Omron Corporation

Tomoyuki Hakata

Kazuyoshi Nishikawa

Satoshi Hirono

Akio Sumiya

Eiji Teramoto

Hitoshi Nakano

Junya Mishima

Hiroshige Uematsu

A heat-dissipating structure includes a board configured to be attached to a heating element, a resin layer provided between the board and a heat dissipation member, the resin layer being attached to the board, and at least one heat transfer portion configured to transfer heat generated by the heating element to the heat dissipation member through the resin layer. The at least one heat transfer portion includes a heat transfer member, which is plate-shaped, provided between the board and the resin layer, the heat transfer member extending along the board, and a conductive layer provided between the board and the resin layer and across the board and the heat transfer member, the conductive layer being partially disposed between the heat transfer member and the resin layer.

Heat-dissipating structure

Provided is a crimp structure in which an inner member and an outer member that is arranged outside the inner member are joined to each other. The inner member includes: an insertion portion having a columnar surface-like outer circumferential surface; and a recessed portion provided in the outer circumferential surface. The outer member includes: a cylindrical portion that forms an opening into which the insertion portion is inserted; a reduced-diameter portion that is formed in the cylindrical portion, and has a plastically deformed shape such that a diameter of the cylindrical portion is reduced annularly inward in a radial direction; and a protruding portion that has a plastically deformed shape such that a part, in a circumferential direction, of the reduced-diameter portion has entered the recessed portion. Relative rotation of the inner member and the outer member can be suppressed.

Crimp structure, crimping method, and electronic device

A bonding structure manufacturing method for manufacturing a bonding structure in which a first member and a second member are bonded is provided with: a step for forming a perforation with an opening in the surface of the first member and forming a protrusion that protrudes into the inner circumferential surface of the perforation; a step for disposing the region of the first member where the perforation is formed adjacent to the second member; and step for filling and curing the second member in the perforation of the first member by irradiating a laser on the region of the first member where the perforation is formed from the second member side.

Manufacturing method of bonding structure and bonding structure

A bonded structure is made of a first member and a second member which are bonded to each other. At least one bore having an opening is formed in a surface of the first member, and the second member is filled in the bore of the first member. The bore is defined by a diameter-increasing portion whose opening size increases in a depth direction from a surface side toward a bottom of the first member, and a first diameter-decreasing portion whose opening size decreases in the depth direction from the surface side toward the bottom. The diameter-increasing portion is formed on the surface side, and the first diameter-decreasing portion is formed on a bottom side.

Bonded structure and method for producing bonded structure

Provided is a crimp structure in which an inner member and an outer member are joined to each other. The inner member includes an insertion portion having a columnar outer circumferential surface, and an annular groove provided in the outer circumferential surface. The outer member includes a main body portion, and a cylindrical portion continuous with the main body portion and forming an opening into which the insertion portion is inserted. The cylindrical portion includes a first reduced-diameter portion continuous with the main body portion via a first plastically-deformed portion and located further inward in a radial direction than the main body portion, and a second reduced-diameter portion continuous with the first reduced-diameter portion via a second plastically-deformed portion and located further inward in the radial direction than the first reduced-diameter portion. At least a part of the second reduced-diameter portion has entered the annular groove.

Growing community of inventors

Uji, Japan

Tomoyuki Hakata