Toray Industries, Inc.

Tomoyuki Yuba

Masao Tomikawa

Natsuko Chayama

Yoji Fujita

Ping Li

Mitsuhito Suwa

Eiichiro Tamaki

Yuki Masuda

Yasuo Kubota

Masaya Asano

Tetsuo Yamashita

Hideyuki Kobayashi

Ryuichiro Taniguchi

Jiake Jin

Yuma Sugisaki

Toshiyuki Nonaka

Yoshihiro Ishikawa

A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2): 

Resin, photosensitive resin composition, electronic component and display device using the same

A resin composition contains: (a) a resin which constitutes a polymer having a structure represented by any one of the following general formulae (1) to (3) below and/or a copolymer having the structure; and (b) a basic compound, wherein Ris a C-Corganic group, Ris a divalent C-Corganic group, X is a sulfonic group, hydroxy group, or carboxy group, p is 1 to 4, and n is 2 to 100,000; wherein Ris a C-Corganic group, Ris a divalent C-Corganic group, Y is a sulfonic group, hydroxy group, or carboxy group, q is 1 to 4, and m is 2 to 100,000; wherein Rrepresents a C-Corganic group, Ris a divalent C-Corganic group, Z is a sulfonic group, hydroxy group, or carboxy group, r is 1 to 4, and l is 2 to 100,000.

Resin composition

The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance. A polyimide solution including: (a) a resin containing 50 mol % or more, based on the total amount of the resin, of a structural unit represented by the general formula (1); and (b) a solvent. 

Polyimide solution, heat-resistant non-woven fabric, and method for manufacturing same

A method of producing a patterned substrate includes the steps of: providing, on a substrate, a coating film of a resin composition including (A) an alkali-soluble resin selected from the group consisting of polyimides, polyamideimides, polyimide precursors, polyamideimide precursors, polybenzoxazoles, polybenzoxazole precursors, copolymers of at least two of the resins, and copolymers of at least one of the resins and another structural unit, (B) a photoacid generator, and (C) at least one compound selected from the group consisting of epoxy compounds and oxetane compounds; forming a pattern of the coating film; patterning the substrate through etching using the pattern of the coating film as a mask; and removing the coating film of the resin composition.

Method for manufacturing substrate and method for manufacturing light emitting element using same

The present invention provides a negative electrode material for a lithium ion secondary battery, a composite negative electrode material for a lithium ion secondary battery, a resin composition for a lithium ion secondary battery negative electrode, and a negative electrode for a lithium ion secondary electrode, which may provide high charge/discharge capacity, and excellent initial charge-discharge characteristics and capacity retention. The surfaces of core particles of silicon of 5 nm or more and 100 nm or less in average particle size are coated with a coating layer to use a negative electrode material containing substantially no silicon oxide in the coating layer, or a composite negative electrode material for a lithium ion secondary battery, which includes the negative electrode material and a matrix material, further with the use of a polyimide resin or a precursor thereof as a bonding resin, thereby making it possible to achieve high charge/discharge capacity and excellent capacity retention, as well as high initial efficiency.

Negative electrode material for lithium ion secondary battery, composite negative electrode material for lithium ion secondary battery, resin composition for lithium ion secondary battery, negative electrode for lithium ion secondary battery, and lithium ion secondary battery

The present invention is directed to a binder for a lithium ion battery electrode, comprising a polyimide precursor having a tetracarboxylic acid residue and a diamine residue and/or a polyimide, the polyimide precursor having a residue of a tetracarboxylic dianhydride selected from those represented by the following general formulas (1) and (2) as the tetracarboxylic acid residue, and a residue of a diamine selected from those represented by the following general formulas (3) and (4) as the diamine residue, the content of the acid residue being from 0.90 to 0.95 moles based on 1 mole of the diamine residue.

Binder for lithium ion battery electrode, paste for lithium ion battery negative electrode, and method for producing lithium ion battery negative electrode

Disclosed is a method for producing polyamide, wherein a diimidazolide compound represented by the general formula (1) shown below is reacted with a diamine compound represented by the general formula (2) shown below. The present invention provides a method for producing a chlorine-free high molecular weight alkali-soluble polyamide by simple process. 

Method for producing polyamide and resin composition

The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.

Photosensitive resin composition and adhesion promoter

The present invention relates to a positive photosensitive resin precursor composition which exhibits good storage stability after exposure. A photosensitive resin precursor composition comprises (a) a polymer essentially composed of a structural unit expressed by formula (1); (b) at least two photo acid generators; and (c) a compound having an alkoxymethyl group: wherein Rrepresents an organic group with a valence of 2 to 8, having at least two carbon atoms; Rrepresents an organic group with a valence of 2 to 6, having at least two carbon atoms; Rrepresents hydrogen or an organic group having a carbon number in the range of 1 to 20; n represents a number ranging from 10 to 100,000; m represents an integer in the range of 0 to 2; and p and q represent integers in the range of 0 to 4 and satisfy p+q&#x3e;0.

Photosensitive resin precursor composition

This invention relates to a positive photosensitive resin composition allowing development with an alkaline aqueous solution and excellent in resolution, photosensitivity and pattern form even if the film formed from the resin is thick. Furthermore, this invention relates to a photosensitive resin composition comprising (a) a polymer having one or more phenolic hydroxyl groups, (b) a compound having a phenolic hydroxyl group and containing only one group selected from a methylol group and alkoxymethyl group, and (c) a photo acid generator.

Photosensitive resin composition

An actinic radiation sensitive polymer composition containing

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Otsu, Japan

Tomoyuki Yuba