Denso Wave Corporation

Denso Corporation

Tomoyuki Nanami

Toshihiro Miyake

Yoshitaro Yazaki

Tomohiro Yokochi

Makoto Totani

Katsuaki Kojima

Takehito Teramae

Hiroyasu Iwama

Kenzo Hirano

A central air-conditioning system conditions a house having a plurality of rooms. When a person is not present in any of the rooms, each room is conditioned in energy-saving conditioning mode having a low load. On the other hand, when the person is detected in any of the rooms, a controller switches an operating mode for conditioning the room, in which the person is detected, from the energy-saving conditioning to rapid conditioning. Air-conditioner ducts respectively connected to the remaining rooms are closed. Therefore, cold air or warm air from an air-conditioning unit is supplied to the room in which the person is detected, while the cold air or warm air is not supplied to the rooms in which the person is not present. As a result, the room that has been switched from energy-saving conditioning to rapid conditioning is conditioned in a concentrated manner.

Central air-conditioning system

Regarding rooms other than a room being targeted, a controller controls the rooms in energy-saving conditioning mode when a person is not detected in the rooms, even when the rooms are scheduled to be controlled in ordinary conditioning mode in a temperature control schedule. At this time, when the controller judges that the person has exited the room, the controller controls the targeted room in energy-saving conditioning mode, in rapid conditioning mode. As a result, the room is rapidly conditioned such that the temperature changes from an energy-saving temperature t to an ordinary set temperature by the time the person who has exited the room enters the room. As a result, unnecessary conditioning of the room set to be conditioning in ordinary conditioning mode can be reduced, and energy consumption can be reduced. In addition, comfort of the person entering the room can be ensured by prediction of the movement of the person.

In interconnecting printed circuit boards: preparing a first and second printed circuit board is accomplished with the first having an insulating substrate of thermoplastic resin and a conductive pattern with a land, while the second has a conductive pattern with a land; overlapping the land of the first with the land of the second is done to form an interconnection portion; and heating the interconnection portion at a temperature approximately higher than a glass transition temperature of the thermoplastic resin while applying pressure to the interconnection portion to create an electrical interconnection sealed with a part of the thermoplastic resin constituting the insulating substrate of the first board is accomplished. The insulating substrate of the first board is overlapped with an insulating substrate of the second printed board to interpose a film, the film including material to reduce a modulus of elasticity of the insulating substrate of the first board.

Method for interconnecting printed circuit boards and interconnection structure

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Kariya, Japan

Tomoyuki Nanami