Hamamatsu-Photonics K.k.

Tomoyuki Ide

Daiki Suzuki

Yuki Morinaga

Mikito Takahashi

Takahiro Matsumoto

A mirror device manufacturing method includes a forming step of forming a structure by forming a base portion, a movable portion, and a coupling portion coupling the base portion and the movable portion to each other such that the movable portion is able to swing with respect to the base portion through processing of a wafer, and forming a mirror layer in the movable portion; and a collecting step of performing collection of foreign substances from the structure using a collection member after the forming step. A mirror unit manufacturing method includes a sealing step of sealing the mirror device after the collecting step.

Mirror device manufacturing method and mirror unit manufacturing method

An optical module includes a mirror unit, a magnet unit, and a package including a recess. The magnet unit includes a first magnet and a second magnet. The recess includes a base wall portion to which an upper surface of the magnet unit is fixed, and a side wall portion facing a side surface of the magnet unit. The mirror unit is disposed on a second surface on an opposite side of the base wall portion from a first surface to which the magnet unit is fixed. A second upper surface of the second magnet is located closer to the lower side than a first upper surface of the first magnet. The magnet unit is fixed to the base wall portion by an adhesive material disposed at least between the first surface of the base wall portion and the second upper surface of the second magnet.

Optical module

A method for manufacturing a mirror device, the method includes a first step of preparing a wafer having a support layer and a device layer; a second step of forming a slit in the wafer such that the movable portion becomes movable with respect to the base portion by removing a part of each of the support layer and the device layer from the wafer by etching and forming a plurality of parts each corresponding to the structure in the wafer, after the first step; a third step of performing wet cleaning for cleaning the wafer using a cleaning liquid after the second step; and a fourth step of cutting out each of the plurality of parts from the wafer after the third step. In the second step, a circulation hole penetrating the wafer is formed at a part other than the slit in the wafer by the etching.

Method of manufacturing mirror device

A mirror unit includes a light scanning device and a package. The package has a main body portion provided with a light incident opening that opens on one side in a predetermined direction, a protrusion provided on a top surface of the main body portion, and a flat plate-shaped window member disposed on the top surface on an inward side of the protrusion and covering the light incident opening. An end surface of the protrusion on the one side is positioned more to the one side than the window member. A thickness of the protrusion is smaller than a height of the protrusion from the top surface. When viewed in any direction perpendicular to the predetermined direction, a length of a part covered by the protrusion in the window member is longer than a length of a part exposed from the protrusion in the window member.

Mirror unit

A method for manufacturing a mirror device, the method includes a first step of preparing a wafer having a support layer, a device layer, and an intermediate layer; a second step of forming a slit in the wafer such that the movable portion becomes movable with respect to the base portion by removing a part of each of the support layer, the device layer, and the intermediate layer from the wafer and forming a plurality of parts each corresponding to the structure in the wafer, after the first step; a third step of performing wet cleaning using a cleaning liquid after the second step; and a fourth step of cutting out each of the plurality of parts from the wafer after the third step. In the second step, a part of the intermediate layer is removed from the wafer by anisotropic etching.

Method for manufacturing mirror device

In a mirror unit, a first wall portion is higher than a second wall portion. A window member is disposed on a top surface of the first wall portion and a top surface of the second wall portion and is inclined with respect to a mirror surface. When any one of first to fourth wall portions is set as a first reference wall portion, in a cross-section perpendicular to the first reference wall portion, a first line passing through a first end at a side of the first reference wall portion in the mirror surface and a first corner portion formed at the side of the first reference wall portion by an outer surface and a first side surface in the window member intersects the first wall portion. A wiring portion includes a portion extending inside a base and leads outside a frame member.

A mirror unit includes an optical scanning device, a frame member, and a window member. The frame member includes first and second wall portions facing each other in an X-axis direction. The first wall portion is higher than the second wall portion. The window member is disposed on a top surface of the first wall portion and a top surface of the second wall portion and is inclined with respect to a mirror surface of the optical scanning device. In a cross-section parallel to the X-axis direction, the first wall portion is separated from a first line passing through a first end at a side of the first wall portion in the mirror surface and a first corner portion formed at the side of the first wall portion by an outer surface opposite to the frame member and a first side surface in the window member.

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Hamamatsu, Japan

Tomoyuki Ide