Panasonic Intellectual Property Management Co., Ltd.

Tomoyuki Abe

Tatsuya Arisawa

Hirohisa Goto

Hiroaki Fujiwara

Yoshihiko Nakamura

Kiyotaka Komori

Yuki Inoue

Mitsuyoshi Nishino

Shunji Araki

Masaaki Matsumoto

Syouji Hasimoto

Tomoaki Iwami

Tatsuo Yonemoto

A metal-clad laminated board includes an insulating layer and a metal layer, in which the insulating layer includes a cured product of a resin composition containing a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated double bond; and a crosslinkable curing agent having an unsaturated double bond in the molecule, and containing 40 to 250 parts by mass of silica particles with respect to 100 parts by mass in total of the modified polyphenylene ether compound and the crosslinkable curing agent, the resin composition contains 0.2 to 5 parts by mass of a first silane coupling agent having an unsaturated double bond in the molecule with respect to 100 parts by mass of the silica particles, and a contact surface of the metal layer in contact with the insulating layer is surface-treated with a second silane coupling agent having an amino group in the molecule.

Metal-clad laminated board, metal member provided with resin, and wiring board

A metal-clad laminated board includes an insulating layer and a metal layer in contact with at least one surface of the insulating layer. The insulating layer includes a cured product of a thermosetting resin composition containing a reaction product of a polyphenylene ether and an epoxy compound. The polyphenylene ether has 1.5 to 2 hydroxyl groups on average in one molecule, and the epoxy compound has 2 to 2.3 epoxy groups on average in one molecule. In the metal-clad laminated board, the reaction product has a terminal hydroxyl group concentration of 700 &#x3bc;mol/g or less. The metal layer includes a metal substrate and a barrier layer containing cobalt. The barrier layer is provided on the metal substrate at a side close to a contact surface of the metal layer with the insulating layer. The contact surface has surface roughness of 2 &#x3bc;m or less in ten-point average roughness Rz.

Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board

One aspect of the present invention is a resin composition containing a thermosetting resin, a curing agent that reacts with the thermosetting resin, and a flame retardant, in which the flame retardant contains a compatible phosphorus compound that is compatible with a mixture of the thermosetting resin and the curing agent, and a non-compatible phosphorus compound that is not compatible with the mixture, a content of the compatible phosphorus compound is 1 to 3.5 parts by mass per 100 parts by mass of a total of the thermosetting resin and the curing agent, and a content of the non-compatible phosphorus compound is 14 to 30 parts by mass per 100 parts by mass of the total of the thermosetting resin and the curing agent.

Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m/g to 15 m/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.

Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board

The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

Growing community of inventors

Fukushima, Japan

Tomoyuki Abe