Fujitsu Corporation

Fujitsu Interconnect Technologies Limited

Tomoyuki Akahoshi

Daisuke Mizutani

Manabu Watanabe

Akio Sugama

Shigenori Aoki

Masateru Koide

Masayuki Sasaki

Seigo Yamawaki

Kei Fukui

Masaharu Furuyama

Masayuki Kato

Hiromitsu Soneda

Yasuo Yamagishi

Tsuyoshi Aoki

Shuji Koike

Akira Iwaishi

Takumi Kawamura

Nawalage Florence Cooray

Masahiro Ono

Mamoru Kurashina

Kouichi Sanpei

Akihiko Miyaki

Mutsuo Watanabe

Hidehiko Fujisaki

Hiromitsu Kobayashi

Youichi Hoshikawa

A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a recess part at a position corresponding to the opening part; and a conductor via provided in the insulating layer, penetrating the dielectric layer, the opening part and the recess part, being in contact with the recess part, and being smaller than the opening part in plan view.

Circuit board, method of manufacturing circuit board, and electronic device

A circuit board includes an insulating layer; a capacitor which is provided in the insulating layer and includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including a first opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a second opening part at a position corresponding to the first opening part; a first conductor via provided in the insulating layer, penetrating the dielectric layer, the first opening part and the second opening part, and being smaller than the first opening part and the second opening part in plan view; a second conductor via provided in the insulating layer and making contact with the second conductor layer; and a third conductor layer provided on the insulating layer and electrically coupled to the first and the second conductor vias.

Circuit board, method for manufacturing circuit board, and electronic device

A substrate includes: a signal line via, a ground line via, and a power supply line via; a first group of first conductor layers formed at a first wiring layer level and coupled to the signal line via, the ground line via, and the power supply line via; a second conductor layer formed at a second wiring layer level and coupled to the power supply line via; a second group of third conductor layers formed at a third wiring layer level and coupled to the signal line via, the ground line via, and the power supply line via; a first insulating layer; and a second insulating layer, wherein the second insulating layer has an opening with a third insulating layer, a relative dielectric constant of the second insulating layer is higher than the first insulating layer and the third insulating layer, and the opening reaches a conductor pattern.

Capacitor built-in multilayer wiring substrate and manufacturing method thereof

A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.

Method of manufacturing board

A wiring board includes a first insulating layer; a first wire that is provided at a first surface of the first insulating layer and transmits a first signal; and a second wire that is provided at a second surface of the first insulating layer that is opposite to the first surface, includes a first portion that is parallel to at least a portion of the first wire, and transmits a first component of the first signal that is transmitted through the first wire.

Wiring board and electronic apparatus

A wiring board includes a first wiring line and a second wiring line formed on a substrate, a first land and a second land respectively formed at a connection portion of the first wiring line and the second wiring line. A second wiring line has a longer wiring length than the first wiring line. The land is structured with a wiring pattern of a single wiring line. The wiring board also includes a first pad electrode and a second pad electrode respectively formed on the first land and a second land through an insulating film, a first interlayer connection via and a interlayer connection via embedded in the insulating film and electrically connecting the land to the pad electrode. And a wiring length of the wiring pattern of the first land is longer than the wiring length of the wiring pattern of the second land.

Wiring board and design method for wiring board

An optical module with a first optical waveguide substrate having end faces; a second optical waveguide substrate which includes a first optical waveguide, a second optical waveguide, and end faces, the second optical waveguide substrate having an opening between the first optical waveguide and the second optical waveguide; and a first deflection device which is mounted in the opening, wherein one of the end faces of the first optical waveguide substrate and one of the end faces of the second optical waveguide substrate are coupled to each other.

Optical module method of manufacturing the same

An optical module with a plurality of optical waveguide substrates having element mounting openings and end surfaces which are adhered to each other with an optical adhesive; and a plurality of light deflecting element arrays mounted to the respective element mounting openings of the plurality of optical waveguide substrates, the plurality of light deflecting element arrays including a plurality of light deflecting elements.

Optical module and method of manufacturing the same

An optoelectronic component is mounted at a precise position on a waveguide substrate so as to reduce loss in propagating light, and electrically connect electrodes on the waveguide substrate and the optoelectronic component. The waveguide substrate has an optical waveguide and a recessed portion for mounting the optoelectronic component, and electrodes are arranged on the recessed portion. A great number of globular elastic conductive particles are distributed on the bottom surface of the recessed portion. Thereafter, the optoelectronic component is placed in the recessed portion so as to press the globular elastic conductive particles, and alignment between the optical waveguide in the waveguide substrate and an optical waveguide in the optoelectronic component is adjusted. Then, the optoelectronic component is fixed to the waveguide substrate with an optical adhesive while the alignment is precisely adjusted.

Method for production of optical module and optical module

The instant invention has an exemplified object to provide an inkjet head and recording device having such an inkjet head with a simpler structure as achieves higher quality of printing inexpensively than the conventional. The pressure-chamber plate of this invention is slit or divided into a plurality of elements.

Inkjet head formed of divided pressure-chamber plate, method for manufacturing the same, and recording device having the inkjet head

A water-repellent coating having a higher wiping resistance against a wiper and capable of being formed by a more simplified process than was previously possible. The method of forming the water-repellent coating comprises a flat hard body and a plating-processed fluoric polymer which are formed on a nozzle plate having a nozzle as a substrate around the nozzle.

Growing community of inventors

Atsugi, Japan

Tomoyuki Akahoshi