Namics Corporation

Tomoya Yamazawa

Kazuyuki Kohara

Nobuyuki Abe

Kodai Okoshi

Haruyuki Yoshii

Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. The resin composition according to the present invention comprises (A) a liquid epoxy resin, (B) a hardener, and (C) an alumina filler having a surface treated with the silane coupling agent of the following formula (1).

Liquid sealing material for copper bump, and resin composition for use as same

An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 &#x3bc;m or more and 2 &#x3bc;m or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.

Epoxy resin composition, semiconductor sealing agent, and semiconductor device

An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 &#x3bc;m or more and 5 &#x3bc;m or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.

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Niigata, Japan

Tomoya Yamazawa