Bitmain Technologies Limited

Tong Zou

Micree Zhan

Lei Zhang

Tao Zhou

Xin Chang

Haitang Hu

Wenjie Cheng

Yanhong Qiu

The present application relates to a chip heat dissipating structure, a chip structure, a circuit board and a supercomputing device, and the chip heat dissipating structure includes a plating layer covered on the chip, where the plating layer includes a first metal layer and a second metal layer arranged in sequence. By adding two metal layer on the top of the chip by physical sputtering, the heat sink may be soldered onto the metal layer through a solder layer, so that the heat sink is fixed to the top of the chip; the main component of the solder layer is metal tin, and the metal layer has a higher thermal conductivity than an epoxy resin material mounted on a traditional heat sink, thereby solving a problem of the heat dissipation bottleneck of a resin material in the chip, thus improving a heat dissipation effect of the chip.

Chip heat dissipating structure, chip structure, circuit board and supercomputing device

A power stage circuit and a calculation board. The power stage circuit includes an input circuit and an output circuit. The input circuit and the output circuit are electrically connected. The power stage circuit also includes a plurality of package pins. The plurality of package pins are respectively connected to the input circuit, the output circuit, and a power supply package unit.

Calculation board power stage circuit, and calculation board

A heat sink for an integrated circuit chip. The heat sink includes a base plate and a plurality of fins connected to the base plate. The base plate includes a first segment, a second segment, and a third segment that are sequentially connected; and the first segment and the third segment extend obliquely upward relative to the second segment.

Heat sink, integrated circuit chip and circuit board

Heat sink

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Beijing, China

Tong Zou