Seiko Epson Corporation

Tomoyoshi Saito

Masashi Yoshiike

Shuichi Tanaka

Yoshihide Matsuo

Haruo Yamaguchi

Toshinari Nanba

A manufacturing method of an electronic device includes a first stacking process of forming a first photosensitive adhesive on a surface on a second substrate side in a first substrate; and a second stacking process of forming a second photosensitive adhesive, which overlaps the first photosensitive adhesive, having a lower degree of cure than that of the first photosensitive adhesive; and a bonding process of bonding together the first substrate and the second substrate by curing the second photosensitive adhesive by heating, in a state in which the first photosensitive adhesive and the second photosensitive adhesive are interposed between the first substrate and the second substrate.

Electronic device and manufacturing method of electronic device

An electronic device includes a first substrate including a structure body protruded from one surface; and a second substrate stacked and disposed facing the one surface through a spacer, in which the first substrate and the spacer are bonded to each other by an adhesive, and in which the adhesive is extended up to the structure body along the one surface.

Electronic device, liquid ejecting head, and manufacturing method of electronic device

An electronic device includes a first substrate that has a drive region in a first surface, and a second substrate that has a second surface that is joined to the first surface by a joining resin portion composed of a photosensitive resin. In the electronic device, a space that houses the drive region is defined between the first surface and the second surface by the joining resin portion, and a joining surface of the joining resin portion joined to the first surface is smaller than a joining surface of the joining resin portion joined to the second surface.

Growing community of inventors

Chino, Japan

Tomoyoshi Saito