Polytronics Technology Corporation

Tong Cheng Tsai

Yi An Sha

David Shau Chew Wang

Fu Hua Chu

Pao Hsuan Chen

Chun Teng Tseng

Kuo Chang Lo

Wen Feng Lee

Chi Jen Su

Ching Han Yu

En Tien Yang

Po-Chih Shen

Chien Cheng Ho

Yu Sian Jhou

A vaporizer comprises an absorber, a heating element, and a porous cover layer. The absorber is configured to absorb a material to be vaporized. The heating element is configured to heat and vaporize the material to be vaporized in the absorber, and includes a first electrode portion, a second electrode portion, and an electrically conductive connecting member connected between the first electrode portion and the second electrode portion. The porous cover layer covers at least a portion of the heating element without covering the first and second electrode portions. A ratio of an area of the porous cover layer to an area of the electrically conductive connecting member is defined as a covering ratio, which is at least 50%. A porosity of the porous cover layer ranges from 30% to 75%.

Vaporizing apparatus and vaporizer thereof

A PTC composition comprises crystalline polymer and conductive filler. The conductive filler comprises tungsten carbide powder dispersed in the crystalline polymer, and the tungsten carbide powder comprises impurity of less than 7% by weight. The impurity comprises the materials other than tungsten monocarbide.

PTC composition and over-current protection device containing the same

An over-current protection device, which can be surface-mounted and stand upright on a circuit board and withstand 60 to 600 volts, comprises a PTC device, first and second electrodes. The PTC device is a laminated structure comprising first and second conductive layers and a PTC material layer. The first and second conductive layers are in physical contact with first and second planar surfaces of the PTC material layer, respectively. The first electrode is disposed on the first conductive layer. The second electrode is disposed on the second conductive layer and is separated from the first electrode. The first electrode, the second electrode and the PTC device commonly form an end surface which is substantially perpendicular to the first and second planar surfaces. The first electrode and the second electrode at the end surface serve as interfaces electrically connecting to the circuit board.

Over-current protection device and circuit board structure containing the same

A radial-leaded over-current protection device includes a PTC device, first and second electrode leads and an insulating encapsulation layer. The PTC device has first and a second conductive layers and a PTC material layer therebetween. The PTC material layer has a resistivity less than 0.18 &#x3a9;-cm and includes crystalline polymer and conductive ceramic filler. The ceramic filler has a resistivity less than 500 &#x3a9;-cm and is 35-65% by volume of the PTC material layer. The first electrode lead has an end connecting to the first conductive layer, whereas the second electrode lead has an end connecting to the second conductive layer. The insulating encapsulation layer wraps the PTC device and the ends of the conductive layers. The radial-leaded over-current protection device at 25&#xb0; C. has a value of hold current thereof divided by an area of the PTC device ranging from 0.027-0.3A/mm. Each electrode lead has a cross-sectional area of at least 0.16 mm.

Radial-leaded over-current protection device

An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.

Over-current protection device and method for manufacturing the same

An over-current and over-voltage protection assembly apparatus including an over-current protection (OCP) device and an over-voltage protection (OVP) device is provided. One end of the OCP device is electrically connected to a first connection point, and the other end is electrically connected to a second connection point. One end of the OVP device is electrically connected to a third connection point, and the other end is electrically connected to the second connection point. The second connection point is a common point. The OCP device and the OVP device are modularized and integrated to an assembly. The first, second, and third connection points are connected to an external circuit to be protected, such that the OCP device is connected in series to the circuit to be protected, and the OVP device is connected in parallel to the circuit to be protected.

Over-current and over-voltage protection assembly apparatus

A variable impedance composition according to one aspect of the present invention comprises a high electro-magnetic permeability powder in an amount from 10% to 85% of the weight of the variable impedance composition, and an insulation adhesive in an amount from 10% to 30% of the weight of the variable impedance composition. The incorporation of high electro-magnetic permeability powder including carbonyl metal, such as carbonyl iron or carbonyl nickel, in the variable impedance composition can not only suppress the overstress voltage, but also dampen the transient current. In contrast to the conventional electrostatic discharge (ESD) device, the relatively high electro-magnetic permeability carbonyl metal powder can reduce arcing as well as lower the trigger voltage of the device. The high electro-magnetic permeability characteristics can also absorb the undesirable electro-magnetic radiation that causes corruption of signal and loss of data.

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Tainan, Taiwan

Tong Cheng Tsai