Nanyang Technological University

Zero-Error Systems Pte Ltd

Tong Lin

Joseph Sylvester Chang

Kwen Siong Chong

Tong Ge

Sivaramakrishnan Hariharakrishnan

Ne Kyaw Zwa Lwin

Jia Zhou

According to embodiments of the present invention, a circuit is provided. The circuit includes forming a first electrical device having a first region of a first conductivity type, forming a second electrical device having a second region of a second conductivity type, and electrically coupling the first region and the second region to each other, wherein one of the first and second regions is arranged to at least substantially surround the other of the first and second regions. According to further embodiments of the present invention, a method of forming a circuit is also provided.

Circuit and method of forming the same

A method of fabricating an electrical circuit assembly on a flexible substrate comprises: identifying one or more bending-sensitive elements of an electrical circuit assembly, each bending-sensitive element having a performance that varies when said bending-sensitive element is flexed; splitting said one or more bending-sensitive elements into a first portion and a second portion, wherein the first portion and the second portion are functionally equivalent and together equate to said bending-sensitive element; printing the first portion of said bending-sensitive element on a first surface of the flexible substrate; printing the second portion of said bending-sensitive element on a second surface of the flexible substrate, diametrically opposite the first portion such that bending of the flexible substrate has an opposite effect on each of the first and second portions thereby serving to substantially cancel the effect on each portion out; and electrically connecting the first portion and the second portion.

Method of fabricating an electrical circuit assembly on a flexible substrate

Growing community of inventors

Singapore, Singapore

Tong Lin