Murata Manufacturing Co., Ltd.

Tomoyuki Maeda

Hideaki Matsushima

Mitsuru Odahara

Mitsuru Ueda

A chip-type coil component capable of reducing the resistance of the coil while minimizing a decrease in the inductance of the coil includes magnetic layers composed of a multilayer body. The chip-type coil component further includes internal electrodes laminated on the magnetic layers. The internal electrodes are connected to each other to form a coil. The chip-type coil component further includes an auxiliary internal electrode laminated on each of the magnetic layers. Each auxiliary internal electrode is connected in parallel to the internal electrode laminated on the magnetic layer that is different from the magnetic layer on which the auxiliary internal electrode is laminated.

Chip-type coil component

A multilayered electronic component that is easy to manufacture and that has excellent electrical characteristics includes end portions of coil wiring patterns that oppose a coil connection electrode that is displaced on the surface of a second ceramic layer due to an increase or decrease in the number of first ceramic layers. A coil connection electrode has a shape in which surface portions of second ceramic layers or opposed second ceramic layers having the first ceramic layers disposed in between are connected to the end portions of the coil wiring patterns that oppose the respective coil connection electrode, which are displaced due to the increase or decrease in the number of the first ceramic layers. A connection wiring pattern has a shape in which one portion of a coil connection electrode is connected to one portion of an external extension electrode connection pattern.

Method of manufacturing multilayered electronic component

A multilayer coil component is constructed such that inductance can be finely adjusted and the coupling between two helical coils can be strengthened without increasing the types of patterns of coil conductors. Coil conductors of a first coil unit are connected to each other in series via via-hole conductors so as to form a first helical coil. Coil conductors of a second coil unit are connected to each other in series via via-hole conductors so as to form a second helical coil. The first and second helical coils are coaxially positioned, have different numbers of turns, and are electrically connected to each other in parallel. The sum of turns of the coil conductors facing each other at a portion where the first coil unit and the second coil unit are adjacent to each other is larger than the sum of turns of the coil conductors positioned on both outer sides in the coil axis direction of the first and second helical coils.

Multilayer coil component

A multilayer coil component is formed such that ceramic green sheets having coil conductors and via hole conductors are laminated. The multilayer coil component includes therein a spiral coil in which the coil conductors are connected in series through the via hole conductors. In plan view in a lamination direction, the via hole conductors are located in positions spaced toward the outer side of the spiral coil, the positions being located near end surfaces in a long side direction of a multilayer body.

Multilayered electronic component

A laminated coil array includes a laminate including a plurality of ceramic layers and a plurality of internal conductors disposed one on top of another, at least three coil conductors defined by electrically connecting internal conductors of the plurality of internal conductors and arranged in line inside the laminate, and external electrodes disposed on a surface of the laminate and electrically connected to end portions of the at least three spiral coil conductors, respectively. In the coil conductors not located on both end portions in the arrangement direction of the coil conductors, the internal conductors are arranged so as to be partially reversed.

Growing community of inventors

Yasu, Japan

Tomoyuki Maeda