Denso Corporation

Tomoyuki Hiramatsu

Koji Kondo

Yoshinori Hayashi

Yasuaki Matsunaga

Masayuki Aoyama

Hisashi Hasegawa

Naoyuki Akita

A X-ray inspection device for inspecting a solder connection portion between a circuit device having a solder ball and a printed circuit board having a land includes: X-ray irradiating means for irradiating X-ray to the solder connection portion between the solder ball and the land; X-ray detecting means for detecting the X-ray transmitted through the solder connection portion and for outputting a detection signal; and image forming means for forming and outputting a horizontal tomographic image of the solder connection portion on the basis of the detection signal. The horizontal tomographic image shows existence or nonexistence of a solder bump disposed on a side of the land.

X-ray inspection device and X-ray inspection method

In an electronic-component mounting structure, an electronic component (,) has a surface. First electrodes (,) provided on the surface of the electronic component (,) are arranged in a first array. Second electrodes (,) provided on a base board (,) are arranged in a second array corresponding to the first array. The second electrodes (,) correspond to the first electrodes (,) respectively. Solder bumps (,) connect the first electrodes (,) and the second electrodes (,) respectively. The first electrodes (,) include first outermost electrodes (,) located in an outer area of the first array. The second electrodes (,) include second outermost electrodes (,) located in an outer area of the second array. The second outermost electrodes (,) correspond to the first outermost electrodes (,) respectively. An outer edge (X,, Z,) of each of the second outermost electrodes (,) extends outward of an outer edge (Y,) of a corresponding first outermost electrode (,) with respect to the first and second arrays. A distance between an outer edge (X,, Z,) of each of the second outermost electrodes (,) and an outer edge (Y,) of a corresponding first outermost electrode (,) is greater than a distance between an inner edge (X,, Z,) of the second outermost electrode (,) and an inner edge (Y,) of the corresponding first outermost electrode (,) with respect to the first and second arrays.

Electronic-component mounting structure

Growing community of inventors

Chiryu, Japan

Tomoyuki Hiramatsu