Kuraray Co., Ltd.

Canon Kabushiki Kaisha

Hitachi, Ltd.

Hitachi-High-Technologies Corporation

Hitachi High-Tech Corporation

Other

Nikon Corporation

The Furukawa Electric Co., Ltd.

Jatco Corporation

Chubu Electric Power Company, Inc.

Sumitomo Chemical Company, Limited

Bridgestone Corporation

Socionext Inc.

Ishikawajima-Harima Heavy Industries Co., Ltd.

Hitachi Microcomputer Engineering, Ltd.

Tomoyuki Watanabe

Kaoru Ikeda

Shinji Tai

Hideharu Iwasaki

Takahiro Okabe

Hirokazu Ishii

Kenetsu Yokogawa

Tetsuo Ono

Minoru Nagata

Michikazu Morimoto

Yutaka Kouzuma

Masao Kato

Hiroyuki Kobayashi

Makoto Hayashi

Katsuyoshi Washio

Tohru Nakamura

Kenji Kaneko

Yasutaka Inubushi

Masamitsu Yanagihara

Hiromi Taguchi

Yasuhiko Kunii

Yutaka Okada

Nobuo Onuma

Nobuya Miyoshi

Akitoshi Yamada

Masaki Kato

Kenichi Hayashi

Hiroshi Ito

Tetsuya Suwa

Satoshi Tanaka

Masaru Izawa

Tatehito Usui

Tetsuya Watanabe

Masao Maeda

Kiichi Yamashita

Kazunori Shinoda

Naoyuki Kofuji

Atsushi Yoshinouchi

Yoshiro Udagawa

Haruhisa Masuda

Masakazu Nakaya

Yutaka Ohmoto

Makoto Furihata

Taizo Kinoshita

Takumi Tandou

Hirotoshi Tanaka

Daisuke Nohara

Kouta Isoyama

Mamoru Yakushiji

Takeyuki Igarashi

Yoshihisa Tsuji

Mie Kodani

Tatsuhiko Hayashibara

Takaharu Mitsuhashi

Naoshi Kikuchi

Hideji Goto

Jun Katoh

Noritsugu Hanazaki

Kazuhiro Nakamura

Kenji Matsubara

Kazuhiro Kurosaki

Yoshitake Shibata

Mie Kanehara

Shizuo Kondo

Nobuo Kotera

Hiroaki Namiki

Yokichi Itoh

Setsuo Ogura

Yuji Morishige

Futoshi Sasaki

Kazuo Onodera

Manabu Toguchi

Daisuke Nakagawa

Hiroyuki Shindome

Kentaro Fujino

Toru Toyabe

Yuwa Takahashi

Satoshi Sakai

Hong Zhang

Norio Anzai

Tsutomu Saitou

Kenji Shimizu

Yoshihiro Yamagishi

Tomonori Murata

Takanori Nishimura

Takashi Agatsuma

Hitoshi Nakata

Masaaki Yamanishi

Shuichi Kudo

Tsuyoshi Yamada

Katuhiro Morisuye

Katuhiro Norisuye

Katsunori Sasaki

Takaharu Kinoshita

Norifumi Ozaki

Hisanori Hayano

Miki Yamasaki

Satoru Koike

Naoki Kataoka

Takuya Matsuno

An objects detecting method for a vacuum processing apparatus equipped with: a processing unit including a vacuum container having therein a processing chamber in which a wafer is processed, and an exhaust pump that exhausts gas in the processing chamber; a vacuum transfer unit including a transfer chamber in which the wafer is transferred; and a connection pipe including a passage through which the wafer can be transferred between the processing chamber and the transfer chamber, includes: an objects collecting process of increasing an internal pressure of the transfer chamber to be higher than an internal pressure of the processing chamber to generate a gas flow in the passage from the transfer chamber toward the processing chamber, transferring the wafer to a position straddling the transfer chamber, the passage, and the processing chamber, and holding the wafer for a predetermined time; and an objects detecting process of detecting objects adhering to a surface of the wafer.

Objects detecting method for vacuum processing apparatus

A diagnosis assisting system, a diagnosis assisting method, and a diagnosis assisting program provide information that contributes to an objective diagnosis, with a server of a diagnosis assisting system including a learned model acquisition unit that acquires a plurality of learned models, each of which is generated by machine learning, inputs information based on an image obtained by imaging a diagnostic target, and outputs information that indicates a diagnosis result of the diagnostic target; an image acquisition unit that acquires an image to be analyzed; a calculation unit that performs calculation based on the plurality of learned models acquired on the image acquired, and calculates one piece of information about a diagnosis using the plurality of learned models; and an output unit that outputs the information calculated by the calculation unit.

Diagnosis assisting system, diagnosis assisting method and diagnosis assisting program

A plasma processing apparatus includes a stage disposed in a processing chamber for mounting a wafer, a plasma generation chamber disposed above the processing chamber for plasma generation using process gas, a plate member having multiple introduction holes, made of a dielectric material, disposed above the stage and between the processing chamber and the plasma generation chamber, and a lamp disposed around the plate member for heating the wafer. The plasma processing apparatus further includes an external IR light source, an emission fiber arranged in the stage, that outputs IR light from the external IR light source toward a wafer bottom, and a light collection fiber for collecting IR light from the wafer. Data obtained using only IR light from the lamp is subtracted from data obtained also using IR light from the external IR light source during heating of the wafer. Thus, a wafer temperature is determined.

Plasma processing method

In a case where a color space that is specified by a specification unit is a predetermined color space corresponding to information that is held in advance before an image processing apparatus obtains image data, even if obtained predetermined information includes color conversion information for converting the color space of the obtained image data into another color space, a conversion unit converts the color space of the obtained image data by use of the information that is held in advance before the image processing apparatus obtains the image data, without using the color conversion information that is included in the obtained predetermined information.

Image processing apparatus with pre-stored color conversion processing, and control method and storage medium thereof

To provide an information processing apparatus capable of printing a plurality of additional information without non-uniformity in a case where a plurality of images and the plurality of additional information corresponding to the respective images are arranged and printed on the same print medium, an information processing apparatus prepares a template in which image arrangement frames for arranging the plurality of images individually and an additional information arrangement frame for arranging the plurality of additional information together are laid out. The information processing apparatus arranges the plurality of images in the respective image arrangement frames and arranges the plurality of additional information in the additional information arrangement frame. At this time, the information processing apparatus sets a plurality of areas for describing the respective additional information in the additional information arrangement frame based on the amounts of description of the respective additional information.

Information processing apparatus, information processing method, and printing apparatus

Provided is a plasma processing apparatus including: a processing chamber; a sample stage placed inside the processing chamber; a processing gas supply unit which supplies processing gas into the processing chamber; a high-frequency power supply which supplies an electric field inside the processing chamber; an electrostatic chuck unit disposed on the sample stage in which openings to flow heat transfer gas are formed; a refrigerant supply unit which supplies a refrigerant inside the sample stage; and a control unit, wherein the control unit controls a heat transfer gas supply unit to control the temperature of a wafer depending on a plurality of processes for processing the wafer by switching a flow rate of the heat transfer gas or the type of the heat transfer gas flowing out of the openings between a concave portion formed in the electrostatic chuck unit and the wafer attracted to the electrostatic chuck unit.

Wafer processing method and wafer processing apparatus

A vacuum processing apparatus includes a processing chamber inside a vacuum vessel, a plasma forming chamber above, a dielectric plate member having multiple through-holes for introducing particles of plasma to the processing chamber between the processing chamber and the plasma forming chamber above a sample stage upper surface in the processing chamber, heating lamp arranged around an outer periphery of the plate member to irradiate an electromagnetic wave to the wafer to heat, and a ring-shaped window member for transmitting the electromagnetic wave from the lamp. The apparatus performs, from the through-holes to the wafer, supplying particles of plasma formed in the plasma forming chamber to form a reaction product, extinguishing the plasma and heating the wafer to desorb the product, and supplying particles, formed in the plasma forming chamber, of the plasma of cleaning gas to the plasma forming chamber, the processing chamber, and the window member.

Operation method of plasma processing apparatus

A wireless communication network system includes a first wireless communication device; and second wireless communication devices. The first wireless communication device selects a master unit from among the second wireless communication devices, on the basis of reception quality and storage battery remaining levels, and sends, to the selected master unit, a master unit request and a storage battery remaining level threshold for the master unit. The selected second wireless communication device operates as the master unit in accordance with the master unit request, and monitors the storage battery remaining level of the selected second wireless communication device on the basis of the storage battery remaining level threshold. When the storage battery remaining level of the selected second wireless communication device does not match the storage battery remaining level threshold, the selected second wireless communication device sends a master unit change request to the first wireless communication device.

Wireless communication network system, wireless communication station, wireless communication device, and battery consumption smoothing method

Light sources include light-emitting surfaces only on a condenser lens side to emit illumination light. The condenser lens and the refraction optical member are formed integrally.

Illumination lens

A plasma processing apparatus includes a metallic basic material arranged in a sample stage, a dielectric film of dielectric material disposed on an upper surface of the basic material, the dielectric film being formed through a plasma spray process; a film-shaped heater disposed in the dielectric film, the heater being formed through a plasma spray process; an adhesive layer arranged on the dielectric film; a sintered ceramic plate having a thickness ranging from about 0.2 mm to about 0.4 mm, the sintered ceramic plate being adhered onto the dielectric film by the adhesive layer; a sensor disposed in the basic material for sensing a temperature; and a controller for receiving an output from the sensor and adjusting quantity of heat generated by the heater.

Plasma processing apparatus and sample stage

A shaped article including a modified ethylene-vinyl alcohol copolymer (C), wherein the modified ethylene-vinyl alcohol copolymer (C) is a product obtained by modifying an unmodified ethylene-vinyl alcohol copolymer (A) with an epoxy compound (B) having a double bond and has a degree of modification with the epoxy compound (B) of 0.1 to 10 mol % based on the monomer units of the ethylene-vinyl alcohol copolymer (A), and at least a part of the modified ethylene-vinyl alcohol copolymer (C) is crosslinked, and the gel fraction of the shaped article is 3% by weight or more. Thereby, a shaped article which contains almost no harmful crosslinking agent and which is excellent in hot water resistance, heat resistance and a gas barrier property is provided.

Molded article and method for production thereof

Laminates in which a layer of a polar resin (C) is laminated with a layer of a polyolefin (D) or a recovered resin (E) via a layer of an adhesive resin composition (A), including an ethylene-vinyl alcohol copolymer, the adhesive resin composition (A) is produced by mixing a resin having an unsaturated carboxylic acid anhydride or derivative thereof (a1) with a ring-opening polymer or condensation polymer (a2) having a hydroxyl group or an amino group at both ends or at one end; or partially grafting the (a2) with the (a1).

Adhesive resin composition, and laminate using the same

A plasma etching method that can improve an etching selection ratio of a film to be etched to a film different from the film to be etched compared with the related art is provided. The present invention provides a plasma etching method for selectively etching a film to be etched against a film different from the film to be etched, in which plasma etching of the film to be etched is performed using a gas that can cause to generate a deposited film containing similar components as components of the different film.

Plasma etching method

A compatibilizer contains a polymer (A) obtained by reacting a modified olefin-based polymer (a-1) with a polymer (a-2) containing a terminal functional group, wherein the modified olefin-based polymer (a-1) is a polymer modified with from 0.01 to 2 mass % of unsaturated carboxylic acid or a derivative thereof, and the polymer (a-2) is a ring opening polymer or condensation polymer containing a terminal functional group, capable of reacting with the modified olefin-based polymer (a-1), at both ends or one end thereof and has a number average molecular weight from 1,500 to 100,000. This provides an excellent compatibilizer. Particularly, upon melt processing a recovery of a multilayer structure including an EVOH layer and a thermoplastic resin layer, a recycling agent is provided that gives sufficient improvement effects to any of the adhesion of a degraded resin to a screw of a molding machine, the generation of die build-up, the generation of fish eyes, and the decrease in transparency.

Compatibilizer and method for producing same

Growing community of inventors

Tokyo, Japan

Tomoyuki Watanabe