Goertek Inc.

Tongqing Liu

Yongchun Tao

Qinglin Song

Shengli Pang

Disclosed is a condenser microphone chip, comprising: a substrate (); a diaphragm () spaced from the substrate; a curved beam () connected with the diaphragm () to anchor the diaphragm () to the substrate (); a curved beam connecting part () having a shape of a substantially circular plate. The curved beam () is arranged in the diaphragm (). The curved beam () includes a plurality of sub beams, each of the plurality of sub beams including a first sub beam portion extending in a substantially radial direction from a circumference of the curved beam connecting part (); a second sub beam portion extending in a substantially circumferential direction from an end of the first sub beam portion away from the circumference of the curved beam connecting part () and having a shape of a substantial arc; and a third sub beam portion extending in the radial direction from an end of the second sub beam portion away from the first sub beam portion and connected to the diaphragm (). The condenser microphone chip according to the present invention is high in sensitivity, low in noise, wide in frequency band, simple in manufacturing process, and high in reliability. In addition, the condenser microphone chip can be easily manufactured in mass production.

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Beijing, China

Tongqing Liu