Shin-etsu Chemical Co., Ltd.

Nichia Corporation

Tomoyoshi Tada

Kazutoshi Tomiyoshi

Yusuke Taguchi

Masaki Hayashi

Hisashi Shimizu

Shoichi Osada

Miyuki Wakao

Tadaharu Ikeda

Kenichi Totsuka

A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by:R&#x2014;COO&#x2014;R&#x2003;&#x2003;(1)wherein Rand Rare CHand n is 1 to 30 and a compound represented by: wherein R, R, and Rare selected from H, &#x2014;OH, &#x2014;OR, and &#x2014;OCOCHwith the proviso that at least one includes &#x2014;OCOCH; R is CH(wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.

Thermosetting epoxy resin composition and semiconductor device

A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130&#xb0; C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.

White heat-curable silicone resin composition, optoelectronic part case, and molding method

A semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) carbon black is prepared by mixing a carbon black feedstock and the curing agent with an organic solvent, filtering off coarse particles of carbon black which remain over a mesh sheet with an opening of 20 &#x3bc;m, removing the solvent from the filtrate to yield a premix of curing agent and carbon black, and kneading the premix with the remaining components.

Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device

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Annaka, Japan

Tomoyoshi Tada