Nissan Chemical Industries Limited

Nissan Chemical Corporation

Hoya Corporation

Tomoyuki Enomoto

Mamoru Tamura

Takahiro Sakaguchi

Takuya Ohashi

Rikimaru Sakamoto

Takahiro Kishioka

Hiroshi Ogino

Tetsuya Shinjo

Keisuke Nakayama

Kazuhiro Sawada

Masaki Nagai

Masahiro Hashimoto

Tadashi Hatanaka

Yasuo Kawamura

Shigeo Kimura

Shunsuke Moriya

Ken-ichi Mizusawa

Makoto Nakajima

Yoshiomi Hiroi

Satoshi Takei

Masakazu Kato

Satoshi Kamibayashi

Tetsuo Sato

Takahiro Hamada

An adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the adhesive including a component (A) that is cured by a hydrosilylation reaction and a component (B) containing a phenyl group-containing polyorganosiloxane, wherein a ratio in % by mass of the component (A) to the component (B) is 95:5 to 30:70. A separation method including applying the adhesive onto a first body to form an adhesion layer, attaching a second body to the adhesion layer, heating the adhesion layer from a side of the first body to cure the adhesive to form a layered body, processing the layered body, and carrying out separation between the adhesion layer, and the first and second bodies. The processing may be polishing the rear surface of the wafer.

Temporary adhesive containing phenyl group-containing polysiloxane

An adhesive can be easily peeled off after polishing the back face of a wafer, which has heat resistance and can be easily washed off. An adhesive for peelably adhering between a support and a circuit-bearing face of a wafer and thereby processing a back face of the wafer, a peeling face upon peeling becomes selectable according to heating from the support side or wafer side when the adhesive is cured. The adhesive includes a component (A) curing by hydrosilylation reaction and a component (B) containing a polydimethylsiloxane. A peeling method including forming an adhesion layer by applying the adhesive to a surface of a first substrate, bonding a surface of a second substrate to the adhesion layer, curing the adhesion layer by heating from the first substrate side to form a laminate, processing the laminate, and peeling off between the first substrate and the adhesion layer.

Adhesive containing polydimethyl siloxane

A temporary adhesive is good peelability, heat resistance and cleaning removability after polishing of the rear surface of the wafer. A layered body for processing a rear surface of a wafer opposite to a circuit surface of the wafer, the layered body being a temporary adhesive loaded between a support and circuit surface of the wafer and including an adhesive layer (A) that includes a polyorganosiloxane to be cured by a hydrosilylation reaction and is releasably bonded, and a separation layer (B) includes a polyorganosiloxane and is releasably bonded, in which the polyorganosiloxane forming the separation layer (B) is a polyorganosiloxane containing a siloxane unit of RRSiO(provided that each R is bonded to a silicon atom as a Si&#x2014;C bond), and at least one R is an aralkyl group, epoxy group, or phenyl group. Methods for producing and separating these layered bodies and composition for forming the separation layer.

Layered body of temporary adhesive

A novel photocurable resin composition including: a polymer with a weight average molecular weight of 1,000 to 50,000, the polymer having a structural unit of formula (1), and having a structure of formula (2) at an end: wherein X is a Calkyl group, vinyl group, allyl group, or glycidyl group; m and n are each independently 0 or 1; Q is a divalent hydrocarbon group having a carbon atom number of 1 to 16; Z is a divalent linking group having a carbon atom number of 1 to 4, wherein the divalent linking group is attached to the &#x2014;O&#x2014; group in formula (1); and Ris a hydrogen atom or methyl group; a radical photopolymerization initiator; and a solvent. 

Photocurable resin composition

A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A), (wherein X is a Calkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent Chydrocarbon group, Z is a divalent Clinking group, the divalent linking group being bonded to an &#x2014;O&#x2014; group in formula (1), and Ris a hydrogen atom or a methyl group.)

Photosensitive adhesive composition

There is provided a film-forming composition for forming a film that covers a substrate and exhibits good electrical insulation properties, heat resistance, and solvent resistance after heating at a low temperature. A film-forming composition including a polymer (A) containing a unit structure of Formula (1): (wherein Tis an arylene group or a combination of an arylene group with T, Tis an alkylene group, a fluorinated alkylene group, a carbonyl group, a sulfonyl group, or a combination thereof, Ris a carboxyl group, an amino group, or an imino group, and n1 is an integer of 1 to 6), and a compound (B) having at least two isocyanate groups or blocked isocyanate groups. The polymer (A) is a polymer containing a unit structure of Formula (1) or a structure (A-1) having a combination of the unit structure of Formula (1) with a unit structure of Formula (2): 

Film-forming composition including thermosetting resin

A photosensitive resin composition comprises a polymer having a repeating structural unit of the following Formula (1): (wherein Rand Rare each independently a single bond, a methylene group, or an ethylene group, Y is an alkylene group of Formula (2) or a combination of the alkylene group of Formula (2) with an alkylene group of Formula (3), n is an integer of 1 to 110, and X is a divalent aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, or a divalent aromatic hydrocarbon group) and a (meth)acryloyl group at both ends, a bifunctional (meth)acrylate compound, a polyfunctional thiol compound, a photo-radical generator and an organic solvent, and then the bifunctional (meth)acrylate compound contained in an amount of 5% to 50% by mass and the polyfunctional thiol compound is contained in an amount of 0.1% to 10% by mass, relative to the content of the polymer.

Photosensitive resin composition and adhesives composition

There is provided a novel polymer, a composition containing the polymer, and a novel adhesive composition containing the polymer from which a cured film having desired properties is obtained. A polymer comprising a structural unit of Formula (1): wherein Q is a bivalent group, Ris a Calkylene group, a Calkenylene group or Calkynylene group, a Carylene group, a Ccyclic alkylene group, etc., or a polymer comprising a structural unit of Formula (6): wherein Qis an allyl group, a vinyl group, an epoxy group, or a glycidyl group, and Ris a bivalent organic group having a main chain containing only carbon atom or at least one of oxygen atom, nitrogen atom and sulfur atom in addition to carbon atom, a composition comprising the polymer, and an adhesive composition comprising the polymer and a solvent.

Polymer and composition including same, and adhesive composition

There is provided a composition for forming a passivation film that satisfies electric insulation, heat-tolerance, solvent-tolerance, and a dry etch back property at the same time. A composition for forming a passivation film, including: a polymer containing a unit structure of Formula (i):T-O&#x2003;&#x2003;Formula (i)(where Tis a sulfonyl group, a fluoroalkylene group, a cycloalkylene group, or an arylene group having a substituent, or is a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cycloalkylene group), wherein the polymer has at least one of a group having a structure of Formula (2-A), a group having a structure of Formula (2-B), or a group having both of the structures, at an end, in a side chain, or in a main chain of the polymer:  The polymer may contain a unit structure of Formula (1):L-O-T-O&#x2003;&#x2003;Formula (1)

Composition for forming passivation film, including resin having carbon-carbon multiple bond

A resin composition for forming an insulating film including a polymer having a structural unit of the following formula (1a) and a structural unit of the following formula (1b); and an organic solvent; wherein Tis a divalent organic group containing at least one arylene group in which at least one hydrogen atom is substituted with an amino group; and Tis a divalent organic group containing at least one arylene group having at least one substituent, wherein the substituent is a substituent of the following formula (2); and wherein Z is a divalent, aliphatic, aromatic, or alicyclic group optionally having a substituent. 

Resin composition, method for forming pattern using the same, and method for synthesizing polymer

Novel thermosetting resin composition is provided. A thermosetting resin composition containing a polymer having a repeating structural unit of the following Formula (1-a): (wherein each of Rand Ris independently a hydrogen atom, a Calkyl group, phenyl group, or a Ccyclic alkyl group, X is a single bond or a divalent organic group, and Y is a divalent organic group), and a terminal structure of the following Formula (1-b): (wherein Q is a Calkylene group, phenylene group in which at least one hydrogen atom may be substituted by a halogen atom, or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and Ris a hydrogen atom or methyl group).

Thermosetting resin composition containing polymer having specific terminal structure

There is provided a resist underlayer film forming composition that is used in a lithography process for the production of semiconductor devices and that can be developed with an alkaline developer for photoresists, and a method of forming a photoresist pattern by using the resist underlayer film forming composition. The resist underlayer film forming composition used in a lithography process for a production of a semiconductor device comprising: an alkali-soluble resin (a); a polynuclear phenol (b); a compound (c) having at least two vinylether groups; and a photoacid generator (d). The alkali-soluble resin (a) may be a polymer containing a unit structure having a carboxyl group, and the polynuclear phenol (b) may be a compound having 2 to 30 phenolic hydroxyl groups in the molecule.

Resist underlayer film forming composition containing low molecular weight dissolution accelerator

There is provided novel thermosetting resin composition. A thermosetting resin composition comprising a polymer having at least one structural unit of the following Formula (1): {wherein each of Rand Ris independently a hydrogen atom or a Calkyl group, X is a single bond or a divalent organic group, and Y is an arylene group of the following Formula (2): (wherein Zis a carbonyl group or a &#x2014;CONH&#x2014; group, Zis a Calkylene group or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and Zis a 5- or 6-membered aromatic heterocyclic group containing two nitrogen atoms in which at least one of hydrogen atoms may be substituted by a Calkyl group)}.

Thermosetting resin composition

An adhesive composition has a polymer that contains a unit structure of Formula (1):L-O-T-O&#x2003;&#x2003;Formula (1)where Lis an arylene group or a combination of an arylene group and a sulfonyl group or a carbonyl group, and Tis a fluoroalkylene group, a cyclic alkylene group, an arylene group having a substituent, or a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cyclic alkylene group and contains, at a terminal or in a side chain or the main chain, at least one group containing a structure of Formula (2-A), a structure of Formula (2-B), or both structures: 

Adhesive composition containing resin having carbon-carbon multiple bond

There is provided a resist underlayer film forming composition for lithography, which in order to prevent a resist pattern from collapsing after development in accordance with the miniaturization of the resist pattern, is applied to multilayer film process by a thin film resist, has a lower dry etching rate than resists and semiconductor substrates, and has a satisfactory etching resistance relative to a substrate to be processed in the processing of the substrate. A resist underlayer film forming composition used in lithography process by a multiplayer film, comprises a polymer containing a unit structure having an aromatic fused ring, a unit structure having a protected carboxyl group or a unit structure having an oxy ring. A method of forming a pattern by use of the resist underlayer film forming composition. A method of manufacturing a semiconductor device by utilizing the method of forming a pattern.

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Toyama, Japan

Tomoyuki Enomoto