Ngk Insulators, Inc.

Ngk Ceramic Device Co., Ltd.

Tomoyoshi Tai

Yuji Hori

Yudai Uno

Masashi Goto

Ryosuke Hattori

Jungo Kondo

Keiichiro Asai

Masahiko Namerikawa

Takahiro Yamadera

Takashi Yoshino

Kengo Suzuki

Yasunori Iwasaki

Akiyoshi Ide

Sugio Miyazawa

Kenji Suzuki

Shoichiro Yamaguchi

Yukihisa Osugi

Masahiro Sakai

Akira Hamajima

Mai Minoura

Mitsuo Ikejiri

Yoshimasa Kobayashi

Hiroharu Kobayashi

Tatsuro Takagaki

Tatsuya Hishiki

Kentaro Tani

Toshinao Nakahara

Yukihisa Ohsugi

Shinya Kaneko

Masato Niwa

Hiroyoshi Ina

Takeshi Yamamoto

Provided is an optical scanning element, which has a large scan angle, is quickly responsive, and can be downsized. The optical scanning element includes: a photonic crystal layer having holes periodically formed in an electro-optical crystal substrate; a line-defect optical waveguide formed in the photonic crystal layer; a diffraction grating arranged in at least one portion selected from an upper portion, a left side surface portion, and a right side surface portion of the optical waveguide; and electrodes arranged on a left side and a right side of the optical waveguide. The optical scanning element is configured so that an emission angle of light emitted from an upper surface of the optical waveguide is changed.

Optical scanning element

There is provided a composite substrate in which peeling is significantly suppressed, light propagation loss is small when used as an electro-optical element, and high-speed and low-voltage drive is possible, and which can achieve an extremely thin electro-optical element capable of maintaining excellent reliability even under a severe high-temperature environment. A composite substrate for an electro-optical element according to an embodiment of the present invention includes: an electro-optical crystal substrate having an electro-optical effect; a first high dielectric layer; a second high dielectric layer; and a support substrate in the stated order. The first high dielectric layer and the second high dielectric layer are directly joined to each other, and an amorphous layer is formed at a joining interface between the first high dielectric layer and the second high dielectric layer.

Composite substrate for electro-optical element

A composite substrate includes: a piezoelectric layer; and a reflective layer arranged on a rear surface side of the piezoelectric layer, wherein the reflective layer includes a high-impedance layer and a low-impedance layer containing silicon oxide, and wherein a ratio of a region of first structures in the high-impedance layer is more than 70%.

Composite substrate and surface acoustic wave element

A bonded body includes a supporting substrate, piezoelectric material substrate and a multilayer film between the supporting substrate and piezoelectric material substrate. The multilayer film includes a lamination structure having a first layer, second layer, third layer and fourth layer in that order. The first layer and third layer are composed of silicon oxides, and the second layer and fourth layer are composed of metal oxides. The refractive index of the second layer is higher than the refractive index of the first layer and refractive index of the third layer. The refractive index of the second layer is different from the refractive index of the fourth layer.

Bonded body and acoustic wave element

A composite substrate for an electro-optic element is disclosed. The composite substrate includes: an electro-optic crystal substrate having an electro-optic effect; a low-refractive-index layer being in contact with the electro-optic crystal substrate and having a lower refractive index than the electro-optical crystal substrate; and a support substrate bonded to the low-refractive-index layer at least via a bonding layer. A plurality of interfaces located between the low-refractive-index layer and the support substrate includes at least one rough interface having a roughness that is larger than a roughness of an interface between the electro-optic crystal substrate and the low-refractive-index layer.

Composite substrate for electro-optic element and method for manufacturing the same

A bonded body includes a supporting substrate composed of a metal oxide, a piezoelectric material substrate, a bonding layer provided between the supporting substrate and piezoelectric material substrate and having a composition of SiO(0.008≤x≤0.408), and an amorphous layer provided between the bonding layer and supporting substrate. The oxygen ratio of the amorphous layer is higher than the oxygen ratio of the supporting substrate.

A bonded body includes a supporting substrate; a piezoelectric material substrate; a first bonding layer provided on the supporting substrate and having a composition of SiO(0.008≤x≤0.408); a second bonding layer provided on the piezoelectric material substrate and having a composition of SiO(0.008≤y≤0.408); and an amorphous layer provided between the first bonding layer and second bonding layer. The oxygen ratio of the amorphous layer is higher than the oxygen ratio of the first bonding layer and oxygen ratio of the second bonding layer.

A composite substrate for an electro-optic element includes: an electro-optic crystal substrate having an electro-optic effect; a support substrate bonded to the electro-optic crystal substrate at least via an amorphous layer; and a low-refractive-index layer located between the electro-optic crystal substrate and the amorphous layer and having a lower refractive index than the electro-optical crystal substrate. The amorphous layer is constituted of one or more elements that constitute a layer or a substrate contacting the amorphous layer from one side and one or more elements that constitute a layer or a substrate contacting the amorphous layer from another side.

A bonded body having a supporting substrate and piezoelectric material layer is provided. The supporting substrate is composed of mullite, and the material of the piezoelectric material layer is LiAOwhere A represents one or more element selected from the group consisting of niobium and tantalum. An interface layer is present along an interface between the supporting body and piezoelectric material layer, and a supporting substrate-side intermediate layer is present between the interface layer and supporting substrate. Each of the interface layer and supporting substrate-side intermediate layer contains oxygen, aluminum, silicon and one or more element selected from the group consisting of niobium and tantalum as main components.

Joined body and elastic wave element

An acoustic wave device includes a piezoelectric material substrate, an intermediate layer on the piezoelectric material substrate and composed of one or more materials selected from the group consisting of silicon oxide, aluminum nitride and sialon. A bonding layer is on the intermediate layer and is composed of one or more materials selected from the group consisting of tantalum pentoxide, niobium pentoxide, titanium oxide, mullite, alumina, and a high resistance silicon and hafnium oxide. A supporting body is composed of a polycrystalline ceramic and is bonded to the bonding layer by direct bonding, and an electrode is on the piezoelectric material substrate.

Acoustic wave devices and a method of producing the same

A vibrating plate-bonded body includes a supporting substrate composed of silicon, a vibrating plate composed of a highly rigid ceramics and having a thickness of 100 &#x3bc;m or smaller, and a bonding layer between the supporting substrate and vibrating plate, contacting a bonding surface of the vibrating plate and composed of &#x3b1;-Si. The arithmetic average roughness Ra of the bonding surface of the vibrating plate is 0.01 nm or more and 10.0 nm or less, and the pit density of the bonding surface of the vibrating plate is 10 counts or more per 100 &#x3bc;m.

Vibrating plate-bonded-body

A piezoelectric monocrystalline substrate is composed of a material represented by LiAO(A represents at least one element selected from the group consisting of niobium and tantalum), a bonding layer is compose of a material of an oxide of at least one element selected from the group consisting of niobium and tantalum, and an interface layer is provided along an interface between the piezoelectric monocrystalline substrate 6 and bonding layer, and the interface layer has a composition of EO(E represents at least one element selected from the group consisting of niobium and tantalum and 0.29&#x2264;x&#x2264;0.89).

Bonded body with piezoelectric monocrystalline substrate and supporting substrate

A bonded body for an optical modulator includes a supporting substrate, an optical waveguide material provided on the supporting substrate and composed of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate, and an optical waveguide in the optical waveguide material. The supporting substrate is composed of a material selected from the group consisting of magnesium oxide and a magnesium-silicon composite oxide.

Bonded bodies for optical modulators, optical modulators and a method of producing bonded bodies for optical modulators

A bonded body includes a supporting substrate composed of a polycrystalline ceramic material or monocrystalline material, a piezoelectric single crystal substrate and a bonding layer provided between the supporting substrate and piezoelectric single crystal substrate. The bonding layer has a composition of SiO(x represents an oxygen ratio). The oxygen ratio is increased or decreased from an end part of the bonding layer on the side of the piezoelectric single crystal substrate to an end part of the bonding layer on the side of the supporting substrate. The maximum value of the oxygen ratio x in the bonding layer is 0.013 or higher and 0.666 or lower, and the minimum value of the oxygen ratio is 0.001 or higher and 0.408 or lower.

Growing community of inventors

Inazawa, Japan

Tomoyoshi Tai