Omron Automotive Electronics Co., Ltd.

Omron Corporation

Aikokiki Manufacturing Co., Ltd.

Tomoyoshi Kobayashi

Koji Hachiya

Masato Kasashima

Satoru Sasaki

Koichi Nakabayashi

Koichi Suzuki

Takashi Yamaguchi

Yoshihiro Ikushima

Ryo Kobayashi

Akihiro Kojima

Eiji Shimoyama

An electronic device includes: an electronic component; and a mounting member on which the electronic component is mounted. A center of gravity of the electronic component is at a position separated from the mounting member. The electronic device further includes: a rigid member having a frame shape, which is fixed to the mounting member and surrounds the electronic component in a direction perpendicular to a direction from the center of gravity of the electronic component to the mounting member; and a connecting member which connects the electronic component to the rigid member on a side opposite to the mounting member with respect to the electronic component.

Electronic device

A cooler includes: a narrow flow path that has a narrow cross-sectional area; a wide flow path that is connected to a downstream side of the narrow flow path, is in thermal contact with a heating body, and has a wide cross-sectional area; and at least one rectifying piece that is provided in an upstream portion of the wide flow path that is an upstream side from a position being in thermal contact with the heating body. A fluid refrigerant flows through the narrow flow path and the wide flow path, and heat generated by the heating body is radiated. The rectifying piece includes: a single first angle portion that protrudes toward the upstream side; and a first surface and a second surface that join at an acute angle to form the first angle portion.

Cooler and flow path unit

A circuit board module includes: a first electronic component of a surface mounting type; a second electronic component of an insertion mounting type including a lead terminal; a circuit board; and a heat transfer body provided in the circuit board. The first electronic component is mounted on a front surface of the circuit board so as to overlap the heat transfer body in a board thickness direction. The heat transfer body is provided so as to transfer heat generated in the first electronic component to a back surface side of the circuit board. The second electronic component is mounted on a back surface of the circuit board. The second electronic component and the heat transfer body are thermally connected to a heat radiation body provided on the back surface side of the circuit board.

Circuit board module and electronic device

A printed circuit board with integrated coil includes: a plurality of layers; and coil patterns which are formed of a conductor and which are provided in at least one outer surface layer and another layer of the plurality of layers. A heat-dissipation pattern formed of a conductor is provided on at least the one outer surface layer so as to correspond to the coil pattern provided in the another layer. The coil pattern provided in the one outer surface layer and the heat-dissipation pattern provided in the one outer surface layer are separated from each other. A thermal inter-layer connector formed of a conductor is provided to connect the coil pattern provided in the another layer and the heat-dissipation pattern provided in the one outer surface layer which correspond to each other.

Printed circuit board with integrated coil, and magnetic device

A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower surface of the first insulating layer, in such a way as to vertically overlap with the mounting regions, and a second insulating layer provided on the lower surface of the first insulating layer, around the metal core. The lower surface of the metal core is exposed from the second insulating layer, the thermal conductivities of the first insulating layer and the metal core are higher than the thermal conductivity of the second insulating layer, and the hardness of the first insulating layer is higher than the hardness of the second insulating layer. Through holes that penetrate the insulating layers and that connect wiring patterns of the insulating layers are provided.

Circuit board

A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

Printed board and electronic apparatus

A printed circuit board includes a first insulating layer having mounting regions for electronic components and wiring patterns provided on an upper surface, a second insulating layer provided so as to be in contact with a lower surface of the first insulating layer, and a metal core embedded in the second insulating layer so as to vertically overlap the mounting regions. The metal core is formed into a predetermined shape by stamping out a metal plate. One outer surface orthogonal to the thickness direction of the metal core is a protruding surface having a curved portion formed at its edge, and is in contact with the lower surface of the first insulating layer. The other outer surface orthogonal to the thickness direction of the metal core is a recessed surface having a protruding portion formed at its edge, and is exposed from a lower surface of the second insulating layer.

Printed circuit board and electronic device

Coil patterns are provided in first and second outer surface layers and an inner layer of the board. First and second heat-dissipation patterns are provided in the second outer surface layer. A first thermal inter-layer connection member connects the coil pattern of the first outer surface layer and the first heat-dissipation pattern. A second thermal inter-layer connection member connects the coil pattern of the inner layer and the second heat-dissipation pattern. The coil pattern provided in the second outer surface layer and the first and second heat-dissipation patterns are separated from each other. An area of the second heat-dissipation pattern is larger than an area of the first heat-dissipation pattern.

Magnetic device

A coil-integrated printed circuit board includes: a first outer layer which includes a first outer thick electric conductor made of a thick metallic foil and a first outer thin electric conductor made of a thin metallic foil having a thickness smaller than that of the first outer thick electric conductor, and which is exposed to an outside; and a first inner layer which includes an inner thick electric conductor made of a thick metallic foil, and which is not exposed to the outside. Coil patterns are respectively formed by the first outer thick electric conductor and the inner thick electric conductor. A first electronic component is surface-mounted on the first outer thin electric conductor provided on the outer layer.

Growing community of inventors

Aichi, Japan

Tomoyoshi Kobayashi