertainties

Multiplier-accumulator circuitry includes circuitry for forming a plurality of partial products of multiplier and multiplicand inputs, carry-save adder circuitry for adding together the partial products and another input to produce intermediate sum and carry outputs, final adder circuitry for adding together the intermediate sum and carry outputs to produce a final output, and feedback circuitry for applying the final output (typically after some delay, e.g., due to registration of the final output) to the carry-save adder circuitry as said another input. The above circuitry may be implemented in so-called 'hard IP' (intellectual property) of a field-programmable gate array ('FPGA') integrated circuit device. If desired, any overflow from the accumulation performed by the above circuitry may be accumulated in &#x201c;soft&#x201d; accumulator-overflow circuitry that is implemented in the general-purpose programmable logic of the FPGA.

Multiplier-accumulator circuitry and methods

A programmable logic integrated circuit device has a plurality of regions of programmable logic disposed on the device in a plurality of intersecting rows and columns of such regions. Interconnection resources (e.g., interconnection conductors, signal buffers/drivers, programmable connectors, etc.) are provided on the device for making programmable interconnections to, from, and/or between the regions. At least some of these interconnection resources are provided in two forms that are architecturally similar (e.g., with similar and substantially parallel routing) but that have significantly different signal propagation speed characteristics. For example, a major or larger portion of such dual-form interconnection resources may have what may be termed normal signal speed, while a smaller minor portion may have significantly faster signal speed. Secondary (e.g., clock and clear) signal distribution may also be enhanced, and so may be input/output circuitry and cascade connections between adjacent or nearby logic modules on the device.

Interconnection and input/output resources for programmable logic integrated circuit devices

Dual port memory array circuitry is provided that includes bit line voltage clamping circuitry. The clamping circuitry contains control transistors that are used to enable and disable the clamping circuitry. The clamping circuitry also contains voltage regulator transistors and feedback paths. When a write operation is performed on one port of the dual port memory array while a read operation is being performed on the other port of the dual port memory array, the bit line voltage clamping circuitry prevents the voltages on the read port bit lines from dropping too low. This allows the write operation to be performed rapidly, even if the memory cell being written to has been adversely affected by variations due to process, voltage, and temperature.

Dual port random-access-memory circuitry

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Saratoga, CA, United States of America

Tony K Ngai