Shin-etsu Chemical Co., Ltd.

Tomoyuki Mizunashi

Takayuki Kusunoki

Yuusuke Takamizawa

Tsutomu Kashiwagi

Hiroyuki Iguchi

Kinya Kodama

A curable silicone resin composition contains the following components (A) to (D): (A) an organopolysiloxane having two or more and less than six alkenyl groups per molecule each having 2 to 10 carbon atoms; (B) an organopolysiloxane shown by the following formula (1); (C) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule, and contained such that the component (C) has a hydrosilyl group in an amount of 0.1 to 4.0 mol per mol of all alkenyl groups bonded to silicon atoms in the curable silicone resin composition; and (D) a platinum group metal-based catalyst. The component (B) is in an amount of 0.1 to 50 mass % relative to a total mass of the components (A) and (B). This invention provides a curable silicone resin composition for forming a silicone resin cured product excellent in mechanical properties, shock absorption, and transparency.

Curable silicone resin composition and cured product thereof

The present invention provides a silylated isocyanurate compound shown by the following general formula (1), where R's each independently represent a hydrogen atom, or a substituent selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and a group shown by a general formula (2-a) or (2-b). At least one R is shown by the general formula (2-b). The silylated isocyanurate compound can serve as a metal corrosion inhibitor excellent in heat resistance and sulfurization resistance.

Silylated isocyanurate compound, metal corrosion inhibitor, curable organosilicon resin composition, and semiconductor apparatus

An addition-curable silicone resin composition which exhibits good adhesion to a substrate and has good compatibility with an inorganic filler, as well as a cured product thereof and a highly reliable semiconductor device encapsulated with the cured product, are provided. The addition-curable silicone resin composition includes (A) a linear or branched organopolysiloxane having at least one alkenyl group, said organopolysiloxane comprising at least one unit selected from RRSiOand RRSiOunits, and at least one unit selected from RSiO, RSiOand RSiOunits, wherein a percentage of a total number of the RRSiOand RRSiOunits, relative to a total number of all siloxane units, is from 0.001% to 50%, and wherein Ris, independently at each occurrence, a hydroxy group or an alkoxy group of 1 to 30 carbon atoms; Ris, independently at each occurrence, a group selected from a substituted or unsubstituted saturated hydrocarbon group of 1 to 12 carbon atoms, a substituted or unsubstituted aromatic hydrocarbon group of 6 to 12 carbon atoms, an alkenyl group of 2 to 10 carbon atoms, and the groups as defined for R; and Ris a groups selected from the groups as defined for Rother than those as defined for R, with the proviso that at least one of Rand Ris an alkenyl group; (B) an organohydrogenpolysiloxane having at least two hydrosilyl groups, in an amount such that the ratio of the number of hydrosilyl groups in component (B) to a total number of alkenyl groups in component (A) is from 0.1 to 4; and (C) a catalytic amount of a hydrosilylation catalyst.

Addition-curable silicone resin composition and a semiconductor device

A curable organosilicon resin composition is provided comprising (A) an organopolysiloxane of block polymer structure consisting of 30 to 80 mol % of RSiO, 10 to 70 mol % of (R)SiOand 0 to 30 mol % of (R)SiOunits, having Mw of 5,000-100,000, and containing at least a part of the (R)SiOunit having an average number of 3 to 80 repetitions, at least two silicon-bonded alkenyl groups per molecule, 0.001 to 1.0 mol/100 g of silicon-bonded hydroxyl groups, and up to 1.0 mol/100 g of silicon-bonded alkoxy groups, (B) an organohydrogenpolysiloxane containing at least two SiH groups and at least one silicon-bonded aryl group per molecule, and (C) a hydrosilylation catalyst.

Curable organosilicon resin composition and semiconductor device

The present invention provides a curable organosilicon resin composition showing excellent optical transparency, curability, heat resistance and light resistance. The present invention also provides a semiconductor device encapsulated with a cured product of such a composition. According to the invention, the curable organopolysiloxane composition comprises: wherein Ris, independently at each occurrence, a monovalent hydrocarbon group having 1 to 10 carbon atoms, and Ris a divalent aromatic group having 6 to 50 carbon atoms and optionally comprising a silylene group or a siloxane linkage, and 10 to 90 mol % of RSiOunit, the organopolysiloxane having a weight average molecular weight (Mw) of from 2,000 to 100,000, as determined by gel permeation chromatography relative to polystyrene standards, and a ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn) of at least 1.5; and

Curable organopolysiloxane composition

One of the purposes of the present invention is to provide a condensation-curable silicone resin composition which show a less increase of the viscosity during handling and cures quickly to provide a cured product which has a very small amount of a remaining catalyst and which has high heat resistance and high light resistance. Thus, the present invention is to provide a condensation-curable silicone composition comprising the following components (A) to (C): (A) 100 parts by mass of an organopolysiloxane which has a branched or network structure and has two or more hydrolyzable groups each bonded to a silicon atom and at least one of (RSiO) and (SiO) units, wherein Ris, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms, (B) 5 to 500 parts by mass of a linear organopolysiloxane having at least one hydrolyzable group bonded to a silicon atom at each of both terminals, and (C) at least one silazane compound represented by the following general formula (3) or (5) or comprising the following units (6) in an amount of 0.02 to 30 parts by mass, relative to total 100 parts by mass of components (A) and (B): 

Condensation-curable silicone resin composition

Provided is an addition-curable organopolysiloxane resin composition capable of forming a cured product having a superior transparency, heat resistance and light resistance. The addition-curable organopolysiloxane resin composition contains:

Addition-curable organopolysiloxane resin composition, cured product thereof, and semiconductor device having the cured product

A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an RSiOunit, 30 to 80 mol % of an (R)SiOunit, and 1 to 30 mol % of an (R)SiOunit. At least a part of the (R)SiOunit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

Curable organosilicon resin composition

A curable silicone resin composition including: (A) an organopolysiloxane having at least two alkenyl groups per molecule, each bonded to a silicone atom and showing a viscosity of 10 to 1,000,000 mPa&#xb7;s at 25 degrees C., and (B) an organopolysiloxane having a resin structure composed of 10 to 80 mol % of SiOunit, 0.1 to 80 mol % of (R)SiOunit and 1 to 60 mol % of (R)SiOunit and having a weight average molecular weight of 1,000 to 10,000. Rrepresents an alkenyl group having 2 to 8 carbon atoms, or a substituted or unsubstituted, monovalent hydrocarbon group having no aliphatic unsaturated group, and Rrepresents, independently of each other, an alkenyl group having 2 to 8 carbon atoms, or a substituted or unsubstituted, monovalent hydrocarbon group having no aliphatic unsaturated group, provided that at least one among all of Ris an alkenyl group.

Curable silicone resin composition

The present invention provides an adhesion promoter for promoting adhesiveness of a cured product of an addition curable organopolysiloxane resin composition, the adhesion promoter comprising at least one alkoxy group bonded to a silicon atom, and at least one cyano group-containing organic group bonded to a silicon atom in one molecule. There can be provided an adhesion promoter which can make a cured product of an addition curable organopolysiloxane resin composition excellent in heat resistance, workability, adhesiveness, and gas barrier property by adding it to the composition.

Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatus

An organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule is novel. Also provided is an addition curable silicone composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule, and (C) a hydrosilylation catalyst.

Hydrosilyl-containing organopolysiloxane, making method, addition curable silicone composition, and semiconductor package

The present invention provides a nanoparticle of an inorganic oxide particle being surface-treated, wherein: a primary particle size of the nanoparticle measured by a dynamic light scattering method is 8 nm or more and 30 nm or less, and the inorganic oxide particle is surface-treated in such a way that alkoxy groups having 1 to 10 carbon atoms are contained in a range of 0.001 to 0.5 mol/100 g. The inventive nanoparticle, being added to a silicone resin composition, enables the cured product thereof to possess excellent mechanical properties, transparency, crack resistance, heat resistance, and gas barrier properties, and enables the composition to have low viscosity and good workability even after the addition of the nanoparticle.

Nanoparticle, method for producing nanoparticle, addition curing silicone resin composition, and semiconductor apparatus

A silicone resin composition for sealing an optical semiconductor element includes (A) (A-1) an organopolysiloxane having a resin structure which contains at least two alkenyl groups in one molecule, the alkenyl groups being present at 10 to 70 mol % of the total substituent groups bonded to silicon atoms, (B) an organopolysiloxane oligomer having at least two alkenyl groups in one molecule and 2 to 5 silicon atoms, (C) an organohydrogenpolysiloxane which contains at least one hydrosilyl group and may have an alkoxy group or hydroxyl group in one molecule, and (D) an addition reaction catalyst, and is capable of providing a transparent cured product.

Silicone resin composition for sealing optical semiconductor element and optical semiconductor device

The invention provides a curable silicone resin composition comprising: (A) an organopolysiloxane containing an aromatic group having two or more alkenyl groups, and having a viscosity at 25&#xb0; C. of 10 to 1,000,000 mPa&#xb7;s, (B) an organopolysiloxane having a resin structure, comprising 10 to 80 mol % of a SiOunit, 1 to 80 mol % of a (R)SiOunit, and 1 to 60 mol % of a (R)SiOunit, and containing a SiOH group in a range of 0.1 to 5.0 mol %, (C) an organohydrogenpolysiloxane having two or more SiH group, and among whole substituents bonded to the silicon atom, 20 to 80 mol % is a phenyl group, and a SiOunit is less than 5 mol %, and (D) a platinum group metal catalyst, and the component (B) is contained in an amount of 20 to 80% by mass based on a sum of the component (A) and the component (B).

Growing community of inventors

Annaka, Japan

Tomoyuki Mizunashi